-
公开(公告)号:US11294571B2
公开(公告)日:2022-04-05
申请号:US16819032
申请日:2020-03-13
Applicant: Samsung Electronics Co., Ltd.
Inventor: Mu-Tien Chang , Dimin Niu , Hongzhong Zheng , Sun Young Lim , Indong Kim , Jangseok Choi
Abstract: A memory module includes a memory array, an interface and a controller. The memory array includes an array of memory cells and is configured as a dual in-line memory module (DIMM). The DIMM includes a plurality of connections that have been repurposed from a standard DIMM pin out configuration to interface operational status of the memory device to a host device. The interface is coupled to the memory array and the plurality of connections of the DIMM to interface the memory array to the host device. The controller is coupled to the memory array and the interface and controls at least one of a refresh operation of the memory array, control an error-correction operation of the memory array, control a memory scrubbing operation of the memory array, and control a wear-level control operation of the array, and the controller to interface with the host device.
-
公开(公告)号:US10592114B2
公开(公告)日:2020-03-17
申请号:US15213386
申请日:2016-07-18
Applicant: Samsung Electronics Co., Ltd.
Inventor: Mu-Tien Chang , Dimin Niu , Hongzhong Zheng , Sun Young Lim , Indong Kim , Jangseok Choi
Abstract: A memory module includes a memory array, an interface and a controller. The memory array includes an array of memory cells and is configured as a dual in-line memory module (DIMM). The DIMM includes a plurality of connections that have been repurposed from a standard DIMM pin out configuration to interface operational status of the memory device to a host device. The interface is coupled to the memory array and the plurality of connections of the DIMM to interface the memory array to the host device. The controller is coupled to the memory array and the interface and controls at least one of a refresh operation of the memory array, control an error-correction operation of the memory array, control a memory scrubbing operation of the memory array, and control a wear-level control operation of the array, and the controller to interface with the host device.
-
公开(公告)号:US10558388B2
公开(公告)日:2020-02-11
申请号:US15169609
申请日:2016-05-31
Applicant: Samsung Electronics Co., Ltd.
Inventor: Dimin Niu , Mu-Tien Chang , Hongzhong Zheng , Craig Hanson , Sun Young Lim , Indong Kim
IPC: G06F3/06
Abstract: A memory system includes: one or more memory modules, each comprising a plurality of memory devices having corresponding write commit policies; and one or more memory controllers coupled to the one or more memory modules, the one or more memory controllers having a configurable write operation protocol to operate with the memory devices according to the corresponding write commit policies.
-
公开(公告)号:US09830086B2
公开(公告)日:2017-11-28
申请号:US15174761
申请日:2016-06-06
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Dimin Niu , Mu-Tien Chang , Hongzhong Zheng , Sun Young Lim , Indong Kim
IPC: G06F3/06
CPC classification number: G06F3/0613 , G06F3/0632 , G06F3/0647 , G06F3/0656 , G06F3/0659 , G06F3/068 , G06F3/0685
Abstract: A hybrid memory controller performs receiving first and second central processing unit (CPU) requests to write to/read from a hybrid memory group, identifying a volatile memory device and a non-volatile memory device as a first target and second target of the first and second CPU requests, respectively, by decoding and address mapping of the first and second CPU requests, queuing the first and second CPU requests in first and second buffers, respectively, generating, based on an arbitration policy, a first command corresponding to one of the first and second CPU requests to an associated one of the first and second targets, and generating a second command corresponding to another one of the first and second CPU requests to an associated another one of the first and second targets, and transmitting the first and second commands to respective ones of the volatile and non-volatile memory devices.
-
公开(公告)号:US10347306B2
公开(公告)日:2019-07-09
申请号:US15231629
申请日:2016-08-08
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Mu-Tien Chang , Dimin Niu , Hongzhong Zheng , Craig Hanson , Sun Young Lim , Indong Kim , Jangseok Choi
IPC: G06F1/32 , G06F1/26 , G11C7/10 , G06F1/3234 , G11C5/04 , G11C7/22 , G06F1/3287 , G11C5/14 , G11C11/4074
Abstract: A memory module includes a plurality of memory components, an in-memory power manager, and an interface to a host computer over a memory bus. The in-memory power manager is configured to control a transition of a power state of the memory module. The transition of the power state of the memory module includes a direct transition from a low power down state to a maximum power down state.
