公开(公告)号：US20140352413A1

公开(公告)日：2014-12-04

申请号：US14289341

申请日：2014-05-28

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hee Jin PARK ,  Seung Mi LEE ,  Suk Jin HAM

IPC: G01N7/14

CPC classification number: G01N15/082 ,  G01N5/025

Abstract: Disclosed herein is a moisture transmission testing instrument of measuring moisture transmission of an electronic material, the moisture transmission testing instrument including: a moisture supplying part having an opened upper portion and having water stored therein; a sample support part stacked on the moisture supplying part so as to be communicated with the moisture supplying part and having a sample seated on an upper side thereof; and a moisture collecting part stacked on the sample support part so as to be communicated with the sample support part and having a dehumidifying agent installed therein.

Abstract translation: 本发明公开了一种测量电子材料的透湿性的湿气传输测试仪器，该透湿检测仪器包括：具有打开的上部并具有储存在其中的水的供水部分; 所述样本支撑部分堆叠在所述供水部分上以与所述供水部分连通并且具有位于其上侧的样本; 以及集尘部，堆叠在所述样品支撑部上，以与所述样品支撑部连通并且设置有除湿剂。

公开(公告)号：US20140145322A1

公开(公告)日：2014-05-29

申请号：US14069906

申请日：2013-11-01

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Young Nam HWANG ,  Suk Jin HAM ,  Seung Wan WOO ,  Po Chul KIM ,  Kyung Ho LEE

IPC: H01L23/08 ,  H01L21/56

CPC classification number: H01L21/565 ,  H01L23/3128 ,  H01L23/562 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/3511

Abstract: Disclosed herein are an electronic component package and a method of manufacturing the same. The electronic component package includes: a substrate; a connection member provided on at least one surface of the substrate; an active element coupled to the substrate by the connection member; and a molding part covering an exposed surface of the active element, wherein the molding part is formed of a first material having a coefficient of thermal expansion of 8 to 15 ppm/° C. and thermal conductivity of 1 to 5 W/m° C. Therefore, warpage may be significantly decreased and heat radiation performance of the active element may be improved, as compared with the case of implementing the molding part using an EMC according to the related art.

Abstract translation: 本文公开了一种电子部件封装及其制造方法。 电子部件封装包括：基板; 设置在所述基板的至少一个表面上的连接构件; 通过所述连接部件与所述基板连接的有源元件; 以及覆盖有源元件的暴露表面的成型部件，其中，所述模制部件由热膨胀系数为8〜15ppm /℃，导热率为1〜5W / m℃的第一材料形成 因此，与使用根据现有技术的EMC的成型部件的情况相比，可能显着降低翘曲并且可以提高有源元件的散热性能。

公开(公告)号：US20150162134A1

公开(公告)日：2015-06-11

申请号：US14613233

申请日：2015-02-03

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Kwang Jik LEE ,  Suk Jin HAM ,  Ji Hyuk LIM

IPC: H01G4/30 ,  H01G4/012 ,  H01G4/12 ,  H01G4/008

CPC classification number: H01G4/306 ,  B23B3/00 ,  H01G4/008 ,  H01G4/0085 ,  H01G4/012 ,  H01G4/1209 ,  H01G4/30 ,  Y10T29/49155 ,  Y10T428/265 ,  Y10T428/31678

Abstract: There are provided a multilayer thin film for a ceramic electronic component and a method of manufacturing the same. The multilayer thin film includes a substrate; and a ceramic layer and a metal layer alternately formed on at least one of upper and lower surfaces of the substrate, wherein at least one of the ceramic layer and the metal layer has a height corresponding to a thickness of at least one of a plurality of particles arranged on a plane. With the multilayer thin film for a ceramic electronic component, the number of layers increases and a distance between electrodes decreases, whereby capacitance may increase.

Abstract translation: 提供了一种用于陶瓷电子部件的多层薄膜及其制造方法。 多层薄膜包括基板; 以及交替地形成在所述基板的上表面和下表面中的至少一个上的陶瓷层和金属层，其中所述陶瓷层和所述金属层中的至少一个具有对应于多个 颗粒排列在平面上。 利用陶瓷电子部件的多层薄膜，层数增加，电极间距离减小，电容量增大。

公开(公告)号：US20140187687A1

公开(公告)日：2014-07-03

申请号：US14092339

申请日：2013-11-27

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Soo Young JI ,  Seung Hwan KIM ,  Suk Jin HAM

IPC: H05K1/03

CPC classification number: H05K1/0373 ,  H05K1/0353 ,  H05K2201/0141 ,  H05K2201/0251 ,  H05K2201/026

Abstract: A soluble liquid crystal thermosetting oligomer containing polysilsesquioxane (POSS) includes a structure in which the POSS is combined with a main chain of a soluble liquid crystal thermosetting oligomer, an insulation composition comprising the same, and a substrate comprising and insulation layer using the insulation composition.

