-
公开(公告)号：US11926695B2
公开(公告)日：2024-03-12
申请号：US16898761
申请日：2020-06-11
Applicant: Samsung Electronics Co., Ltd.
Inventor： Kyeong Pang , In Kim , Jonghoon Won , Mooho Lee , Hyejeong Lee , Songwon Hyun
IPC: C08G59/24 , C08G59/26 , C08G59/62 , C08L63/00 , C09D5/00 , C09D163/00 , C09K5/14 , H01L33/56 , H01L33/62 , H01L33/64
CPC classification number: C08G59/245 , C08G59/26 , C08G59/621 , C08L63/00 , C09D5/00 , C09D163/00 , C09K5/14 , H01L33/56 , H01L33/62 , H01L33/641
Abstract: A high-thermal conductive epoxy compound and a composition, a material for a semiconductor package, a molded product, an electric and electronic device, and a semiconductor package including the epoxy compound. The epoxy compound has a structure represented by Formula 1.
E1-M1p-L1x-M2q-L2y-M3r-L3z-A-L3z-M3r-L2y-M2q-L1x-M1p-E2 Formula 1
In Formula 1, M1, M2, M3, L1, L2, L3, A, E, p, q, r, x, y, and z are the same as defined in the detailed description.-
公开(公告)号：US10450458B2
公开(公告)日：2019-10-22
申请号：US15340001
申请日：2016-11-01
Applicant: Samsung Electronics Co., Ltd
Inventor： Moon Il Jung , In Kim , Kyeong Pang
IPC: C08L23/00 , C08L75/04 , B29C48/03 , B29B9/10 , B29C45/00 , C08L77/06 , C08L77/02 , G02B27/00 , G06F15/00 , C08G67/02 , B29C48/04 , B29C48/05 , B29C48/285 , B29K83/00 , B29K101/12 , B29L31/34
Abstract: The present disclosure relates to a polymer composition including eco-friendly materials, an electronic device and a method of manufacturing the same.The polymer composition according to an aspect of the present disclosure includes a thermoplastic resin at 30 to 70 parts by weight; an eco-friendly resin, including a bio-resin, at 1 to 50 parts by weight; and a silicone resin at 1 to 60 parts by weight based on the total weight of the polymer composition.
-
公开(公告)号：US10266696B2
公开(公告)日：2019-04-23
申请号：US15314293
申请日：2015-03-26
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： In Kim , Song Won Hyun , Seon Yeong Kim
Abstract: Provided are: a polymer composition, as an eco-friendly material, comprising a post consumer material (PCM) resin and a bio-based resin; a molded article; and a method for manufacturing the same. The polymer composition according to an embodiment comprises a thermoplastic resin containing polycarbonate, a post consumer material (PCM) resin, a bio-based resin, and a core-shell type elastomer.
-
公开(公告)号：US09982121B2
公开(公告)日：2018-05-29
申请号：US15357166
申请日：2016-11-21
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Won Cheol Jung , In Ki Kim , Moo Ho Lee , Ginam Kim , In Kim
Abstract: A composite includes a cross-linked polymer including a pyridinium group and a thermoplastic polymer, and an article that includes the composite.
-
公开(公告)号：US09734930B2
公开(公告)日：2017-08-15
申请号：US14489005
申请日：2014-09-17
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： In Kim , Kyeong Pang , Song Won Hyun
CPC classification number: H01B1/24 , C08K3/04 , C08K3/041 , C08K3/40 , C08L33/20 , C08L55/02 , C08L67/00 , C08L69/00 , G02F1/1333 , Y10T428/31507 , Y10T428/31786
Abstract: Disclosed are a conductive resin composition and a display device using the same. The display device includes a display panel, and a frame having conductivity, in which the display panel is mounted, wherein the frame is formed of a conductive resin composition and the conductive resin composition includes a resin including a polyester copolymer resin, and carbon nanotube (CNT). The conductive resin composition prevents static discharge due to electrical conductivity and improves production efficiency though simplification of the overall manufacturing process. In addition, the conductive resin composition is applicable to thin film molding due to improved moldability and self-extinguishes flames due to flame retardancy.
-
Patent Agency Ranking
公开(公告)号：US11901499B2
公开(公告)日：2024-02-13
申请号：US16851617
申请日：2020-04-17
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Song Won Hyun , In Kim , Kyeong Pang , Moo Ho Lee , Hye Jeong Lee , In Su Lee
IPC: H01M10/0525 , H01M50/24 , H01M50/55 , H01M50/553 , H01M50/122 , H01M50/117 , H01M50/131 , H01M50/141 , H01M50/16 , H01M50/157 , H01M50/162 , H01M50/121
CPC classification number: H01M10/0525 , H01M50/117 , H01M50/121 , H01M50/122 , H01M50/131 , H01M50/141 , H01M50/157 , H01M50/16 , H01M50/162 , H01M50/24 , H01M50/55 , H01M50/553 , H01M2220/20
Abstract: A composite including a polymer matrix; an inorganic moisture absorber; a ceramic filler, graphite, or a combination thereof; and a tracking resistance polymer, wherein the tracking resistance polymer includes an average bond energy between an atom forming a main chain and another atom covalently bonded to the atom that forms the main chain of about 350 kJ/mol to about 500 kJ/mol; a carbonaceous residue yield after pyrolysis of less than or equal to about 5 weight percent, based on the amount of the tracking resistance polymer before pyrolysis; or a combination thereof.
