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公开(公告)号：US20190386641A1
公开(公告)日：2019-12-19
申请号：US16190573
申请日：2018-11-14
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Tae Kyung LEE , Tae Yoon KIM , Jong Woon KIM , Moon Chul LEE , Yong Jin KANG , Nam Jung LEE
Abstract: An acoustic resonator includes a substrate, and a resonant portion comprising a center portion in which a first electrode, a piezoelectric layer and a second electrode are sequentially laminated on the substrate, and an extending portion disposed along a periphery of the center portion, wherein the resonant portion is configured to have an asymmetrical polygonal plane, an insertion layer is disposed below the piezoelectric layer in the extending portion, and the piezoelectric layer is configured to have a top surface which is raised to conform to a shape of the insertion layer, and the insertion layer is configured to have an asymmetrical polygonal shape corresponding to a shape of the extending portion.
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公开(公告)号：US20190356301A1
公开(公告)日：2019-11-21
申请号：US16196453
申请日：2018-11-20
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Sang Kee YOON , Nam Soo PARK , Hyung Jae PARK , Tae Kyung LEE , Moon Chul LEE
IPC: H03H9/17 , H01L21/3213
Abstract: A method of manufacturing a bulk acoustic wave resonator includes: forming a sacrificial layer on a substrate protection layer; forming a membrane layer on the substrate protection layer to cover the sacrificial layer; and forming a cavity by removing the sacrificial layer using a gas mixture comprising a halide-based gas and an oxygen-containing gas, wherein a mixture ratio of the halide-based gas to the oxygen-containing gas in the gas mixture is in a range from 1.5 to 2.4.
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公开(公告)号：US20190356293A1
公开(公告)日：2019-11-21
申请号：US16400052
申请日：2019-05-01
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Yong Suk KIM , Moon Chul LEE , Sung Jun LEE , Chang Hyun LIM , Jae Hyoung GIL , Sang Hyun YI
Abstract: A bulk acoustic wave resonator includes a substrate; a lower electrode disposed on the substrate; a piezoelectric layer disposed to cover at least a portion of the lower electrode; an upper electrode disposed to cover at least a portion of the piezoelectric layer; and a passivation layer disposed to cover at least a portion of the upper electrode, wherein the passivation layer includes a non-trimming-processed portion disposed outside an active region of the bulk acoustic wave resonator in which portions of the lower electrode, the piezoelectric layer, and the upper electrode overlap, and having a thickness that is thicker than a thickness of a portion of the passivation layer disposed in the active region.
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公开(公告)号：US20180019723A1
公开(公告)日：2018-01-18
申请号：US15623703
申请日：2017-06-15
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Chang Hyun LIM , Jae Chang LEE , Sung Min CHO , Tae Kyung LEE , Moon Chul LEE
IPC: H03H9/02 , H03H9/56 , H01L41/047
CPC classification number: H03H9/02118 , H03H9/131 , H03H9/173 , H03H9/564
Abstract: A bulk acoustic wave filter device includes a resonating part, an electrode connecting part, a first layer, and a second layer. The resonating part is disposed on a substrate, and the electrode connecting part connects electrodes of the resonating part. The first layer is disposed on the substrate, and the second layer is disposed on regions of the first layer, other than a lower portion of the electrode connecting part.
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公开(公告)号：US20170366156A1
公开(公告)日：2017-12-21
申请号：US15384385
申请日：2016-12-20
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Won HAN , Tae Hun LEE , Dae Hun JEONG , Moon Chul LEE , Sang Uk SON
CPC classification number: H03H9/02007 , H03H9/02086 , H03H9/132 , H03H9/173 , H03H9/174 , H03H9/54
Abstract: An acoustic wave filter device includes a lower electrode disposed between a substrate and a piezoelectric layer, an upper electrode disposed on the piezoelectric layer, and an insulating layer disposed on the upper electrode. The insulating layer exposes portions of the upper electrode.
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Patent Agency Ranking
公开(公告)号：US20160344367A1
公开(公告)日：2016-11-24
申请号：US15058713
申请日：2016-03-02
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Tae Yoon KIM , Yeong Gyu LEE , Moon Chul LEE , Jae Chang LEE , Duck Hwan KIM
CPC classification number: H03H9/131 , H03H3/02 , H03H9/1007
Abstract: A resonator package and a method of manufacturing the same are provided. The method of manufacturing a resonator package involves etching a lower electrode with a hardmask, in which only a portion of a thickness of the lower electrode is etched to shape the lower electrode.
