公开(公告)号：US20040233505A1

公开(公告)日：2004-11-25

申请号：US10346506

申请日：2003-01-15

Applicant: REFLECTIVITY, INC., a California corporation

Inventor： Andrew G. Huibers ,  Satyadev R. Patel

IPC: G02B026/00

CPC classification number: G02B26/0841

Abstract: A MEMS device is disclosed comprising: a substrate; a movable micromechanical element movable relative to the substrate; a connector and a hinge for allowing movement of the micromechanical element, wherein the connector is made of a material different than the hinge. In another embodiment of the invention, the connector has a conductivity greater than the hinge. In a further embodiment of the invention, the hinge provides at least 90% of the restoring force to the MEMS device, and the connector provides 10% or less of the restoring force. In a further embodiment of the invention, the connector and the hinge have different spring constants. In a still further embodiment of the invention, the connector experiences a lower strain at maximum deflection of the micromechanical element than the hinge.

Abstract translation: 公开了一种MEMS器件，包括：衬底; 可移动微机械元件，其相对于所述基板移动; 用于允许微机械元件移动的连接器和铰链，其中连接器由不同于铰链的材料制成。 在本发明的另一个实施例中，连接器的导电率大于铰链。 在本发明的另一实施例中，铰链提供至少90％的恢复力到MEMS装置，并且连接器提供10％或更小的恢复力。 在本发明的另一实施例中，连接器和铰链具有不同的弹簧常数。 在本发明的另一个实施例中，连接器在微机械元件的最大偏转处经受比铰链更低的应变。

公开(公告)号：US20040100594A1

公开(公告)日：2004-05-27

申请号：US10305507

申请日：2002-11-26

Applicant: REFLECTIVITY, INC., a California corporation

Inventor： Andrew G. Huibers ,  Peter W. Richards

IPC: G02F001/135

CPC classification number: B82Y30/00 ,  G02B26/0841 ,  H04N5/7458

Abstract: A projection system, a spatial light modulator, and a method for forming micromirrors are disclosed. A substrate comprises circuitry and electrodes for electrostatically deflecting micromirror elements that are disposed within an array of such elements forming the spatial light modulator. In one embodiment, the substrate is a silicon substrate having circuitry and electrodes thereon for electrostatically actuating adjacent micromirror elements, and the substrate is fully or selectively covered with a light absorbing material.

Abstract translation: 公开了投影系统，空间光调制器和用于形成微镜的方法。 衬底包括用于静电偏转微镜元件的电路和电极，微镜元件设置在形成空间光调制器的这种元件的阵列内。 在一个实施例中，衬底是具有电路和电极的硅衬底，用于静电地驱动相邻的微镜元件，并且衬底被完全或选择性地覆盖有光吸收材料。

公开(公告)号：US20020196524A1

公开(公告)日：2002-12-26

申请号：US10155744

申请日：2002-05-24

Applicant: REFLECTIVITY, INC.

Inventor： Andrew G. Huibers ,  Peter J. Heureux ,  Satyadev R. Patel

IPC: G02B026/00

CPC classification number: G02B26/0841

Abstract: A spatial light modulator having a micromirror and one or more deflection limiting mechanisms, and a process for fabrication therefor. In one embodiment, the mirror support structure has a deflection stopping mechanism that limits the tilt angle of the reflective plate. Alternatively, a deflection stopping mechanism can be provided separate from the mirror support structure. The deflection stopping mechanism can be used in conjunction with one or more additional stopping mechanisms such as the abutment of a portion of the reflective plate against the substrate upon which it was constructed and/or abutment of the micromirror on a surface or structure of the circuit substrate.

Abstract translation: 具有微反射镜和一个或多个偏转限制机构的空间光调制器及其制造方法。 在一个实施例中，反射镜支撑结构具有限制反射板的倾斜角度的偏转停止机构。 或者，偏转止动机构可以与镜支撑结构分开设置。 偏转止动机构可以与一个或多个附加止动机构结合使用，例如反射板的一部分抵靠其上构造的基板和/或微镜在电路的表面或结构上的邻接 基质。

公开(公告)号：US20020195423A1

公开(公告)日：2002-12-26

申请号：US10104109

申请日：2002-03-22

Applicant: REFLECTIVITY, INC.

