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公开(公告)号：US10123491B2
公开(公告)日：2018-11-13
申请号：US14985128
申请日：2015-12-30
Applicant: STMicroelectronics, Inc.
Inventor： Marco De Fazio , Simon Dodd
Abstract: The present disclosure is directed to a greenhouse or single container for plant growth coupled to the Internet of Things and including a microfluidic die for water or nutrient distribution. The microfluidic die is controllable automatically or with instructions from a remote user, based on sensors included within a growth environment.
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公开(公告)号：US09968700B2
公开(公告)日：2018-05-15
申请号：US14975200
申请日：2015-12-18
Applicant: STMicroelectronics, Inc. , STMicroelectronics S.r.l. , STMicroelectronics International N.V.
Inventor： Simon Dodd , Joseph Edward Scheffelin , Dave S. Hunt , Timothy James Hoekstra , Faiz Sherman , Stephan Gary Bush
CPC classification number: A61L9/03 , A61L2/00 , A61L9/00 , B05B17/0684
Abstract: One or more embodiments are directed to a microfluidic delivery system that dispenses a fluid. The microfluidic delivery system may be provided in a variety of orientations. In one embodiment, the microfluidic delivery system is vertical so that fluid being expelled opposes gravity. In another embodiment, the microfluidic delivery system is orientated sideways so that fluid being expelled has a horizontal component. In yet another embodiment, the microfluidic delivery system faces downward.
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公开(公告)号：US11242242B2
公开(公告)日：2022-02-08
申请号：US16422504
申请日：2019-05-24
Applicant: STMICROELECTRONICS S.R.L. , STMICROELECTRONICS, INC.
Inventor： Domenico Giusti , Simon Dodd
Abstract: A microfluidic MEMS device is formed by a plurality of ejection cells each having a fluid chamber; an actuator chamber; a membrane having a first surface facing the actuator chamber and a second surface facing the fluid chamber; a piezoelectric actuator on the first surface of the membrane; and a passivation layer on the piezoelectric actuator. The membrane has an elongated area defining a longitudinal direction and a transverse direction. The passivation layer has a plurality of holes. The holes extend throughout the thickness of the passivation layer and, in a plan view, have an elongated shape with a greater dimension parallel to the longitudinal direction of the membrane and a smaller dimension parallel to the transverse direction.
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公开(公告)号：US10759169B2
公开(公告)日：2020-09-01
申请号：US16357100
申请日：2019-03-18
Applicant: STMICROELECTRONICS, INC. , STMICROELECTRONICS INTERNAITONAL N.V. , STMICROELECTRONICS S.R.L.
Inventor： Simon Dodd , David S. Hunt , Joseph Edward Scheffelin , Dana Gruenbacher , Stefan H. Hollinger , Uwe Schober , Peter Janouch
Abstract: The present disclosure provides supports for microfluidic die that allow for nozzles of the microfluidic die to be on a different plane or face a different direction from electrical contacts on the same support. This includes a rigid support having electrical contacts on a different side of the rigid support with respect to a direction of ejection of the nozzles, and a semi-flexible support or semi-rigid support that allow the electrical contacts to be moved with respect to a direction of ejection of the nozzles. The semi-flexible and semi-rigid supports allow the die to be up to and beyond a 90 degree angle with respect to a plane of the electrical contacts. The different supports allow for a variety of positions of the microfluidic die with respect to a position of the electrical contacts.
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公开(公告)号：US10357964B2
公开(公告)日：2019-07-23
申请号：US15917231
申请日：2018-03-09
Applicant: STMICROELECTRONICS, INC. , STMICROELECTRONICS (MALTA) LTD
Inventor： Simon Dodd , Ivan Ellul , Christopher Brincat
Abstract: One or more embodiments are directed to a microfluidic assembly that includes an interconnect substrate coupled to a microfluidic die. In one embodiment, the microfluidic die includes a ledge with a plurality of bond pads. The microfluidic assembly further includes an interconnect substrate having an end resting on the ledge proximate the bond pads. In another embodiment, the interconnect substrate abuts a side surface of the ledge or is located proximate the ledge. Conductive elements couple the microfluidic die to contacts of the interconnect substrate. Encapsulant is located over the conductive elements, the bond pads, the contacts.
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Patent Agency Ranking
公开(公告)号：US10159150B2
公开(公告)日：2018-12-18
申请号：US15253615
申请日：2016-08-31
Applicant: STMICROELECTRONICS, INC. , STMICROELECTRONICS S.R.L.
Inventor： Simon Dodd , Roberto Brioschi
Abstract: The present disclosure is directed to a ceramic substrate that includes a plurality of contact pads, a plurality of electrical traces, and a microelectromechanical die. Contacts on the die are coupled to the plurality of contact pads through the plurality of electrical traces. The substrate also includes a plurality of memory bits formed directly on the substrate. Each memory bit is coupled between a first one of the contact pads and a second one of the contact pads.
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公开(公告)号：US10118391B2
公开(公告)日：2018-11-06
申请号：US15253618
申请日：2016-08-31
Applicant: STMICROELECTRONICS, INC.
