公开(公告)号：US20200373348A1

公开(公告)日：2020-11-26

申请号：US15930979

申请日：2020-05-13

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Seom Geun LEE ,  Seong Kyu Jang ,  Chan Seob Shin ,  Ho Joon Lee

IPC: H01L27/15 ,  H01L33/30 ,  H01L33/38 ,  H01L33/42 ,  H01L33/44 ,  H01L33/62 ,  H01L25/065

Abstract: A light emitting device for a display including a first LED stack, a second LED stack disposed thereunder, a third LED stack disposed thereunder and including first and second conductivity type semiconductor layers, a first bonding layer between the second and third LED stacks, a second bonding layer between the first and second LED stacks, an insulation layer between the second bonding layer and the second LED stack, lower buried layers passing through the second LED stack and the insulation layer and electrically connected to the first and second conductivity type semiconductor layers of the third LED stack, respectively, upper buried layers passing through the first LED stack and the second bonding layer and electrically connected to the lower buried layers, and upper connectors disposed on the first LED stack and including upper connectors covering and electrically connected to the upper buried layers, respectively.

公开(公告)号：US20200295228A1

公开(公告)日：2020-09-17

申请号：US16815823

申请日：2020-03-11

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Seong Kyu JANG ,  Chan Seob SHIN ,  Seom Geun LEE ,  Ho Joon LEE

IPC: H01L33/24 ,  H01L33/62 ,  H01L25/075

Abstract: A light emitting device for a display including first, second, and third LED stacks, and bump pads disposed on the first LED stack, in which each LED stack includes a first semiconductor layer and a second semiconductor layer exposing a portion of the first semiconductor layer, the first LED stack includes upper through-holes and the second LED stack includes lower through-holes, the bump pads include a first bump pad electrically connected to the second semiconductor layer of the first LED stack, a second bump pad electrically connected to the second semiconductor layer of the second LED stack through the upper through-hole, a third bump pad electrically connected to the second semiconductor layer of the third LED stack through the upper through-hole and the lower through-hole, and a common bump pad electrically connected to the first semiconductor layers of each LED stack in common.

公开(公告)号：US20180153007A1

公开(公告)日：2018-05-31

申请号：US15579370

申请日：2016-05-18

Applicant: Seoul Viosys Co., Ltd

Inventor： Mae Yi KIM ,  Seom Geun LEE ,  Yeo Jin YOON ,  Jin Woong LEE ,  Yong Woo RYU

IPC: H05B33/08 ,  H01L33/14 ,  H01L33/36

CPC classification number: H05B33/0803 ,  H01L33/14 ,  H01L33/36 ,  H01L33/382

Abstract: A light emitting diode including a first semiconductor layer and a plurality of mesas including a second semiconductor layer and an active layer interposed between the first semiconductor layer and the second semiconductor layer, the first semiconductor layer including an exposed region between the plurality of mesas, a current blocking layer disposed on a portion of the plurality of mesas and a portion of the exposed region, a transparent electrode layer covering the second semiconductor layer and the current blocking layer, and a second electrode disposed on the current blocking layer and the transparent electrode layer and electrically connected to the second semiconductor layer. The current blocking layer includes a connecting portion extending from a first mesa to a second mesa adjacent to the first mesa and a protruding portion protruding from the connecting portion and disposed on the exposed region.

公开(公告)号：US20160163921A1

公开(公告)日：2016-06-09

申请号：US15013708

申请日：2016-02-02

Applicant: Seoul Viosys Co., Ltd

Inventor： Seom Geun LEE ,  Jong Kyu KIM ,  Yeo Jin YOON ,  Jae Kwon KIM ,  Mae Yi KIM

IPC: H01L33/08 ,  H01L33/14 ,  H01L33/62 ,  H01L33/42 ,  H01L33/46

CPC classification number: H01L27/15 ,  H01L27/156 ,  H01L33/007 ,  H01L33/0075 ,  H01L33/06 ,  H01L33/08 ,  H01L33/10 ,  H01L33/14 ,  H01L33/145 ,  H01L33/32 ,  H01L33/38 ,  H01L33/42 ,  H01L33/44 ,  H01L33/46 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0016 ,  H01L2933/0066 ,  H01L2924/00

Abstract: A light emitting diode including a first light emitting cell and a second light emitting cell disposed on a substrate and spaced apart from each other to expose a surface of the substrate, a first transparent layer disposed on and electrically connected to the first light emitting cell, first connection section disposed on a portion of the first light emitting cell, a second connection section disposed on a portion of the second light emitting cell, a first interconnection and a second interconnection electrically connecting the first light emitting cell and the second light emitting cell, and an insulation layer disposed between the first and second interconnections and a side surface of the first light emitting cell.

Abstract translation: 一种发光二极管，包括第一发光单元和设置在基板上并彼此间隔开以暴露基板的表面的第二发光单元，设置在第一发光单元上并电连接到第一发光单元的第一透明层， 设置在第一发光单元的一部分上的第一连接部，设置在第二发光单元的一部分上的第二连接部，电连接第一发光单元和第二发光单元的第一互连和第二互连， 以及设置在第一和第二互连之间的绝缘层和第一发光单元的侧表面。

公开(公告)号：US20250063877A1

公开(公告)日：2025-02-20

申请号：US18939470

申请日：2024-11-06

Applicant: Seoul Viosys Co., Ltd.

