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公开(公告)号：US20220102080A1
公开(公告)日：2022-03-31
申请号：US17546385
申请日：2021-12-09
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Taek Jung LEE , Min Gon LEE , Jea Yeol CHOI , Jin Man JUNG , Jin Kyung JOO
Abstract: A multilayer ceramic capacitor includes a body including a dielectric layer and first and second internal electrodes disposed with the dielectric layer interposed therebetween and disposed in point-symmetry with each other; first and second connection electrodes penetrating the body in a direction perpendicular to the dielectric layer and connected to the first internal electrode; third and fourth connection electrodes penetrating the body in a direction perpendicular to the dielectric layer and connected to the second internal electrode; first and second external electrodes disposed on both surfaces of the body and connected to the first and second connection electrodes; and third and fourth external electrodes spaced apart from the first and second external electrodes and connected to the third and fourth connection electrodes, and the first and second internal electrodes include a region in which an electrode is not disposed.
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12.发明申请MULTILAYER CERAMIC ELECTRONIC COMPONENT EMBEDDED IN BOARD AND PRINTED CIRCUIT BOARD HAVING THE SAME 审中-公开埋在板上的多层陶瓷电子元件及其印刷电路板公开(公告)号：US20150075853A1
公开(公告)日：2015-03-19
申请号：US14135308
申请日：2013-12-19
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Hai Joon LEE , Doo Young KIM , Byoung Hwa LEE , Jin Man JUNG
CPC classification number: H01G2/06 , H01G4/012 , H01G4/12 , H01G4/232 , H01G4/30 , H05K1/185 , H05K2201/09509 , H05K2201/10015 , H05K2201/10636 , Y02P70/611
Abstract: There is provided a multilayer ceramic electronic component embedded in a board including: a ceramic body including dielectric layers; an active layer including a plurality of first and second internal electrodes, having the dielectric layer therebetween, to thereby form capacitance; upper and lower cover layers formed in upper and lower portions of the active layer; and first and second external electrodes formed in both ends of the ceramic body, wherein the first external electrode includes a first base electrode and a first terminal electrode formed on the first base electrode, the second external electrode includes a second base electrode and a second terminal electrode formed on the second base electrode, and in the case that a thickness of the upper cover layer is tc1 and a thickness of the lower cover layer is tc2, 0.10≦tc1/tc2≦1.00 is satisfied.
Abstract translation: 提供了一种嵌入板中的多层陶瓷电子部件，包括：包括电介质层的陶瓷体; 包括多个第一和第二内部电极的有源层，其间具有介电层，从而形成电容; 形成在有源层的上部和下部的上和下覆盖层; 以及形成在陶瓷体的两端的第一外部电极和第二外部电极，其中，所述第一外部电极包括形成在所述第一基底电极上的第一基极和第一端子电极，所述第二外部电极包括第二基极和第二端 形成在第二基极上的电极，并且在上覆盖层的厚度为tc1且下覆盖层的厚度为tc2，0.10＆nlE; tc1 / tc2＆nlE; 1.00的情况下，形成电极。
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13.发明申请公开(公告)号：US20150041199A1
公开(公告)日：2015-02-12
申请号：US14213185
申请日：2014-03-14
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Byoung Hwa LEE , Hai Joon LEE , Eun Hyuk CHAE , Bae Gen LEE , Jin Man JUNG
CPC classification number: H05K1/185 , H01G2/06 , H01G4/005 , H01G4/232 , H01G4/30 , H05K1/0306 , H05K2201/10015 , H05K2201/10636 , Y02P70/611
Abstract: A multilayer ceramic electronic component to be embedded in a board includes: a ceramic body including dielectric layers; first and second internal electrodes formed in the ceramic body; and first-polarity external electrodes connected to the first internal electrodes, and second-polarity external electrodes connected to the second internal electrodes, wherein the number of the first-polarity external electrodes and the number of the second-polarity external electrodes may be two or more, the first-polarity and second-polarity external electrodes may include first-polarity and second-polarity base electrodes and first-polarity and second-polarity terminal electrodes formed on the first-polarity and second-polarity base electrodes, respectively, when L denotes a length of the ceramic body and W denotes a width thereof, W/L≧0.6 may be satisfied, and a width BW of each of the first-polarity and second-polarity external electrodes formed on the first and second main surfaces of the ceramic body may satisfy 150 μm≦BW≦350 μm.
