公开(公告)号：US20180366468A1

公开(公告)日：2018-12-20

申请号：US16110658

申请日：2018-08-23

申请人： Samsung Electronics Co., Ltd.

发明人： Jonghyuk PARK ,  Byoungho Kwon ,  Inho Kim ,  Hyesung Park ,  Jin-Woo Bae ,  Yanghee Lee ,  Inseak Hwang

IPC分类号： H01L27/108 ,  H01L21/66

CPC分类号： H01L27/10855 ,  H01L22/32 ,  H01L22/34 ,  H01L27/10814 ,  H01L27/10817 ,  H01L27/10876 ,  H01L27/10894

摘要： Provided are a semiconductor device and a method of fabricating the same. The semiconductor device may include a semiconductor substrate including a first region and a second region, a dummy separation pattern provided on the second region of the semiconductor substrate to have a recessed region at its upper portion, a first electrode provided on the first region of the semiconductor substrate, a dielectric layer covering the first electrode, a second electrode provided on the dielectric layer, and a remaining electrode pattern provided in the recessed region. The second electrode and the remaining electrode pattern may be formed of a same material.

公开(公告)号：US20240278383A1

公开(公告)日：2024-08-22

申请号：US18418868

申请日：2024-01-22

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Hwiyoung Jeong ,  Byoungho Kwon ,  Dongchan Kim

IPC分类号： B24B53/017 ,  B24B37/04 ,  H01L21/306

CPC分类号： B24B53/017 ,  B24B37/044 ,  H01L21/30625

摘要： The inventive concept provides a chemical mechanical polishing apparatus including a polishing pad providing a flat main surface to which a slurry liquid having polishing particles is supplied and a conditioning disk on the main surface of the polishing pad. The conditioning disk can include a plurality of diamond particles that are positioned on a surface of the conditioning disk facing the main surface of the polishing pad, and wherein the plurality of diamond particles are terminated with specific elements on surfaces thereof, and a polarity of a zeta potential on the surface of the diamond particles is the same as that of a zeta potential on the polishing particles of the slurry liquid.

公开(公告)号：US11964357B2

公开(公告)日：2024-04-23

申请号：US17857289

申请日：2022-07-05

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Seungchul Han ,  Yonghee Lee ,  Taemin Earmme ,  Byoungho Kwon ,  Kuntack Lee

IPC分类号： B24B37/005 ,  B24B37/20

CPC分类号： B24B37/005 ,  B24B37/20

摘要： A conditioner of a chemical mechanical polishing (CMP) apparatus includes a disk to polish a polishing pad of the CMP apparatus, a driver to rotate the disk, a lifter to lift the driver, an arm to rotate the lifter, and a connector to connect the driver to the lifter, the driver being tiltable with respect to the lifter.

公开(公告)号：US11654458B2

公开(公告)日：2023-05-23

申请号：US17081855

申请日：2020-10-27

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Yonghee Lee ,  Byoungho Kwon ,  Kuntack Lee

IPC分类号： B08B1/00 ,  B08B13/00 ,  B08B1/04 ,  A46B13/00 ,  A46B13/02 ,  B08B3/04 ,  B24B7/22 ,  B24B37/04 ,  B24B37/00 ,  B24B7/00

CPC分类号： B08B1/002 ,  A46B13/001 ,  A46B13/02 ,  B08B1/04 ,  B08B3/04 ,  B08B13/00 ,  A46B2200/30 ,  B24B7/00 ,  B24B7/22 ,  B24B37/00 ,  B24B37/04

摘要： A substrate-cleaning apparatus may include a tilting arm to which a roll brush and a motor are coupled, a support arm positioned on the tilting arm, a first spring and a second spring coupling the tilting arm to the support arm, a first air bag and a second air bag mounted between the tilting arm and the support arm, and a controller configured to adjust an internal pressure of each of the first air bag and the second air bag. The controller may adjust a difference in internal pressure between the first air bag and the second air bag to control the inclination of the roll brush, and may adjust the internal pressure of each of the first air bag and the second air bag to move the roll brush vertically.