Abstract translation: 含有聚倍半硅氧烷（POSS）的可溶性液晶热固性低聚物包括其中POSS与可溶性液晶热固性低聚物的主链组合的结构，包含该可溶性液晶热固性低聚物的绝缘组合物，以及使用该绝缘组合物的基材和绝缘层 。

公开(公告)号：US20140184782A1

公开(公告)日：2014-07-03

申请号：US14142714

申请日：2013-12-27

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Seung Wan WOO ,  Po Chul KIM ,  Young Nam HWANG ,  Kyung Ho LEE ,  Suk Jin HAM

IPC: H01L21/66 ,  H05K1/02

CPC classification number: H01L22/12 ,  G01B11/167 ,  G01B11/254 ,  G01B11/306 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Disclosed herein are a system for measuring a warpage and a method for measuring a warpage. The system for measuring a warpage includes: a heating plate portion heating the sample; and a reference gating portion disposed between the sample and the camera so as to be spaced apart from the sample by a predetermined distance, wherein the reference grating portion includes a plurality of wires that are each spaced apart from each other by a predetermined interval, thereby accurately measuring the warpage without being affected by the fume generated from the sample.

Abstract translation: 本文公开了一种用于测量翘曲的系统和用于测量翘曲的方法。 用于测量翘曲的系统包括：加热试样的加热板部分; 以及设置在样本和照相机之间以便与样本间隔开预定距离的参考门控部分，其中参考光栅部分包括彼此间隔开预定间隔的多条电线，从而 准确地测量翘曲而不受样品产生的烟雾影响。

公开(公告)号：US20140178814A1

公开(公告)日：2014-06-26

申请号：US13794099

申请日：2013-03-11

Applicant: SAMSUNG ELECTRO-MECHANICS CO. LTD.

Inventor： Hyo Jin YOON ,  Hye Jin CHO ,  Ji Eun JEON ,  Sung Hee LIM ,  Suk Jin HAM

IPC: G03F7/09

CPC classification number: G03F7/092 ,  G03F7/11

Abstract: There is provided a dry film photoresist including: a base film having an oxygen permeable barrier layer formed thereon; a photosensitive resin layer formed on the oxygen permeable barrier layer; and a protective film formed on the photosensitive resin layer. According to the present invention, the dry film photoresist includes the oxygen permeable barrier layer formed on the base film to prevent a curing reaction from being deteriorated by oxygen permeation in the dry film photoresist, such that residue that is not peeled off may be decreased, thereby significantly decreasing process defects.

Abstract translation: 提供了一种干膜光致抗蚀剂，包括：其上形成有氧可渗透阻挡层的基膜; 形成在透氧阻挡层上的感光性树脂层; 以及形成在感光性树脂层上的保护膜。 根据本发明，干膜光致抗蚀剂包括形成在基膜上的透氧阻挡层，以防止干膜光致抗蚀剂中的氧渗透导致固化反应劣化，使得未剥离的残留物可能降低， 从而显着降低工艺缺陷。

公开(公告)号：US20140152980A1

公开(公告)日：2014-06-05

申请号：US13772491

申请日：2013-02-21

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Gyu Seok KIM ,  Hee Suk CHUNG ,  Suk Jin HAM ,  Dong Yong KIM ,  Yong Choon PARK ,  Mi Yang KIM ,  Tae Yoon KIM

IPC: G01N1/28

CPC classification number: G01N1/28 ,  G01M99/002 ,  G01N3/60 ,  G01N2203/0023 ,  G01N2203/0282 ,  G01N2203/0647

Abstract: There are provided an inspection device for substrate deformation at high temperatures and an inspection method for substrate deformation at high temperatures, the inspection device for substrate deformation at high temperatures, including a crucible including an internal space, an inspection hole disposed in an upper portion thereof so as to inspect the internal space, and a heating unit heating the internal space, an indenter tip disposed in the crucible such that a substrate fixed to the internal space is warped, and an inspection unit disposed above the crucible so as to inspect a cross-section of the substrate.

