PROCESS CONTROL METHOD AND PROCESS CONTROL SYSTEM FOR MANUFACTURING SEMICONDUCTOR DEVICE

    公开(公告)号:US20190115527A1

    公开(公告)日:2019-04-18

    申请号:US16107242

    申请日:2018-08-21

    摘要: Provided are process control methods and process control systems. The method includes performing a deposition process on a lot defined by a group of a plurality of wafers, performing a measurement process on the lot to obtain a measured value with respect to at least one wafer among the plurality of wafers, producing a target value of a factor of a process condition in the deposition process by using a difference between the measured value and a reference value, and providing an input value of the factor with respect to a subsequent lot based on the target value. The operation of providing the input value of the factor includes obtaining a previous target value of the factor previously produced with respect to at least one previous lot, and providing a weighted average of the previous target value and the target value as the input value.

    Magnetic memory devices
    2.
    发明授权

    公开(公告)号:US10862025B2

    公开(公告)日:2020-12-08

    申请号:US16434478

    申请日:2019-06-07

    摘要: A magnetic memory device includes a first magnetic tunnel junction pattern on a substrate, a second magnetic tunnel junction pattern on the first magnetic tunnel junction pattern, and a conductive line between the first magnetic tunnel junction pattern and the second magnetic tunnel junction pattern. The conductive line is configured such that a current flowing through the conductive line flows in parallel to an interface between the conductive line and each of the first and second magnetic tunnel junction patterns.

    MAGNETIC MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME

    公开(公告)号:US20170092848A1

    公开(公告)日:2017-03-30

    申请号:US15210627

    申请日:2016-07-14

    IPC分类号: H01L43/08 H01L43/10 H01L43/02

    CPC分类号: H01L43/08 H01L43/10

    摘要: A magnetic memory device includes a magnetic tunnel junction pattern including a first free layer, a pinned layer, and a tunnel barrier layer between the first free layer and the pinned layer. The first free layer includes a first free magnetic pattern having a first surface in direct contact with the tunnel barrier layer and a second surface opposite to the first surface, and a second free magnetic pattern in contact with the second surface. The second free magnetic pattern includes iron-nickel (FeNi), and a nickel content of the second free magnetic pattern ranges from about 10 at % to about 30 at %.