公开(公告)号：US20230228570A1

公开(公告)日：2023-07-20

申请号：US18150720

申请日：2023-01-05

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Patrick FEDELI ,  Luca GUERINONI ,  Paola CARULLI ,  Luca Giuseppe FALORNI

IPC: G01C19/5712

CPC classification number: G01C19/5712

Abstract: A microelectromechanical gyroscope is provided with a detection structure having: a substrate with a top surface parallel to a horizontal plane (xy); a mobile mass, suspended above the substrate to perform, as a function of a first angular velocity (Ωx) around a first axis (x) of the horizontal plane (xy), at least a first detection movement of rotation around a second axis (y) of the horizontal plane; and a first and a second stator elements integral with the substrate and arranged underneath the mobile mass to define a capacitive coupling, a capacitance value thereof is indicative of the first angular velocity (Ωx). The detection structure has a single mechanical anchorage structure for anchoring both the mobile mass and the stator elements to the substrate, arranged internally with respect to the mobile mass, which is coupled to this single mechanical anchorage structure by coupling elastic elements yielding to torsion around the second axis; the stator elements are integrally coupled to the single mechanical anchorage structure in an arrangement suspended above the top surface of the substrate.

公开(公告)号：US20230068616A1

公开(公告)日：2023-03-02

申请号：US17460030

申请日：2021-08-27

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Luca GUERINONI ,  Gabriele GATTERE

IPC: G01C25/00 ,  G01C19/72

Abstract: A gyroscopic sensor unit detects a phase drift between a demodulated output signal and demodulation signal during output of a quadrature test signal. A delay calculator detects the phase drift based on changes in the demodulated output signal during application of the quadrature test signal. A delay compensation circuit compensates for the phase drift by delaying the demodulation signal by the phase drift value.

公开(公告)号：US20220170745A1

公开(公告)日：2022-06-02

申请号：US17524609

申请日：2021-11-11

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Luca GUERINONI ,  Luca Giuseppe FALORNI

IPC: G01C19/5712 ,  G01C25/00

Abstract: A microelectromechanical gyroscope includes: the support structure; a sensing mass, coupled to the support structure with degrees of freedom along a driving direction and a sensing direction perpendicular to each other; and a calibration structure facing the sensing mass and separated from the sensing mass by a gap having an average width, the calibration structure being movable with respect to the sensing mass so that displacements of the calibration structure cause variations in the average width of the gap. A calibration actuator controls a relative position of the calibration structure with respect to the sensing mass and the average width of the gap.

公开(公告)号：US20210293597A1

公开(公告)日：2021-09-23

申请号：US17204664

申请日：2021-03-17

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Gabriele GATTERE ,  Francesco RIZZINI ,  Luca GUERINONI ,  Lorenzo CORSO ,  Domenico GIUSTI

IPC: G01F1/84

Abstract: Embodiments of a Coriolis-force-based flow sensing device and embodiments of methods for manufacturing embodiments of the Coriolis-force-based flow sensing device, comprising the steps of: forming a driving electrode; forming, on the driving electrode, a first sacrificial region; forming, on the first sacrificial region, a first structural portion with a second sacrificial region buried therein; forming openings for selectively etching the second sacrificial region; forming, within the openings, a porous layer having pores; removing the second sacrificial region through the pores of the porous layer, forming a buried channel; growing, on the porous layer and not within the buried channel, a second structural portion that forms, with the first structural region, a structural body; selectively removing the first sacrificial region thus suspending the structural body on the driving electrode.

公开(公告)号：US20170108530A1

公开(公告)日：2017-04-20

申请号：US15182317

申请日：2016-06-14

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Alessandro TOCCHIO ,  Francesco RIZZINI ,  Luca GUERINONI

IPC: G01P15/125 ,  G01P1/00

CPC classification number: G01P15/125 ,  B81B3/0072 ,  G01C19/5755 ,  G01P1/00 ,  G01P2015/0814

Abstract: A MEMS sensor device provided with a sensing structure, having: a substrate with a top surface extending in a horizontal plane; an inertial mass, suspended over the substrate; elastic coupling elements, elastically connected to the inertial mass so as to enable inertial movement thereof with respect to the substrate as a function of a quantity to be detected along a sensing axis belonging to the horizontal plane; and sensing electrodes, capacitively coupled to the inertial mass so as to form at least one sensing capacitor, a value of capacitance of which is indicative of the quantity to be detected. The sensing structure moreover has a suspension structure, to which the sensing electrodes are rigidly coupled, and to which the inertial mass is elastically coupled through the elastic coupling elements; the suspension structure is connected to an anchorage structure, fixed with respect to the substrate, by means of elastic suspension elements.

公开(公告)号：US20170088416A1

公开(公告)日：2017-03-30

申请号：US15083034

申请日：2016-03-28

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Alessandro TOCCHIO ,  Carlo VALZASINA ,  Luca GUERINONI ,  Giorgio ALLEGATO

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0048 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2207/012 ,  B81B2207/096 ,  B81C1/00325 ,  B81C2203/0792 ,  H01L23/055 ,  H01L23/13 ,  H01L23/16 ,  H01L2224/32145 ,  H01L2224/48145 ,  H01L2224/48235 ,  H01L2224/73265 ,  H01L2924/1433 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/15313 ,  H01L2924/16195 ,  H01L2924/16251 ,  H01L2924/3511 ,  H01L2924/00012

Abstract: An encapsulated device of semiconductor material wherein a chip of semiconductor material is fixed to a base element of a packaging body through at least one pillar element having elasticity and deformability greater than the chip, for example a Young's modulus lower than 300 MPa. In one example, four pillar elements are fixed in proximity of the corners of a fixing surface of the chip and operate as uncoupling structure, which prevents transfer of stresses and deformations of the base element to the chip.