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公开(公告)号：US20230187360A1
公开(公告)日：2023-06-15
申请号：US17749623
申请日：2022-05-20
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Tae Hong Min
IPC: H01L23/538 , H01L25/065 , H01L25/18 , H01L21/48
CPC classification number: H01L23/5381 , H01L25/0655 , H01L25/18 , H01L23/5383 , H01L21/4857
Abstract: A substrate includes: a first printed circuit board layer including a first insulating layer and a first wiring layer, disposed on a lower surface of the first insulating layer; a second wiring layer, disposed on an upper surface of the first insulating layer; a bridge disposed above the first printed circuit board layer and including circuit wirings; a first bridge insulating layer and a second bridge insulating layer, disposed in the bridge and on which the circuit wirings are disposed, respectively; and a second printed circuit board layer including a second insulating layer surrounding side surfaces of the bridge and covering the first insulating layer and the second wiring layer. A first stacking direction in which the first insulating layer and the second insulating layer are stacked and a second stacking direction in which the first bridge insulating layer and the second bridge insulating layer are stacked are different.
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公开(公告)号：US20210305699A1
公开(公告)日：2021-09-30
申请号：US16925847
申请日：2020-07-10
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Tae Hong Min
IPC: H01Q9/04 , H01L25/18 , H01L23/498 , H01L23/66 , H01Q1/52
Abstract: An antenna module includes: a wiring structure including a plurality of insulating layers and a plurality of wiring layers; a metal structure disposed on one surface of the wiring structure, and having a through-portion; and an antenna disposed on the one surface of the wiring structure. At least a portion of the antenna is disposed in the through-portion.
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公开(公告)号：US20210014964A1
公开(公告)日：2021-01-14
申请号：US16679736
申请日：2019-11-11
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Tae Hong Min , Ju Ho Kim
Abstract: A printed circuit board is disclosed. The printed circuit board includes a first substrate portion, and a second substrate portion connected to the first substrate portion and having a flexible insulation layer which is bendable, and the second substrate portion includes a frame member inserted into the flexible insulation layer.
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公开(公告)号：US09899136B2
公开(公告)日：2018-02-20
申请号：US15395075
申请日：2016-12-30
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Sa Yong Lee , Myung Sam Kang , Tae Hong Min , Seon Ha Kang , Mi Sun Hwang , Il Jong Seo
CPC classification number: H01F27/255 , H01F5/00 , H01F17/0013 , H01F17/04 , H01F27/2804 , H01F27/29 , H01F27/292 , H01F41/046 , H01F41/10 , H01F41/122 , H01F2017/048 , H01F2027/2809
Abstract: A coil component includes a body portion, a coil portion, and an electrode portion. The body portion includes a magnetic material, the coil portion is disposed in the body portion, and the electrode portion is disposed on the body portion and electrically connected to the coil portion. The coil portion includes a first coil layer in which a plurality of conductors having a planar spiral shape are stacked, a second coil layer in which a plurality of conductors having a planar spiral shape are stacked, and a first bump disposed between the first and second coil layers to electrically connect the first and second coil layers to each other. The first coil layer and the second coil layer are electrically connected to each other through the first bump to form a single coil having coil turns adjacent to each other in horizontal and vertical directions.
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公开(公告)号：US20140151095A1
公开(公告)日：2014-06-05
申请号：US14097036
申请日：2013-12-04
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Suk Hyeon Cho , Tae Hong Min , Seung Yeop Kook , Jung Han Lee , Hye Jin Kim
CPC classification number: H05K1/0306 , H05K1/03 , H05K3/108 , H05K3/426 , H05K2201/0141 , H05K2201/0145 , H05K2201/0154 , H05K2201/0158 , H05K2201/0195 , H05K2201/0323 , H05K2201/09563 , Y10T29/49155 , Y10T29/49165
Abstract: Disclosed herein is a printed circuit board, including: a composite sheet including an insulating material and a glass plate bonded to the insulating material; and a circuit layer formed on the composite sheet.
Abstract translation: 这里公开了一种印刷电路板，包括：复合片，其包括绝缘材料和与绝缘材料接合的玻璃板; 以及形成在复合片上的电路层。
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Patent Agency Ranking
公开(公告)号：US20230262891A1
公开(公告)日：2023-08-17
申请号：US18138901
申请日：2023-04-25
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Tae Hong Min , Ho Hyung Ham , Yong Soon Jang , Ki Suk Kim , Hyung Ki Lee , Chi Won Hwang
IPC: H05K1/11
CPC classification number: H05K1/115 , H05K2201/041 , H05K2201/0338 , G06F1/189
Abstract: A connection structure embedded substrate includes: a printed circuit board including a plurality of first insulating layers and a plurality of first wiring layers, respectively disposed on or between the plurality of first insulating layers; and a connection structure disposed in the printed circuit board and including a plurality of internal insulating layers and a plurality of internal wiring layers, respectively disposed on or between the plurality of internal insulating layers. Among the plurality of internal wiring layers, an internal wiring layer disposed in one surface of the connection structure is in contact with one surface of a first insulating layer, among the plurality of first insulating layers.
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公开(公告)号：US20220322527A1
公开(公告)日：2022-10-06
申请号：US17371813
申请日：2021-07-09
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Tae Hong Min , Ho Hyung Ham , Yong Soon Jang , Ki Suk Kim , Hyung Ki Lee , Chi Won Hwang
IPC: H05K1/11
Abstract: A connection structure embedded substrate includes: a printed circuit board including a plurality of first insulating layers and a plurality of first wiring layers, respectively disposed on or between the plurality of first insulating layers; and a connection structure disposed in the printed circuit board and including a plurality of internal insulating layers and a plurality of internal wiring layers, respectively disposed on or between the plurality of internal insulating layers. Among the plurality of internal wiring layers, an internal wiring layer disposed in one surface of the connection structure is in contact with one surface of a first insulating layer, among the plurality of first insulating layers.
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公开(公告)号：US11437724B2
公开(公告)日：2022-09-06
申请号：US16925847
申请日：2020-07-10
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Tae Hong Min
IPC: H01Q1/22 , H01Q9/04 , H01L25/18 , H01L23/498 , H01Q1/52 , H01L23/66 , H01L23/552
Abstract: An antenna module includes: a wiring structure including a plurality of insulating layers and a plurality of wiring layers; a metal structure disposed on one surface of the wiring structure, and having a through-portion; and an antenna disposed on the one surface of the wiring structure. At least a portion of the antenna is disposed in the through-portion.
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公开(公告)号：US10952316B2
公开(公告)日：2021-03-16
申请号：US16679736
申请日：2019-11-11
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Tae Hong Min , Ju Ho Kim
Abstract: A printed circuit board is disclosed. The printed circuit board includes a first substrate portion, and a second substrate portion connected to the first substrate portion and having a flexible insulation layer which is bendable, and the second substrate portion includes a frame member inserted into the flexible insulation layer.
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公开(公告)号：US20210022243A1
公开(公告)日：2021-01-21
申请号：US16671611
申请日：2019-11-01
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Tae Hong Min
Abstract: A printed circuit board is disclosed. The printed circuit board includes a first substrate portion, and a second substrate portion connected to the first substrate portion and having a flexible insulating layer bendable with respect to the first substrate portion. The second substrate portion includes a block member disposed in the flexible insulating layer and a circuit pattern disposed on a region of the flexible insulating layer, in which the block member is embedded.
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