公开(公告)号：US11590628B2

公开(公告)日：2023-02-28

申请号：US16747034

申请日：2020-01-20

申请人： Samsung Electronics Co., Ltd.

发明人： Yonghee Lee ,  Yungjun Kim ,  Hyunjoon Park ,  Taemin Earmme ,  Seungchul Han ,  Byoungho Kwon ,  Kuntack Lee

IPC分类号： B24B37/20 ,  B24B37/005 ,  B24B37/30

摘要： A chemical mechanical polishing apparatus includes a fixing portion; and a rotary body module including a rotating shaft rotatably installed on the fixing portion, a first rotating unit connected to the rotating shaft and on which a wafer is mounted, and a second rotating unit disposed around the first rotating unit and on which a retainer ring is mounted, wherein the fixing portion comprises a first driving member disposed above the first rotating unit and a second driving member disposed above the second rotating unit, wherein the first and second driving members are comprised of a magnet or an electromagnet, wherein a first magnet, disposed opposite to the first driving member, is provided in the first rotating unit, and a second magnet, disposed opposite to the second driving member, is provided in the second rotating unit, and wherein the first rotating unit and the second rotating unit are independently tilted.

公开(公告)号：US10777560B2

公开(公告)日：2020-09-15

申请号：US16833914

申请日：2020-03-30

申请人： Samsung Electronics Co., Ltd.

发明人： Jonghyuk Park ,  Byoungho Kwon ,  Inho Kim ,  Hyesung Park ,  Jin-Woo Bae ,  Yanghee Lee ,  Inseak Hwang

IPC分类号： H01L27/108 ,  H01L21/66

摘要： Provided are a semiconductor device and a method of fabricating the same. The semiconductor device may include a semiconductor substrate including a first region and a second region, a dummy separation pattern provided on the second region of the semiconductor substrate to have a recessed region at its upper portion, a first electrode provided on the first region of the semiconductor substrate, a dielectric layer covering the first electrode, a second electrode provided on the dielectric layer, and a remaining electrode pattern provided in the recessed region. The second electrode and the remaining electrode pattern may be formed of a same material.

公开(公告)号：US10748906B2

公开(公告)日：2020-08-18

申请号：US16110658

申请日：2018-08-23

申请人： Samsung Electronics Co., Ltd.

发明人： Jonghyuk Park ,  Byoungho Kwon ,  Inho Kim ,  Hyesung Park ,  Jin-Woo Bae ,  Yanghee Lee ,  Inseak Hwang

IPC分类号： H01L27/108 ,  H01L21/66

摘要： Provided are a semiconductor device and a method of fabricating the same. The semiconductor device may include a semiconductor substrate including a first region and a second region, a dummy separation pattern provided on the second region of the semiconductor substrate to have a recessed region at its upper portion, a first electrode provided on the first region of the semiconductor substrate, a dielectric layer covering the first electrode, a second electrode provided on the dielectric layer, and a remaining electrode pattern provided in the recessed region. The second electrode and the remaining electrode pattern may be formed of a same material.

公开(公告)号：US10177160B2

公开(公告)日：2019-01-08

申请号：US15661280

申请日：2017-07-27

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Youngbeom Pyon ,  Kichul Park ,  Inkwon Kim ,  Ki Hoon Jang ,  Byoungho Kwon ,  Sangkyun Kim ,  Boun Yoon

IPC分类号： H01L21/00 ,  H01L23/528 ,  H01L27/112 ,  H01L23/535 ,  H01L27/11551 ,  H01L27/11578 ,  H01L21/768 ,  H01L21/02 ,  H01L23/538

摘要： A semiconductor device includes a substrate, a peripheral structure, a lower insulating layer, and a stack. The substrate includes a peripheral circuit region and a cell array region. The peripheral structure is on the peripheral circuit region. The lower insulating layer covers the peripheral circuit region and the cell array region and has a protruding portion protruding from a flat portion. The stack is on the lower insulating layer and the cell array region, and includes upper conductive patterns and insulating patterns which are alternately and repeatedly stacked.