Abstract:
A method for forming a MEMS device is disclosed, where a final release step is performed just prior to a wafer bonding step to protect the MEMS device from contamination, physical contact, or other deleterious external events. Without additional changes to the MEMS structure between release and wafer bonding and singulation, except for an optional stiction treatment, the MEMS device is best protected and overall process flow is improved. The method is applicable to the production of any MEMS device and is particularly beneficial in the making of fragile micromirrors.
Abstract:
An etching method, such as for forming a micromechanical device, is disclosed. One embodiment of the method is for releasing a micromechanical structure, comprising, providing a substrate; providing a sacrificial layer directly or indirectly on the substrate; providing one or more micromechanical structural layers on the sacrificial layer; performing a first etch to remove a portion of the sacrificial layer, the first etch comprising providing an etchant gas and energizing the etchant gas so as to allow the etchant gas to physically, or chemically and physically, remove the portion of the sacrificial layer; performing a second etch to remove additional sacrificial material in the sacrificial layer, the second etch comprising providing a gas that chemically but not physically etches the additional sacrificial material. Another embodiment of the method is for etching a silicon material on or within a substrate, comprising: performing a first etch to remove a portion of the silicon, the first etch comprising providing an etchant gas and energizing the etchant gas so as to allow the etchant gas to physically, or chemically and physically, remove the portion of silicon; performing a second etch to remove additional silicon, the second etch comprising providing an etchant gas that chemically but not physically etches the additional silicon.
Abstract:
A projection system, a spatial light modulator, and a method for forming a MEMS device are disclosed. The spatial light modulator can have two substrates bonded together with one of the substrates comprising a micro-mirror array. The two substrates can be bonded at the wafer level after depositing a getter material and/or solid or liquid lubricant on one or both of the wafers if desired. In one embodiment of the invention, one of the substrates is a light transmissive substrate and a light blocking layer that is preferably a light absorbing layer is provided on the light transmissive substrate to selectively block light from passing through the substrate. The light blocking layer can be formed as a pattern, such as a grid or strips for blocking light from entering gaps between adjacent micro-mirrors.
Abstract:
A color wheel is disclosed that has at least one segment that occupies, for a given radius, a percentage of the circumference of the wheel at that radius, which percentage varies continuously or in multiple steps from a radially inward point to a radially outer point on the wheel. In one embodiment, the color wheel has a plurality of filter segments adjacent each other around the circumference of the wheel, wherein at least one of the transitions from one filter segment to the next is curved or stepped. A color wheel also is disclosed that has a plurality of filter segments adjacent each other around the circumference of the wheel, wherein at least one of the segments is a higher brightness segment than the others and has sides facing adjacent filter segments that do not lie on the radius of the wheel. A projection system is also disclosed that has a light source, a unique color wheel, a spatial light modulator, and projection optics.
Abstract:
A projection system, a spatial light modulator, and a method for forming micromirrors are disclosed. A substrate comprises circuitry and electrodes for electrostatically deflecting micromirror elements that are disposed within an array of such elements forming the spatial light modulator. In one embodiment, the substrate is a silicon substrate having circuitry and electrodes thereon for electrostatically actuating adjacent micromirror elements, and the substrate is fully or selectively covered with a light absorbing material.
Abstract:
A method for making a MEMS device comprises forming a plurality of micromechanical elements on a first substrate; forming circuitry and electrodes on a second substrate, the first and second substrates extending in a plane in X and Y directions; aligning the first and second substrates in the X and Y directions and moving the substrates toward each other in a Z direction and bonding the first and second substrates with a gap therebetween in the Z direction to form an assembly; singulating the assembly into assembly portions; and altering the gap for each assembly portion. Another embodiment involves aligning the first and second substrates in the X and Y directions and moving the substrates toward each other in a Z direction and bonding the first and second substrates with a gap therebetween in the Z direction to form an assembly; actuating and testing the micromechanical elements of the assembly; and altering the gap for each assembly. A further embodiment involves aligning the first and second substrates in the X and Y directions and moving the substrates toward each other in a Z direction and bonding the first and second substrates with a gap therebetween in the Z direction to form an assembly; wherein the micromechanical elements are actuated while bonding of the substrates.
Abstract:
A spatial light modulator includes an upper optically transmissive substrate held above a lower substrate containing addressing circuitry. One or more electrostatically deflectable elements are suspended by hinges from the upper substrate. In operation, individual mirrors are selectively deflected and serve to spatially modulate light that is incident to, and then reflected back through, the upper substrate. Motion stops may be attached to the reflective deflectable elements so that the mirror does not snap to the bottom substrate. Instead, the motion stop rests against the upper substrate thus limiting the deflection angle of the reflective deflectable elements.
Abstract:
A projection system is disclosed that has a light source of multiple wavelengths, a spatial light modulator and projection optics for projecting an image to be viewed by a viewer or to be displayed on a target. Also provided are one or more color sequencing devices which filter the light multiple times. Whether a single or plural color sequencing elements are provided, a single light beam passes at least twice through a sequence of light filters. In one embodiment, two color wheels provide the ability to filter the light multiple times. By changing the physical position or phase of one series of filters relative to another, the brightness and color saturation of the image projected through the projection optics can be changed. The changes in brightness and color saturation can be performed manually by mechanically changing the phase (or position) of the color sequencing device(s) relative to the light beam. Such changes can be performed step-wise of gradually through a continuum of brightness vs. color saturation points.
Abstract:
A projection system, a spatial light modulator, and a method for forming a micromirror array such as for a projection display are disclosed. The spatial light modulator can have two substrates bonded together with one of the substrates comprising a micro-mirror array. The two substrates can be bonded at the wafer level after depositing a getter material and/or solid or liquid lubricant on one or both of the wafers if desired. In one embodiment of the invention, one of the substrates is a light transmissive substrate and a light absorbing layer is provided on the light transmissive substrate to selectively block light from passing through the substrate. The light absorbing layer can form a pattern, such as a frame around an array of micro-mirrors.
Abstract:
Processes for the removal of a layer or region from a workpiece material by contact with a process gas in the manufacture of a microstructure are enhanced by the ability to accurately determine the endpoint of the removal step. A vapor phase etchant is used to remove a material that has been deposited on a substrate, with or without other deposited structure thereon. By creating an impedance at the exit of an etching chamber (or downstream thereof), as the vapor phase etchant passes from the etching chamber, a gaseous product of the etching reaction is monitored, and the endpoint of the removal process can be determined. The vapor phase etching process can be flow through, a combination of flow through and pulse, or recirculated back to the etching chamber