LIGHT DEFLECTOR AND LIGHT OUTPUT DEVICE INCLUDING THE SAME

    公开(公告)号:US20210157212A1

    公开(公告)日:2021-05-27

    申请号:US17167872

    申请日:2021-02-04

    Abstract: Provided are a light deflector and a light output device including the light deflector, the light deflector including a first electrode layer and a second electrode layer that are spaced apart from each other and facing each other, and a deflection layer configured to deflect incident light thereon based on a voltage applied to the first electrode layer and the second electrode layer, wherein the first electrode layer includes a plurality of electrode elements that are spaced apart from each other, and a resistor that is in contact with at least part of the plurality of electrode elements and in which a voltage drop is generated.

    THERMAL IMAGING PIXEL, THERMAL IMAGING SENSOR, AND BOLOMETER

    公开(公告)号:US20240219240A1

    公开(公告)日:2024-07-04

    申请号:US18227488

    申请日:2023-07-28

    CPC classification number: G01J5/20 G01J2005/0077

    Abstract: A thermal imaging pixel, including a variable resistor array; and a pixel readout circuit configured to read electrical signals corresponding to a composite resistance of the variable resistor array, wherein the variable resistor array includes a plurality of variable resistor subarrays electrically connected in series, wherein each variable resistor subarray of the plurality of variable resistor subarrays includes a plurality of variable resistor cells electrically connected in parallel, and wherein each variable resistor cell of the plurality of variable resistor cells has a resistance which changes according to temperature.

    HYBRID BONDING STRUCTURES AND SEMICONDUCTOR DEVICES INCLUDING THE SAME

    公开(公告)号:US20220077100A1

    公开(公告)日:2022-03-10

    申请号:US17467973

    申请日:2021-09-07

    Abstract: A hybrid bonding structure and a semiconductor including the hybrid bonding structure are provided. The hybrid bonding structure includes a solder ball and a solder paste bonded to the solder ball. The solder paste may include solder particles including at least one of In, Zn, SnBiAg alloy, or SnBi alloy, and ceramic particles. The solder paste may include a flux. The solder particles may include Sn(42.0 wt %)-Ag(0.4 wt %)-Bi(57.5−X) wt %, and the ceramic particles include CeO2(X) wt %, where 0.05≤X≤0.1.

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