公开(公告)号：US20140145323A1

公开(公告)日：2014-05-29

申请号：US14089724

申请日：2013-11-25

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Kyung Ho LEE ,  Hyun Bok KWON ,  Seung Wan WOO ,  Young Nam HWANG ,  Suk Jin HAM ,  Po Chul KIM ,  So Hyang EUN ,  Se Jun PARK

IPC: H01L23/373

CPC classification number: H01L23/49816 ,  H01L23/3128 ,  H01L23/3737 ,  H01L23/49833 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/73253 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/15331

Abstract: Disclosed herein is a lamination layer type semiconductor package, and more particularly, a lamination layer type semiconductor package capable of maintaining a thickness of a package on package structure at a minimum and minimizing a warpage defect by mounting two chips so as to correspond to each other. The lamination layer type semiconductor package includes: an upper package having an upper flip chip mounted on an upper substrate; a lower package having a lower flip chip mounted on a lower substrate and disposed so as to closely adhere the upper flip chip and the lower flip chip to each other; a heat dissipation adhesive member adhesively fixing the upper flip chip and the lower flip chip and dissipating heat generated from the upper flip chip and the lower flip chip; and a molding member molding between the upper substrate and the lower substrate.

Abstract translation: 本文公开了一种叠层型半导体封装，更具体地说，是一种能够将封装结构上的封装的厚度最小化并且通过安装两个芯片以使彼此对应来最小化翘曲缺陷的层压层型半导体封装 。 叠层型半导体封装包括：上封装，其具有安装在上基板上的上倒装芯片; 下封装，其具有安装在下基板上的下倒装芯片，并且被设置为将上倒装芯片和下倒装芯片彼此紧贴; 散热粘合构件，其粘合地固定所述上倒装芯片和所述下倒装芯片，并消散由所述上倒装芯片和所述下倒装芯片产生的热量; 以及在上基板和下基板之间成型的成型部件。

公开(公告)号：US20140138611A1

公开(公告)日：2014-05-22

申请号：US13782864

申请日：2013-03-01

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hee Suk CHUNG ,  Gyu Seok KIM ,  Han Wool KANG ,  Kyung Ho LEE ,  Mi Yang KIM ,  Suk Jin HAM

IPC: H01L21/02 ,  H01L29/06

CPC classification number: H01L29/0676 ,  B82Y10/00 ,  B82Y40/00 ,  H01L21/0254 ,  H01L21/02603 ,  H01L21/02614 ,  H01L29/66469 ,  H01L29/775 ,  H01L33/18

Abstract: There is provided an In nanowire including a substrate, an indium thin film formed on the substrate, an insulating film formed on the indium thin film and having at least one through hole through formation of a pattern, and an In nanowire vertically protruded from the indium thin film through the at least one through hole.

Abstract translation: 提供了一种In纳米线，其包括基板，形成在基板上的铟薄膜，形成在铟薄膜上并具有通过形成图案的至少一个通孔的绝缘膜，以及从铟垂直地突出的In纳米线 薄膜通过至少一个通孔。

公开(公告)号：US20140106278A1

公开(公告)日：2014-04-17

申请号：US13731776

申请日：2012-12-31

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hye Jin CHO ,  Suk Jin HAM ,  Sung Hee LIM ,  Kyoung Soon PARK

IPC: G03F7/095

CPC classification number: G03F7/0955 ,  G03F7/027 ,  G03F7/033 ,  G03F7/11

Abstract: There is provided a dry film resist sheet, including: a base film; a first dry film resist layer formed on the base film, the first dry film resist layer containing a binder polymer, a multi-functional monomer, and a photoinitiator; and a second dry film resist layer formed on the first dry film resist layer, the second dry film resist layer containing a binder polymer, a multi-functional monomer, a photoinitiator, and a thermal initiator.

Abstract translation: 提供了一种干膜抗蚀剂片，包括：基膜; 形成在基膜上的第一干膜抗蚀剂层，含有粘合剂聚合物的第一干膜抗蚀剂层，多官能单体和光引发剂; 和形成在第一干膜抗蚀剂层上的第二干膜抗蚀剂层，第二干膜抗蚀剂层含有粘合剂聚合物，多官能单体，光引发剂和热引发剂。

公开(公告)号：US20140104417A1

公开(公告)日：2014-04-17

申请号：US14048703

申请日：2013-10-08

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Seung Wan WOO ,  Young Nam HWANG ,  Po Chul KIM ,  Kyung Ho LEE ,  Suk Jin HAM

IPC: G01N21/88

CPC classification number: G01N21/88 ,  G01B11/306 ,  G01N25/16

Abstract: Disclosed herein are a system of measuring a warpage and a method of measuring a warpage. The system of measuring a warpage of a sample by analyzing an image photographed by the camera using light that is diffused from a light source and reflected on a surface of a sample and is arrived at the camera through a reference grating part, the system includes: an intake part that removes a fume generated from the sample. By this configuration, it is possible to measure the warpage while effectively removing the fume generated from the sample according to the increase in the temperature of the sample at the time of measuring the warpage, thereby improving the accuracy of the warpage measurement.

Abstract translation: 这里公开了测量翘曲的系统和测量翘曲的方法。 通过使用从光源扩散并在样品表面上反射的光通过分析由相机拍摄的图像并通过参考光栅部件到达相机的方式来测量样品的翘曲的系统，该系统包括： 一个摄取部分去除样品产生的烟雾。 通过该结构，可以根据测定翘曲时的试样的温度的上升而有效地除去样品产生的烟雾，能够测量翘曲，提高翘曲测定精度。