Inventor： Jong Hyeon CHAE ,  Seom Geun LEE ,  Seong Kyu JANG

IPC: H01L27/15

Abstract: A display panel including a circuit board having pads thereon, and a plurality of pixel regions arranged on the circuit board, each of the pixel regions including a first LED stack disposed on the circuit board, a first bonding layer disposed between the first LED stack and the circuit board, a second LED stack disposed on the first LED stack, a third LED stack disposed on the second LED stack, first through-vias passing through the first LED stack and the first bonding layer, second through-vias passing through the second LED stack, and third through-vias passing through the third LED stack, in which the first through-vias pass through the first LED stack and the first bonding layer, and are connected to the pads of the circuit board.

公开(公告)号：US20250056952A1

公开(公告)日：2025-02-13

申请号：US18927345

申请日：2024-10-25

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Jong Hyeon CHAE ,  Seom Geun LEE ,  Seong Kyu JANG

IPC: H01L27/15 ,  H01L25/075 ,  H01L33/00 ,  H01L33/22 ,  H01L33/42 ,  H01L33/60 ,  H01L33/62

Abstract: A light emitting device for a display including a first LED stack configured to generate light having a first peak wavelength, a second LED stack disposed under the first LED stack, and configured to generate light having a second peak wavelength, a third LED stack disposed under the second LED stack, and configured to generate light having a third peak wavelength; and a floating reflection layer disposed over the first LED stack, in which the first peak wavelength is longer than the second and third peak wavelengths, the first LED stack has a roughened surface to increase the luminous intensity of the light generated in the first LED stack entering the second LED stack, and the floating reflection layer has a high reflectance of 80% or more over light having the first peak wavelength.

公开(公告)号：US20230081487A1

公开(公告)日：2023-03-16

申请号：US17990735

申请日：2022-11-20

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Jong Hyeon CHAE ,  Ik Kyu YOU ,  Seom Geun LEE ,  Seong Kyu JANG ,  Yong Woo RYU

IPC: H01L25/075 ,  H01L33/62 ,  H01L23/00

Abstract: A display panel including a circuit board having first pads, light emitting devices disposed on the circuit board and having second pads and including at least one first light emitting device to emit light having a first peak wavelength and second light emitting devices to emit light having a second peak wavelength, and a metal bonding layer electrically connecting the first pads and the second pads, in which the metal bonding layer of the first light emitting device has a thickness different from that of the metal bonding layer of the second light emitting devices while including a same material, and an upper surface of the second light devices are disposed at an elevation between an upper surface and a bottom surface of the first light emitting device.

公开(公告)号：US20220285329A1

公开(公告)日：2022-09-08

申请号：US17826106

申请日：2022-05-26

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Seom Geun LEE ,  Chan Seob SHIN ,  Ho Joon LEE ,  Seong Kyu JANG

IPC: H01L25/13 ,  H01L33/62 ,  H01L33/42 ,  H01L33/08

Abstract: A light emitting device for a display including a circuit board, a plurality of light emitting units arranged on the circuit board, each light emitting unit comprising a first LED stack including a first conductivity type semiconductor layer, a second conductivity type semiconductor layer, a first electrode disposed on the first conductivity type semiconductor layer, and a second electrode disposed on the second conductivity type semiconductor layer, a plurality of bump pads disposed between the plurality of light emitting units and the circuit board, and a bonding layer disposed between the second electrode and the circuit board, in which the second electrode has a side surface recessed inwardly with respect to a side surface of the light emitting unit to define a recessed portion, and the bonding layer is filled in the recessed portion.

公开(公告)号：US20210175280A1

公开(公告)日：2021-06-10

申请号：US17106150

申请日：2020-11-29

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Jong Hyeon CHAE ,  Seom Geun LEE ,  Seong Kyu JANG

IPC: H01L27/15 ,  H01L33/62 ,  H01L33/24 ,  H01L33/42 ,  H01L33/38 ,  H01L33/00

Abstract: A light emitting device for a display including a first LED stack, a second LED stack disposed under the first LED stack, a third LED stack disposed under the second LED stack, and including a first conductivity type semiconductor layer and a second conductivity type semiconductor layer, a surface protection layer at least partially covering side surfaces of the first LED stack, the second LED stack, or the third LED stack, a first bonding layer interposed between the second LED stack and the third LED stack, a second bonding layer interposed between the first LED stack and the second LED stack, lower buried vias passing through the second LED stack and the first bonding layer, and electrically connected to the first conductivity type semiconductor layer and the second conductivity type semiconductor layer of the third LED stack, respectively, and upper buried vias passing through the first LED stack.

公开(公告)号：US20210057481A1

公开(公告)日：2021-02-25

申请号：US16940394

申请日：2020-07-28

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Jong Hyeon CHAE ,  Seom Geun LEE ,  Seong Kyu JANG

IPC: H01L27/15 ,  H01L25/075 ,  H01L33/22 ,  H01L33/42 ,  H01L33/60 ,  H01L33/62 ,  H01L33/00

Abstract: A light emitting device for a display including a first LED stack configured to generate light having a first peak wavelength, a second LED stack disposed under the first LED stack, and configured to generate light having a second peak wavelength, a third LED stack disposed under the second LED stack, and configured to generate light having a third peak wavelength, and a floating reflection layer disposed over the first LED stack, and configured to reflect light having the first peak wavelength, in which the first peak wavelength is longer than the second and third peak wavelengths.