-
公开(公告)号:US10078448B2
公开(公告)日:2018-09-18
申请号:US15196726
申请日:2016-06-29
Applicant: Samsung Electronics Co., Ltd.
Inventor: Sun-Young Lim , Taeksoo Kim , Indong Kim , Hangu Sohn
CPC classification number: G11C14/0018 , G06F12/0246 , G06F2212/1016 , G06F2212/7203 , G11C11/005 , G11C14/0063
Abstract: Electronic devices and memory management methods thereof are provided. Memory management methods may include setting page data of a nonvolatile memory as a read/write mode, copying the page data of the nonvolatile memory to a dynamic random access memory (DRAM) and setting the page data of the DRAM copied from the nonvolatile memory as a read only mode.
-
公开(公告)号:US20180102152A1
公开(公告)日:2018-04-12
申请号:US15811576
申请日:2017-11-13
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Mu-Tien Chang , Dimin Niu , Hongzhong Zheng , Sun Young Lim , Indong Kim , Jangseok Choi
CPC classification number: G11C8/08 , G11C7/1018 , G11C8/04 , G11C8/06 , G11C8/12 , G11C8/18 , G11C13/0026 , G11C13/0028 , G11C13/0069
Abstract: A method for addressing memory device data arranged in rows and columns indexed by a first number of row address bits and a second number of column address bits, and addressed by a row command specifying a third number of row address bits followed by a column command specifying a fourth number of column address bits, the first number being greater than the third number or the second number being greater than the fourth number, includes: splitting the first number of row address bits into first and second subsets, and specifying the first subset in the row command and the second subset in a next address command when the first number is greater than the third number; otherwise splitting the second number of column address bits into third and fourth subsets, and specifying the fourth subset in the column command and the third subset in a previous address command.
-
公开(公告)号:US20170256311A1
公开(公告)日:2017-09-07
申请号:US15227911
申请日:2016-08-03
Applicant: Samsung Electronics Co., Ltd.
Inventor: Mu-Tien Chang , Dimin Niu , Hongzhong Zheng , Sun Young Lim , Indong Kim , Jangseok Choi
IPC: G11C13/00
CPC classification number: G11C8/08 , G11C7/1018 , G11C8/04 , G11C8/06 , G11C8/12 , G11C8/18 , G11C13/0026 , G11C13/0028 , G11C13/0069
Abstract: A method for addressing memory device data arranged in rows and columns indexed by a first number of row address bits and a second number of column address bits, and addressed by a row command specifying a third number of row address bits followed by a column command specifying a fourth number of column address bits, the first number being greater than the third number or the second number being greater than the fourth number, includes: splitting the first number of row address bits into first and second subsets, and specifying the first subset in the row command and the second subset in a next address command when the first number is greater than the third number; otherwise splitting the second number of column address bits into third and fourth subsets, and specifying the fourth subset in the column command and the third subset in a previous address command.
-
公开(公告)号:US20170255398A1
公开(公告)日:2017-09-07
申请号:US15174761
申请日:2016-06-06
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Dimin Niu , Mu-Tien Chang , Hongzhong Zheng , Benjamin Lim , Indong Kim
IPC: G06F3/06
CPC classification number: G06F3/0613 , G06F3/0632 , G06F3/0647 , G06F3/0656 , G06F3/0659 , G06F3/068 , G06F3/0685
Abstract: A hybrid memory controller performs receiving first and second central processing unit (CPU) requests to write to/read from a hybrid memory group, identifying a volatile memory device and a non-volatile memory device as a first target and second target of the first and second CPU requests, respectively, by decoding and address mapping of the first and second CPU requests, queuing the first and second CPU requests in first and second buffers, respectively, generating, based on an arbitration policy, a first command corresponding to one of the first and second CPU requests to an associated one of the first and second targets, and generating a second command corresponding to another one of the first and second CPU requests to an associated another one of the first and second targets, and transmitting the first and second commands to respective ones of the volatile and non-volatile memory devices.
-
-
-
-
-
-
-
-