公开(公告)号：US20220084861A1

公开(公告)日：2022-03-17

申请号：US17476368

申请日：2021-09-15

Applicant: SHIBAURA MECHATRONICS CORPORATION

Inventor： Masaaki FURUYA

IPC: H01L21/677 ,  H01L21/67 ,  B65G47/90

Abstract: A substrate carrying apparatus that can reduce attachment of dust to substrates can be provided. The substrate carrying apparatus 1 of the present embodiment includes a carrying arm 2 for carrying a substrate, a column 32 standing up from a base body 31 with fixed angle, an upper link 33 which supports the carrying arm 2 at one end, which is rotatably connected to the column 32, and which moves the carrying arm 2 up and down in accordance with a rotation, a lower link 34 which is connected to be rotatable around an axis in parallel with a rotation axis of the upper link 33 as a center below a portion of the column 32 connected to the upper link 33, a connection link 35 which is rotatably connected to the upper link 33 and the lower link 34 so that the upper link 33 rotates in accordance with a rotation of the lower link 34, and a driving unit 4 which rotates the lower link 34.

公开(公告)号：US20150090296A1

公开(公告)日：2015-04-02

申请号：US14495118

申请日：2014-09-24

Applicant: SHIBAURA MECHATRONICS CORPORATION

Inventor： Yuji NAGASHIMA ,  Jun MATSUSHITA ,  Konosuke HAYASHI ,  Kunihiro MIYAZAKI ,  Masaaki FURUYA ,  Hidehito AZUMANO ,  Toyoyasu TAUCHI

IPC: B08B3/10

CPC classification number: B08B3/10 ,  H01L21/67028

Abstract: A substrate processing device 100 includes a solvent replacing unit (organic solvent supply unit 15 and solvent supply unit 34) replacing a cleaning liquid with a volatile solvent of a low concentration, and thereafter further performing replacement with a volatile solvent of a high concentration.

Abstract translation: 基板处理装置100包括用低浓度的挥发性溶剂代替清洗液的溶剂置换单元（有机溶剂供给单元15和溶剂供给单元34），然后进一步用高浓度的挥发性溶剂进行置换。

公开(公告)号：US20140299166A1

公开(公告)日：2014-10-09

申请号：US14247329

申请日：2014-04-08

Applicant: Shibaura Mechatronics Corporation

Inventor： Masaaki FURUYA ,  Koichi HIGUCHI

IPC: H01L21/687 ,  H01L21/67

CPC classification number: H01L21/68728

Abstract: A rotary table; a drive motor M configured to rotate the rotary table; a pin base supported by the rotary table; a pin fixing member configured to move closer to or away from C1 upon the pin base revolving; first chuck pins and second chuck pins provided on the pin fixing member and configured to be into contact with an outer edge of the substrate W; a substrate gripping force generation mechanism including a spring member; a chuck pin switching mechanism including an inertia member configured to be rotated coaxially with the rotary table and a protruded member provided on an outer peripheral part of the inertia member; and a cum member provided on the pin fixing member and configured to engage with protruded member.

Abstract translation: 旋转台; 构造成旋转所述旋转台的驱动马达M; 由转台支撑的销座; 销固定构件，其构造成在销基座旋转时靠近或远离C1移动; 第一卡盘销和第二卡盘销设置在销固定构件上并且构造成与基板W的外边缘接触; 包括弹簧部件的基板夹紧力产生机构; 卡盘销切换机构，其包括构造成与所述旋转台同轴旋转的惯性构件和设置在所述惯性构件的外周部上的突出构件; 以及设置在销固定构件上并构造成与突出构件接合的暨构件。

公开(公告)号：US20140261554A1

公开(公告)日：2014-09-18

申请号：US14212382

申请日：2014-03-14

Applicant: SHIBAURA MECHATRONICS CORPORATION

Inventor： Konosuke HAYASHI ,  Masaaki FURUYA ,  Takashi OOTAGAKI ,  Yuji NAGASHIMA ,  Atsushi KINASE ,  Masahiro ABE

IPC: H01L21/67

CPC classification number: H01L21/6704 ,  H01L21/67028 ,  H01L21/67034 ,  H01L21/67115

Abstract: In a substrate processing device 10 having a heating and drying unit 103 for drying a surface of a substrate W, the heating and drying unit 103 heats upward a vertically downward surface of the substrate W to dry the surface of the substrate by dropping and removing, by gravity, the droplets of the volatile solvent formed on the surface of the substrate W by the heating operation.

Abstract translation: 在具有用于干燥基板W的表面的加热和干燥单元103的基板处理装置10中，加热和干燥单元103向上加热基板W的垂直向下的表面，以通过掉落和去除来干燥基板的表面， 通过重力，通过加热操作形成在基板W的表面上的挥发性溶剂的液滴。

公开(公告)号：US20140261549A1

公开(公告)日：2014-09-18

申请号：US14212218

申请日：2014-03-14

Applicant: SHIBAURA MECHATRONICS CORPORATION

Inventor： Konosuke HAYASHI ,  Masaaki FURUYA ,  Takashi OOTAGAKI ,  Yuji NAGASHIMA ,  Atsushi KINASE ,  Masahiro ABE

IPC: H01L21/67

CPC classification number: H01L21/67051 ,  H01L21/67028 ,  H01L21/67034 ,  H01L21/6776

Abstract: A substrate processing device 100 includes a cleaning liquid supply unit 114 supplying a cleaning liquid to a surface of a substrate W, a solvent supply unit 115 supplying a volatile solvent to the surface of the substrate W supplied with the cleaning liquid to replace the cleaning liquid on the surface of the substrate W with the volatile solvent, a heating unit 117 heating the substrate W supplied with the volatile solvent, and a drying unit 118 drying the surface of the substrate W by removing a droplet of the volatile solvent produced on the surface of the substrate W by a heating operation of the heating unit 117, and the heating unit 117 and the drying unit 118 are arranged in a course of transportation of the substrate W transported from the solvent supply unit 115.

Abstract translation: 基板处理装置100包括向基板W的表面供给清洗液的清洗液供给部114，向供给清洗液的基板W的表面供给挥发性溶剂的溶剂供给部115，以更换清洗液 在具有挥发性溶剂的基板W的表面上，加热单元117，加热供给挥发性溶剂的基板W，以及干燥单元118，通过除去表面上产生的挥发性溶剂的液滴来干燥基板W的表面 通过加热单元117的加热操作，加热单元117和干燥单元118在从溶剂供应单元115输送的基板W的输送过程中布置。