-
公开(公告)号：US11827742B2
公开(公告)日：2023-11-28
申请号：US17404480
申请日：2021-08-17
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jonghoon Won , Dahye Park , Kyeong Pang , In Kim
CPC classification number: C08G59/26 , C08G59/063 , C08G59/621 , C08L63/00 , C08G2190/00 , C08L2203/206
Abstract: An epoxy compound including a 5-membered aromatic heterocyclic ring represented by Formula 1 or Formula 2, a composition prepared using the epoxy compound, a semiconductor device prepared using the epoxy compound, an electronic device prepared using the epoxy compound, an article prepared using the epoxy compound, and a method of preparing the article:
E1-(M1)a1-(L1)b1-M3-(L2)b2-(M2)a2-E2 Formula 1
E1-(M1)a1-(L1)b1-M3-(L2)b2-(M2)a2-(L5)b5-A-(L6)b6-(M4)a3-(L3)b3-M6-(L4)b4-(M5)a4-E2 Formula 2
wherein in Formulae 1 and 2, M1, M2, M3, M4, M5, M6, L1, L2, L3, L4, L5, L6, E1, E2, a1, a2, a3, a4, b1, b2, b3, b4, b5, and b6 are the same as those defined in the detailed description.-
公开(公告)号：US11094982B2
公开(公告)日：2021-08-17
申请号：US16298229
申请日：2019-03-11
Applicant: Samsung Electronics Co., Ltd.
Inventor： Moo Ho Lee , Moon Il Jung , In Kim , In Su Lee , Junghoon Lee , Hye Jeong Lee , Song Won Hyun
IPC: H01M50/116 , H01M10/0525 , B32B27/08 , B32B27/32 , H01M50/20 , H01M50/24 , H01M50/155 , H01M50/166
Abstract: A battery case including a container configured to house an electrode assembly, wherein the container includes a bottom wall and a plurality of side walls, the bottom wall and the side walls integrated to define a space for housing the electrode assembly and an open side opposed to the bottom wall, the container includes a composite including a polymer matrix, an inorganic moisture absorbent dispersed in the base polymer, and a compatibilizer to promote compatibility between the polymer matrix and the inorganic moisture absorbent, the compatibilizer is included in an amount of less than about 3 wt % based on a total weight of the composite, at least one of the bottom wall and the side walls at a thickness of 1 millimeter has a water vapor transmission rate of less than about 0.07 g/m2/day, when measured at 38° C. and a relative humidity of 100%.
-
公开(公告)号：US11088357B2
公开(公告)日：2021-08-10
申请号：US16217126
申请日：2018-12-12
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Moon Il Jung , Song Won Hyun , In Kim , Moo Ho Lee , In Su Lee , Junghoon Lee , Hye Jeong Lee , Ginam Kim
IPC: H01M2/28 , H01M2/02 , H01M10/058 , H01M2/06 , H01M2/04 , H01M10/0525 , H01M10/52
Abstract: A battery case including: a container configured to house an electrode assembly, wherein the container includes a bottom wall and a plurality of side walls, the bottom wall and the plurality of side walls are integrated to define a space for housing the electrode assembly and to provide a top opening opposite the bottom wall, the container includes a polymeric composition including a polymer and an inorganic moisture absorbent dispersed in the polymer, and the battery case has a water vapor transmission rate (WVTR) of less than about 0.05 grams per square meter per day, when measured at 38° C. and a relative humidity of 100% according to ISO 15106 or ASTM F1249.
-
公开(公告)号：US20210147612A1
公开(公告)日：2021-05-20
申请号：US16898761
申请日：2020-06-11
Applicant: Samsung Electronics Co., Ltd.
Inventor： Kyeong Pang , In Kim , Jonghoon Won , Mooho Lee , Hyejeong Lee , Songwon Hyun
IPC: C08G59/24 , C08G59/26 , C08G59/62 , C08L63/00 , C09D163/00 , C09D5/00 , C09K5/14 , H01L33/56 , H01L33/62 , H01L33/64
Abstract: A high-thermal conductive epoxy compound and a composition, a material for a semiconductor package, a molded product, an electric and electronic device, and a semiconductor package including the epoxy compound. The epoxy compound has a structure represented by Formula 1. E1-M1p-L1x-M2q-L2y-M3r-L3z-A-L3z-M3r-L2y-M2q-L1x-M1p-E2 Formula 1 In Formula 1, M1, M2, M3, L1, L2, L3, A, E, p, q, r, x, y, and z are the same as defined in the detailed description.
-
-
-
-
-
-
-
-
-
Search Results
20
records
(took 0.019 seconds)
