PROCESS CONTROL METHOD AND PROCESS CONTROL SYSTEM FOR MANUFACTURING SEMICONDUCTOR DEVICE

    公开(公告)号:US20190115527A1

    公开(公告)日:2019-04-18

    申请号:US16107242

    申请日:2018-08-21

    Abstract: Provided are process control methods and process control systems. The method includes performing a deposition process on a lot defined by a group of a plurality of wafers, performing a measurement process on the lot to obtain a measured value with respect to at least one wafer among the plurality of wafers, producing a target value of a factor of a process condition in the deposition process by using a difference between the measured value and a reference value, and providing an input value of the factor with respect to a subsequent lot based on the target value. The operation of providing the input value of the factor includes obtaining a previous target value of the factor previously produced with respect to at least one previous lot, and providing a weighted average of the previous target value and the target value as the input value.

    Memory devices and methods of manufacturing the same
    12.
    发明授权
    Memory devices and methods of manufacturing the same 有权
    存储器件及其制造方法

    公开(公告)号:US09184376B2

    公开(公告)日:2015-11-10

    申请号:US14315610

    申请日:2014-06-26

    CPC classification number: H01L43/10 G11C11/161 H01L43/08

    Abstract: A magnetic memory device may include a substrate and a magnetic tunnel junction memory element on the substrate. The magnetic tunnel junction memory element may include a reference magnetic layer, a tunnel barrier layer, and a free magnetic layer. The reference magnetic layer may include a first pinned layer, an exchange coupling layer, and a second pinned layer. The exchange coupling layer may be between the first and second pinned layers, and the second pinned layer may include a ferromagnetic layer and a non-magnetic layer. The second pinned layer may be between the first pinned layer and the tunnel barrier layer, and the tunnel barrier layer may be between the reference magnetic layer and the free magnetic layer.

    Abstract translation: 磁存储器件可以在衬底上包括衬底和磁性隧道结存储元件。 磁性隧道结存储元件可以包括参考磁性层,隧道势垒层和自由磁性层。 参考磁性层可以包括第一固定层,交换耦合层和第二固定层。 交换耦合层可以在第一和第二被钉扎层之间,并且第二被钉扎层可以包括铁磁层和非磁性层。 第二被钉扎层可以在第一被钉扎层和隧道势垒层之间,并且隧道势垒层可以在参考磁性层和自由磁性层之间。

    Magnetic memory devices
    14.
    发明授权

    公开(公告)号:US10862025B2

    公开(公告)日:2020-12-08

    申请号:US16434478

    申请日:2019-06-07

    Abstract: A magnetic memory device includes a first magnetic tunnel junction pattern on a substrate, a second magnetic tunnel junction pattern on the first magnetic tunnel junction pattern, and a conductive line between the first magnetic tunnel junction pattern and the second magnetic tunnel junction pattern. The conductive line is configured such that a current flowing through the conductive line flows in parallel to an interface between the conductive line and each of the first and second magnetic tunnel junction patterns.

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