Abstract translation: 在高温下设置基板变形检查装置和高温基板变形检查方法，高温基板变形检查装置，包括内部空间的坩埚，设置在其上部的检查孔 检查内部空间，加热单元加热内部空间，设置在坩埚中的压头，使得固定在内部空间的基板翘曲;以及检查单元，其设置在坩埚上方，以检查十字 切片的底物。

公开(公告)号：US20140133100A1

公开(公告)日：2014-05-15

申请号：US13750882

申请日：2013-01-25

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Shang Hoon SEO ,  Seung Hwan KIM ,  Suk Jin HAM

IPC: H05K7/20

CPC classification number: G01R31/2874

Abstract: There are provided an apparatus for testing a semiconductor device and a method for testing a semiconductor device. The apparatus for testing a semiconductor device includes: a temperature detection unit detecting a temperature of a semiconductor device to generate a detected temperature; a controller comparing the detected temperature with a preset control temperature to generate a comparison result, and determining whether to cool the semiconductor device according to the comparison result; and a cooling unit cooling the semiconductor device according to a control of the controller, wherein the controller resets the control temperature, when the detected temperature is outside of a range of an operational temperature of the semiconductor device.

Abstract translation: 提供了一种用于测试半导体器件的设备和用于测试半导体器件的方法。 用于测试半导体器件的装置包括：温度检测单元，其检测半导体器件的温度以产生检测温度; 控制器将检测到的温度与预设的控制温度进行比较以产生比较结果，以及根据比较结果确定是否冷却半导体器件; 以及冷却单元，其根据所述控制器的控制来冷却所述半导体器件，其中，当所述检测温度在所述半导体器件的工作温度的范围之外时，所述控制器复位所述控制温度。

公开(公告)号：US20140041206A1

公开(公告)日：2014-02-13

申请号：US13843640

申请日：2013-03-15

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hye Jin CHO ,  Hyo Jin YOON ,  Suk Jin HAM ,  Sung Hee LIM ,  Seong Chan PARK ,  Ji Eun JEON

IPC: H05K3/00

CPC classification number: H05K3/0094 ,  H05K3/225 ,  H05K3/4069 ,  H05K3/42 ,  H05K2203/121 ,  Y10T29/49004 ,  Y10T29/49124

Abstract: Disclosed herein is a method for repairing a via in which a dimple phenomenon occurs, in the case in which a dimple error occurs at the time of a process of forming the via used for electrically connecting between layers of a multi-layers circuit board. The method for repairing a via according to an exemplary embodiment of the present invention includes judging whether or not a dimple error occurs in a via; and repairing the via in which the dimple error occurs.

Abstract translation: 这里公开了在形成用于多层电路板的层之间的电连接的通孔的形成处理时发生凹坑错误的情况下，修复其中发生凹坑现象的通孔的方法。 根据本发明的示例性实施例的修复通孔的方法包括判断通孔中是否出现凹坑错误; 并修复出现凹坑错误的通孔。

公开(公告)号：US20150163924A1

公开(公告)日：2015-06-11

申请号：US14243431

申请日：2014-04-02

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hye Jin CHO ,  Hyo Jin YOON ,  Suk Jin HAM

IPC: H05K3/30 ,  H05K1/18

CPC classification number: H05K3/305 ,  H05K1/0269 ,  H05K2203/161 ,  H05K2203/166 ,  Y02P70/613

Abstract: Embodiments of the invention provide a method and device for bonding an electronic component with improved adhesive force. In accordance with at least one embodiment, the method includes preparing a printed circuit board, coating an optical alignment polymer on a bonding region of the printed circuit board, for bonding the electronic component, aligning the optical alignment polymer by irradiating the printed circuit board with UV, coating an adhesive agent on the optical alignment polymer, and mounting the electronic component on the adhesive agent.

Abstract translation: 本发明的实施例提供一种用于以改进的粘合力粘合电子部件的方法和装置。 根据至少一个实施方案，该方法包括制备印刷电路板，在印刷电路板的接合区域上涂布光学取向聚合物，用于粘结电子部件，通过将印刷电路板与 UV，在光学取向聚合物上涂覆粘合剂，并将电子部件安装在粘合剂上。