Abstract translation: 嵌入板中的多层陶瓷电子部件包括：包含电介质层的陶瓷体; 在陶瓷体中形成的第一和第二内部电极; 连接到第一内部电极的第一极性外部电极和连接到第二内部电极的第二极性外部电极，其中第一极性外部电极的数量和第二极性外部电极的数量可以是两个或 此外，第一极性和第二极性外部电极可以包括分别在第一极性和第二极性基极上形成的第一极性和第二极性基极以及形成在第一极性和第二极性基极上的第一极性和第二极性端子电极，当L 表示陶瓷体的长度，W表示其宽度，W /L≥0.6，并且形成在第一和第二主表面上的第一极性和第二极性外部电极的宽度BW 陶瓷体可以满足150μm＆nlE; BW＆nlE;350μm。
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14.发明申请公开(公告)号：US20150041198A1
公开(公告)日：2015-02-12
申请号：US14174591
申请日：2014-02-06
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Byoung Hwa LEE , Doo Young KIM , Hai Joon LEE , Jin Man JUNG
CPC classification number: H01G2/06 , H01G4/005 , H01G4/232 , H01G4/30 , H05K1/185 , H05K2201/10015 , H05K2201/10636 , Y02P70/611
Abstract: There is provided a multilayer ceramic electronic part to be embedded in a board, the multilayer ceramic electronic part including: a ceramic body including dielectric layers; first and second internal electrodes disposed in the ceramic body; first and second external electrodes formed on the respective end portions of the ceramic body, and a third external electrode formed on first and second main surfaces of the ceramic body, wherein an outermost first internal electrode among the first internal electrodes is connected to the first and second external electrodes through at least one first via, and the second internal electrodes are connected to the third external electrode through at least one second via.
Abstract translation: 提供了一种要嵌入板中的多层陶瓷电子部件，所述多层陶瓷电子部件包括：陶瓷体，包括电介质层; 布置在陶瓷体中的第一和第二内部电极; 形成在陶瓷体的各个端部的第一外部电极和第二外部电极，以及形成在陶瓷体的第一和第二主表面上的第三外部电极，其中，第一内部电极中的最外部第一内部电极连接到第一内部电极， 通过至少一个第一通孔的第二外部电极，并且所述第二内部电极通过至少一个第二通孔连接到所述第三外部电极。
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15.发明申请公开(公告)号：US20150021079A1
公开(公告)日：2015-01-22
申请号：US14083189
申请日：2013-11-18
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Byoung Hwa LEE , Doo Young KIM , Hai Joon LEE , Jin Man JUNG
CPC classification number: H01G2/06 , H01G4/012 , H01G4/232 , H01G4/30 , H05K1/185 , H05K3/0035 , H05K2201/10015 , H05K2201/10636 , Y02P70/611
Abstract: There is provided a multilayer ceramic electronic component to be embedded in a board, including a ceramic body including dielectric layers and having first and second main surfaces facing each other, first and second side surfaces facing each other, and first and second end surfaces facing each other, an active layer including a plurality of first and second internal electrodes alternately exposed through both end surfaces of the ceramic body with the dielectric layers interposed therebetween, to form capacitance therein, upper and lower cover layers formed on upper and lower portions of the active layer, and first and second external electrodes formed on both end surfaces of the ceramic body, wherein when a thickness of the upper or lower cover layer is defined as tc, 4 μm≦tc≦20 μm may be satisfied.
Abstract translation: 本发明提供一种嵌入电路板的多层陶瓷电子元件，其包括：包含电介质层的陶瓷体，具有彼此相对的第一和第二主表面，彼此相对的第一和第二侧表面以及面向每个的第一和第二端面 另一方面，包括多个第一和第二内部电极的有源层，所述多个第一和第二内部电极通过陶瓷体的两个端面交替地暴露在介电层之间以形成电容，其中形成在活性物质的上部和下部的上部和下部覆盖层 层，以及形成在陶瓷体的两个端面的第一外部电极和第二外部电极，其中当上部或下部覆盖层的厚度被定义为tc时，可以满足4μm＆lt; nlE; tc＆nlE;20μm。
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Patent Agency Ranking
公开(公告)号：US20210166880A1
公开(公告)日：2021-06-03
申请号：US17177343
申请日：2021-02-17
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Min Gon LEE , Seung Woo SONG , Jae Yeol CHOI , Jin Kyung JOO , Taek Jung LEE , Jin Man JUNG
Abstract: A multilayer ceramic electronic component includes: a ceramic body and first and second external electrodes on external surfaces of the ceramic body. The ceramic body includes first and second internal electrodes facing each other with dielectric layers interposed therebetween. The ceramic body includes an active portion in which capacitance is formed and cover portions on upper and lower surfaces of the active portion, respectively. The ratio of the thickness of the first and second external electrodes to the thickness of the cover portion is proportional to the inverse of the cube root of the ratio of the Young's Modulus of each of the first and second external electrodes to the Young's modulus of the cover portion.