Inventor： Satyadev R. Patel ,  Gregory P. Schaadt ,  Douglas B. MacDonald ,  Hongqin Shi ,  Andrew G. Huibers ,  Peter Heureux

IPC: C23F001/00 ,  B44C001/22 ,  C03C015/00 ,  C03C025/68

CPC classification number: B81C1/00 ,  B81B2201/045 ,  B81C1/00476 ,  B81C1/00531 ,  B81C1/00595 ,  B81C99/0025 ,  B81C2201/0138 ,  B82Y30/00 ,  H01L21/3065 ,  H01L21/3081 ,  H01L21/32135

Abstract: The etching of a material in a vapor phase etchant is disclosed where a vapor phase etchant is provided to an etching chamber at a total gas pressure of 10 Torr or more, preferably 20 Torr or even 200 Torr or more. The vapor phase etchant can be gaseous acid etchant, a noble gas halide or an interhalogen. The sample/workpiece that is etched can be, for example, a semiconductor device or MEMS device, etc. The material that is etched/removed by the vapor phase etchant is preferably silicon and the vapor phase etchant is preferably provided along with one or more diluents. Another feature of the etching system includes the ability to accurately determine the end point of the etch step, such as by creating an impedance at the exit of the etching chamber (or downstream thereof) so that when the vapor phase etchant passes from the etching chamber, a gaseous product of the etching reaction is monitored, and the end point of the removal process can be determined. The vapor phase etching process can be flow through, a combination of flow through and pulse, or recirculated back to the etching chamber. A first plasma or wet chemical etch (or both) can be performed prior to the vapor phase etch.

Abstract translation: 公开了在气相蚀刻剂中的材料的蚀刻，其中气蚀刻蚀刻剂以10托或更大，优选20托或甚至200托或更大的总气体压力提供给蚀刻室。 气相蚀刻剂可以是气态酸蚀刻剂，惰性气体卤化物或中间卤素。 被蚀刻的样品/工件可以是例如半导体器件或MEMS器件等。通过气相蚀刻剂蚀刻/去除的材料优选为硅，并且气相蚀刻剂优选与一个或多个 稀释剂。 蚀刻系统的另一特征包括能够精确地确定蚀刻步骤的终点，例如通过在蚀刻室的出口处（或其下游）处产生阻抗，使得当气相蚀刻剂从蚀刻室 ，监测蚀刻反应的气体产物，并且可以确定除去过程的终点。 气相蚀刻工艺可以流过，流过和脉冲的组合，或再循环回蚀刻室。 可以在气相蚀刻之前执行第一等离子体或湿化学蚀刻（或两者）。

公开(公告)号：US20020132389A1

公开(公告)日：2002-09-19

申请号：US10099314

申请日：2002-03-15

Applicant: REFLECTIVITY, INC., a Delaware corporation

Inventor： Satyadev R. Patel ,  Andrew G. Huibers

IPC: H01L021/00 ,  H01L021/302 ,  H01L021/461 ,  H01L021/26

CPC classification number: B81C1/00214 ,  B81B7/0077 ,  B81B2201/042 ,  B81C1/00333 ,  B81C1/00896 ,  B81C1/00904 ,  B81C2203/0118 ,  B82Y30/00 ,  G02B26/0833 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01049 ,  H01L2924/01054 ,  H01L2924/01058 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/04953 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12036 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00

Abstract: A method is disclosed for forming a micromechanical device. The method includes fully or partially forming one or more micromechanical structures multiple times on a first substrate. A second substrate is bonded onto the first substrate so as to cover the multiple areas each having one or more micromechanical structures, so as to form a substrate assembly. The substrate assembly is then separated into individual dies, each die having the one or more micromechanical structures held on a portion of the first substrate, with a portion of the second substrate bonded to the first substrate portion. Finally, the second substrate portion is removed from each die to expose the one or more micromechanical structures on the first substrate portion. The invention is also directed to a method for forming a micromechanical device, including: forming one or more micromechanical structures in one or more areas on a first substrate; bonding caps onto the first substrate so as to cover the one or more areas each having one or more micromechanical structures, so as to form a substrate assembly; after a period of time, removing the caps to expose the one or more micromechanical structures. During the period of time between bonding the caps and later removing the caps, the substrate assembly can be singulated, inspected, irradiated, annealed, die attached, shipped and/or stored.

Abstract translation: 公开了一种用于形成微机械装置的方法。 该方法包括在第一衬底上多次完全或部分地形成一个或多个微机械结构。 将第二基板接合到第一基板上以覆盖各自具有一个或多个微机械结构的多个区域，以便形成基板组件。 然后将基板组件分离成单个管芯，每个管芯具有保持在第一衬底的一部分上的一个或多个微机械结构，其中第二衬底的一部分结合到第一衬底部分。 最后，从每个管芯移除第二衬底部分以露出第一衬底部分上的一个或多个微机械结构。 本发明还涉及一种用于形成微机械装置的方法，包括：在第一基板上的一个或多个区域中形成一个或多个微机械结构; 将盖接合到第一基板上以覆盖每个具有一个或多个微机械结构的一个或多个区域，以便形成基板组件; 在一段时间之后，移除盖以露出一个或多个微机械结构。 在接合盖子和稍后移除盖子之间的时间段期间，可以对基板组件进行单切割，检查，照射，退火，模具附接，运输和/或存储。