Abstract translation: 提供了一种谐振器封装及其制造方法。 制造谐振器封装的方法包括用硬掩模蚀刻下电极，其中仅蚀刻下电极的厚度的一部分以使下电极成形。
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公开(公告)号：US20160329481A1
公开(公告)日：2016-11-10
申请号：US14991110
申请日：2016-01-08
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Tae Yoon KIM , Yeong Gyu LEE , Moon Chul LEE , Jae Chang LEE , Duck Hwan KIM
IPC: H03H9/54 , H01L41/047
CPC classification number: H03H9/1014
Abstract: A bulk acoustic wave resonator includes a resonating part comprising a first electrode, a piezoelectric layer, and a second electrode sequentially laminated, wherein the resonating part is disposed on a substrate; and a cap comprising a groove part configured to accommodate the resonating part, a frame bonded to the substrate by a bonding agent, and a permeation preventing part configured to block the bonding agent from permeating into the groove part from the frame.
Abstract translation: 一种体声波谐振器包括：谐振部分，包括第一电极，压电层和顺序层压的第二电极，其中所述谐振部分设置在基板上; 以及帽，其包括构造成容纳所述共振部的槽部，通过接合剂与所述基板接合的框架，以及防止粘结剂从所述框架向所述槽部渗透的防渗透部。
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公开(公告)号：US20160204761A1
公开(公告)日：2016-07-14
申请号：US14932109
申请日：2015-11-04
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Moon Chul LEE , Duck Hwan KIM , Yeong Gyu LEE , Chul Soo KIM , Jie Ai YU , Sang Uk SON
CPC classification number: H03H9/0514 , H03H3/02 , H03H9/0504 , H03H9/173 , H03H2003/021
Abstract: There are provided an acoustic resonator and a method of manufacturing the same. The acoustic resonator includes a resonance part including a first electrode, a second electrode, and a piezoelectric layer disposed between the first and second electrodes. The acoustic resonator also includes a substrate disposed below the resonance part and including a via hole penetrating through the substrate and a connection conductor disposed in the via hole and connected to at least one of the first and second electrodes.
Abstract translation: 提供了一种声谐振器及其制造方法。 声谐振器包括共振部分，其包括第一电极，第二电极和布置在第一和第二电极之间的压电层。 声谐振器还包括设置在谐振部分下方并且包括穿透基板的通孔和布置在通孔中并连接到第一和第二电极中的至少一个的连接导体的基板。
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公开(公告)号：US20160163954A1
公开(公告)日：2016-06-09
申请号：US14925230
申请日：2015-10-28
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Jea Shik SHIN , Sang Uk SON , Yeong Gyu LEE , Moon Chul LEE , Ho Soo PARK , Duck Hwan KIM , Chul Soo KIM
IPC: H01L41/047 , H01L41/18 , H01L41/29
CPC classification number: H03H9/173 , H03H3/02 , H03H2003/021
Abstract: An acoustic resonator and a method of manufacturing the same are provided. The acoustic resonator includes a resonance part including a first electrode, a second electrode, and a piezoelectric layer disposed between the first and second electrodes; and a substrate disposed below the resonance part. The piezoelectric layer is disposed on a flat surface of the first electrode.
Abstract translation: 提供一种声谐振器及其制造方法。 声谐振器包括共振部分，其包括第一电极，第二电极和布置在第一和第二电极之间的压电层; 以及设置在共振部下方的基板。 压电层设置在第一电极的平坦表面上。
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公开(公告)号：US20240080011A1
公开(公告)日：2024-03-07
申请号：US18112609
申请日：2023-02-22
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Moon Chul LEE , Jae Hyoung GIL , Kwang Su KIM , Sung Jun LEE , Yong Suk KIM , Dong Hyun PARK , Tae Kyung LEE
Abstract: A bulk-acoustic wave (BAW) resonator includes a central portion in which a first electrode, a piezoelectric layer, and a second electrode are sequentially stacked on a substrate, and an extension portion extending externally from the central portion, and an insertion layer and a loss prevention film are disposed in the extension portion between the substrate and the second electrode. The loss prevention film is formed to have a thickness of 50 Å to 500 Å. The insertion layer is stacked on the loss prevention film, and has a side surface opposing the central portion, the side surface is formed as a first inclined surface having a first inclination angle. The loss prevention film has a side surface opposing the central portion, the side surface is formed as a second inclined surface having a second inclination angle. The second inclination angle is formed to be greater than the first inclination angle.
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