Light emitting element
    11.
    发明授权

    公开(公告)号:US12119617B2

    公开(公告)日:2024-10-15

    申请号:US16978531

    申请日:2019-02-06

    Abstract: A light emitting element includes a stacked structure including, in a stacked state, a first light reflection layer 41 in which a plurality of thin films is stacked, a light emitting structure 20, and a second light reflection layer 42 in which a plurality of thin films is stacked. The light emitting structure includes a first compound semiconductor layer 21, an active layer 23 and, a second compound semiconductor layer 22 which are stacked. The light emitting structure 20 is formed with a light absorbing material layer 71 (32) in parallel to a virtual plane occupied by the active layer 23. Let the oscillation wavelength be λ0, let the equivalent refractive index from the active layer to the light absorbing material layer be neq, let the optical distance from the active layer to the light absorbing material layer be Lop, and let Λ≡{(2m+1)λ0}/(4neq) (where m is an integer of equal to or more than 0), then, the value of Lop is a value different from Λ, and the thickness Tave of the second light reflection layer 42 is a value different from the theoretical thickness TDBR of the second light reflection layer 42.

    LIGHT-EMITTING ELEMENT AND METHOD FOR MANUFACTURING THE SAME

    公开(公告)号:US20210098971A1

    公开(公告)日:2021-04-01

    申请号:US17067451

    申请日:2020-10-09

    Abstract: A light-emitting element includes a mesa structure in which a first compound semiconductor layer of a first conductivity type, an active layer, and a second compound semiconductor layer of a second conductivity type are disposed in that order, wherein at least one of the first compound semiconductor layer and the second compound semiconductor layer has a current constriction region surrounded by an insulation region extending inward from a sidewall portion of the mesa structure; a wall structure disposed so as to surround the mesa structure; at least one bridge structure connecting the mesa structure and the wall structure, the wall structure and the bridge structure each having the same layer structure as the portion of the mesa structure in which the insulation region is provided; a first electrode; and a second electrode disposed on a top face of the wall structure.

    LIGHT-EMITTING ELEMENT AND METHOD FOR MANUFACTURING THE SAME
    16.
    发明申请
    LIGHT-EMITTING ELEMENT AND METHOD FOR MANUFACTURING THE SAME 审中-公开
    发光元件及其制造方法

    公开(公告)号:US20170012409A1

    公开(公告)日:2017-01-12

    申请号:US15272181

    申请日:2016-09-21

    Abstract: A light-emitting element includes a mesa structure in which a first compound semiconductor layer of a first conductivity type, an active layer, and a second compound semiconductor layer of a second conductivity type are disposed in that order, wherein at least one of the first compound semiconductor layer and the second compound semiconductor layer has a current constriction region surrounded by an insulation region extending inward from a sidewall portion of the mesa structure; a wall structure disposed so as to surround the mesa structure; at least one bridge structure connecting the mesa structure and the wall structure, the wall structure and the bridge structure each having the same layer structure as the portion of the mesa structure in which the insulation region is provided; a first electrode; and a second electrode disposed on a top face of the wall structure.

    Abstract translation: 发光元件包括台面结构,其中第一导电类型的第一化合物半导体层,有源层和第二导电类型的第二化合物半导体层以该顺序设置,其中第一 化合物半导体层和第二化合物半导体层具有由从台面结构的侧壁部向内延伸的绝缘区域包围的电流收缩区域; 设置成围绕台面结构的壁结构; 连接台面结构和壁结构的至少一个桥结构,壁结构和桥结构各自具有与设置绝缘区域的台面结构部分相同的层结构; 第一电极; 以及设置在所述壁结构的顶面上的第二电极。

    Light emitting element
    18.
    发明授权

    公开(公告)号:US12088059B2

    公开(公告)日:2024-09-10

    申请号:US17281532

    申请日:2019-09-06

    CPC classification number: H01S5/0281 H01S5/18369 H01S5/343

    Abstract: A light emitting element comprising a layered structure configured by layering a first light reflecting layer 41 configured by layering a plurality of thin films, a light emitting structure 20, and a second light reflecting layer 42 configured by layering a plurality of thin films, wherein the light emitting structure 20 is configured by layering, from the first light reflecting layer side, a first compound semiconductor layer 21, an active layer 23, and a second compound semiconductor layer 22, a second electrode 32 and an intermediate layer 70 are formed between the second compound semiconductor layer 22 and the second light reflecting layer 42 from the second compound semiconductor layer side, and the value of a surface roughness of a second surface 72 of the intermediate layer 70 in contact with the second light reflecting layer 42 is less than the value of a surface roughness of a first surface 71 of the intermediate layer 70 facing the second electrode 32.

    Laser device assembly
    19.
    发明授权

    公开(公告)号:US11221446B2

    公开(公告)日:2022-01-11

    申请号:US16605439

    申请日:2018-02-16

    Abstract: A monolithic laser device assembly 10A in the present disclosure includes a first gain portion 20 having a first end portion 20A and a second end portion 20B, a second gain portion 30 having a third end portion 30A and a fourth end portion 30B, one or multiple ring resonators 40, a semiconductor optical amplifier 50 for amplifying a laser light emitted from the first gain portion 20, and a pulse selector 60 disposed between the first gain portion 20 and the semiconductor optical amplifier 50, in which the ring resonator 40 is optically coupled with the first gain portion 20 and with the second gain portion 30, and laser oscillation is performed on either the first gain portion 20 or the second gain portion 30.

    LIGHT-EMITTING ELEMENT AND METHOD FOR MANUFACTURING THE SAME

    公开(公告)号:US20190074662A1

    公开(公告)日:2019-03-07

    申请号:US16173226

    申请日:2018-10-29

    Abstract: A light-emitting element includes a mesa structure in which a first compound semiconductor layer of a first conductivity type, an active layer, and a second compound semiconductor layer of a second conductivity type are disposed in that order, wherein at least one of the first compound semiconductor layer and the second compound semiconductor layer has a current constriction region surrounded by an insulation region extending inward from a sidewall portion of the mesa structure; a wall structure disposed so as to surround the mesa structure; at least one bridge structure connecting the mesa structure and the wall structure, the wall structure and the bridge structure each having the same layer structure as the portion of the mesa structure in which the insulation region is provided; a first electrode; and a second electrode disposed on a top face of the wall structure.

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