Inventor： Simon Dodd
IPC: B41J2/14
Abstract: The present disclosure provides supports for a microfluidic die and one or more additional die including, but not limited to, microfluidic die, ASICs, MEMS devices, and sensors. This includes semi-flexible supports that allow a microfluidic die to be at a 90 degree angle with respect to another die and rigid supports that allow a microfluidic and another die to be in close proximity to each other.
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公开(公告)号：US09919334B2
公开(公告)日：2018-03-20
申请号：US14975540
申请日：2015-12-18
Applicant: STMicroelectronics, Inc. , STMICROELECTRONICS S.R.L. , STMicroelectronics International N.V.
Inventor： Simon Dodd , Joe Scheffelin , Dave Hunt , Matt Giere , Dana Gruenbacher , Faiz Sherman
CPC classification number: B05B17/0607 , B05B17/0638 , B05B17/0684 , B41J2/14016 , B41J2/14024 , B41J2/14056 , B41J2/14072 , B41J2/1433 , B41J2/1601 , B41J2/1632 , B41J2/175 , B41J2/17526 , B41J2/1753 , B41J2002/14338 , B41J2002/14491 , H05K1/0212 , H05K1/111 , H05K1/181 , Y10T29/49119
Abstract: The present disclosure is directed to a microfluidic die that includes a plurality of heaters above a substrate, a plurality of chambers and nozzles above the heaters, a plurality of first contacts coupled to the heaters, and a plurality of second contacts coupled to the heaters. The plurality of second contacts are coupled to each other and coupled to ground. The die includes a plurality of contact pads, a first signal line coupled to the plurality of second contacts and to a first one of the plurality of contact pads, and a plurality of second signal lines, each second signal line being coupled to one of the plurality of first contacts, groups of the second signal lines being coupled together to drive a group of the plurality of heaters with a single signal, each group of the second signal lines being coupled to a remaining one of the plurality of contact pads.
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公开(公告)号：US09833806B2
公开(公告)日：2017-12-05
申请号：US14976434
申请日：2015-12-21
Applicant: STMicroelectronics, Inc. , STMICROELECTRONICS S.R.L. , STMicroelectronics International N.V.
Inventor： Simon Dodd , Joe Scheffelin , Dave Hunt , Matt Giere , Dana Gruenbacher , Faiz Sherman
CPC classification number: B05B17/0607 , B05B17/0638 , B05B17/0684 , B41J2/14016 , B41J2/14024 , B41J2/14056 , B41J2/14072 , B41J2/1433 , B41J2/1601 , B41J2/1632 , B41J2/175 , B41J2/17526 , B41J2/1753 , B41J2002/14338 , B41J2002/14491 , H05K1/0212 , H05K1/111 , H05K1/181 , Y10T29/49119
Abstract: The present disclosure is directed to a microfluidic die that includes a plurality of heaters above a substrate, a plurality of chambers and nozzles above the heaters, a plurality of first contacts coupled to the heaters, and a plurality of second contacts coupled to the heaters. The plurality of second contacts are coupled to each other and coupled to ground. The die includes a plurality of contact pads, a first signal line coupled to the plurality of second contacts and to a first one of the plurality of contact pads, and a plurality of second signal lines, each second signal line being coupled to one of the plurality of first contacts, groups of the second signal lines being coupled together to drive a group of the plurality of heaters with a single signal, each group of the second signal lines being coupled to a remaining one of the plurality of contact pads.
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公开(公告)号：US09358567B2
公开(公告)日：2016-06-07
申请号：US14310886
申请日：2014-06-20
Applicant: STMicroelectronics, Inc.
Inventor： Simon Dodd , Joe Scheffelin , Dave Hunt , Matt Giere , Dana Gruenbacher , Faiz Sherman
CPC classification number: B05B17/0607 , B05B17/0638 , B05B17/0684 , B41J2/14016 , B41J2/14024 , B41J2/14056 , B41J2/14072 , B41J2/1433 , B41J2/1601 , B41J2/1632 , B41J2/175 , B41J2/17526 , B41J2/1753 , B41J2002/14338 , B41J2002/14491 , H05K1/0212 , H05K1/111 , H05K1/181 , Y10T29/49119
Abstract: The present disclosure is directed to a microfluidic die that includes a plurality of heaters above a substrate, a plurality of chambers and nozzles above the heaters, a plurality of first contacts coupled to the heaters, and a plurality of second contacts coupled to the heaters. The plurality of second contacts are coupled to each other and coupled to ground. The die includes a plurality of contact pads, a first signal line coupled to the plurality of second contacts and to a first one of the plurality of contact pads, and a plurality of second signal lines, each second signal line being coupled to one of the plurality of first contacts, groups of the second signal lines being coupled together to drive a group of the plurality of heaters with a single signal, each group of the second signal lines being coupled to a remaining one of the plurality of contact pads.
Abstract translation: 本公开涉及一种微流体管芯，其包括在基底上方的多个加热器，加热器上方的多个腔室和喷嘴，联接到加热器的多个第一触头以及耦合到加热器的多个第二触点。 多个第二触点彼此耦合并耦合到地。 芯片包括多个接触焊盘，耦合到多个第二触点和多个接触焊盘中的第一触点的第一信号线以及多个第二信号线，每个第二信号线耦合到 多个第一触点，第二信号线的组被耦合在一起以用单个信号驱动一组多个加热器，每组第二信号线耦合到多个接触垫中的剩余的一个。
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