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公开(公告)号：US20210057158A1
公开(公告)日：2021-02-25
申请号：US16817783
申请日：2020-03-13
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Min Gon LEE , Taek Jung LEE , Jin Man JUNG , Jin Kyung JOO , Ji Hong JO
Abstract: A multilayer ceramic capacitor includes a body including a dielectric layer and first and second internal electrodes disposed with the dielectric layer interposed therebetween; first and second through electrodes penetrating the body, connected to the first and second internal electrodes, respectively, and including nickel; first and second external electrodes, and connected to the first through electrode; and third and fourth external electrodes spaced apart from the first and second external electrodes, and connected to the second through electrode. Each of the first to fourth external electrodes includes a sintered electrode including nickel, and a first plating layer and a second plating layer stacked on the sintered electrode in order.
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公开(公告)号：US20190148073A1
公开(公告)日：2019-05-16
申请号：US16010984
申请日：2018-06-18
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jong Pil LEE , Jung Il KIM , Jin Man JUNG , Young Key KIM , Jin Kyung JOO
Abstract: A multilayer capacitor includes: a first internal electrode layer including first and second internal electrodes disposed to face each other with an insulating portion interposed therebetween; a second internal electrode layer including a third internal electrode and a lead portion connected to the third internal electrode; a body including the first and second internal electrode layers alternately disposed with respective dielectric layers interposed therebetween; first and second external electrodes disposed on the body to be connected to the first and second internal electrodes, respectively; and a third external electrode disposed on the body to be connected to the lead portion.
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公开(公告)号：US20190066923A1
公开(公告)日：2019-02-28
申请号：US15959905
申请日：2018-04-23
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jin Man JUNG , Jin Kyung JOO , Ik Hwan CHANG , Byeong Chan KWON , Ji Hyun PARK , Do Heung NA , Jae Yeol CHOI , Sung Hyun CHO
Abstract: A capacitor component includes a body including first and second internal electrodes alternately disposed with respective dielectric layers interposed therebetween to be exposed to the third and fourth surfaces of the body, respectively; first and second conductive layers covering the third and fourth surfaces and connected to the first and second internal electrodes, respectively; first and second insulating layers covering the first and second conductive layers, respectively; first and second band portions spaced apart from each other on the second surface of the body; first and second external electrodes covering a portion of the first and second band portions and the first insulating layer, respectively; and third and fourth external electrodes covering a portion of the first and second insulating layers and a portion of the first surface of the body, respectively; and a method of manufacturing the same.
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公开(公告)号：US20180199440A1
公开(公告)日：2018-07-12
申请号：US15914664
申请日：2018-03-07
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jin Woo LEE , Jin Man JUNG
CPC classification number: H05K1/185 , H01G4/12 , H01G4/232 , H01G4/30 , H05K1/0231 , H05K1/09 , H05K1/115 , H05K2201/10015 , H05K2201/10636 , Y02P70/611
Abstract: There is provided a multilayer ceramic electronic component embedded in a board including: a ceramic body including dielectric layers; first and second internal electrodes; and first and second external electrodes formed on first and second side surfaces of the ceramic body, respectively, wherein the first external electrode includes a first electrode layer and a first metal layer formed on the first electrode layer, the second external electrode includes a second electrode layer and a second metal layer formed on the second electrode layer, the first and second external electrodes are formed to be extended to first main surface of the ceramic body, and when a maximum width and a minimum width of at least one of the first and second external electrodes formed on the first main surface are defined as BWmax and BWmin, respectively, 0≤BWmax−BWmin≤100 μm is satisfied.
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