Semiconductor memory devices
    11.
    发明授权

    公开(公告)号:US12066893B2

    公开(公告)日:2024-08-20

    申请号:US18226622

    申请日:2023-07-26

    CPC classification number: G06F11/1068

    Abstract: A semiconductor memory device includes a memory cell array, a link error correction code (ECC) engine and on-die ECC engine. The memory cell array includes a plurality of volatile memory cells. The link ECC engine provides a main data by performing a first ECC decoding on a first codeword including the main data and a first parity data, and generates a first error flag based on a result of the first ECC decoding. The on-die ECC engine generates a second parity data by performing a first ECC encoding on the main data, provides a target page of the memory cell array with a second codeword including the main data and the second parity data in response to the first error flag being deactivated or generates a third codeword by changing at least one of bits of the second codeword in response to the first error flag being deactivated.

    Semiconductor memory devices
    13.
    发明授权

    公开(公告)号:US11762736B2

    公开(公告)日:2023-09-19

    申请号:US17580048

    申请日:2022-01-20

    CPC classification number: G06F11/1068

    Abstract: A semiconductor memory device includes a memory cell array, a link error correction code (ECC) engine and on-die ECC engine. The memory cell array includes a plurality of volatile memory cells. The link ECC engine provides a main data by performing a first ECC decoding on a first codeword including the main data and a first parity data, and generates a first error flag based on a result of the first ECC decoding. The on-die ECC engine generates a second parity data by performing a first ECC encoding on the main data, provides a target page of the memory cell array with a second codeword including the main data and the second parity data in response to the first error flag being deactivated or generates a third codeword by changing at least one of bits of the second codeword in response to the first error flag being deactivated.

    SEMICONDUCTOR MEMORY DEVICES
    15.
    发明申请

    公开(公告)号:US20220374309A1

    公开(公告)日:2022-11-24

    申请号:US17580048

    申请日:2022-01-20

    Abstract: A semiconductor memory device includes a memory cell array, a link error correction code (ECC) engine and on-die ECC engine. The memory cell array includes a plurality of volatile memory cells. The link ECC engine provides a main data by performing a first ECC decoding on a first coedword including the main data and a first parity data, and generates a first error flag based on a result of the first ECC decoding. The on-die ECC engine generates a second parity data by performing a first ECC encoding on the main data, provides a target page of the memory cell array with a second codeword including the main data and the second parity data in response to the first error flag being deactivated or generates a third codeword by changing at least one of bits of the second codeword in response to the first error flag being deactivated.

    Memory controllers and memory systems including the same

    公开(公告)号:US11463110B2

    公开(公告)日:2022-10-04

    申请号:US16987554

    申请日:2020-08-07

    Abstract: A memory controller includes an error correction circuit and a central processing unit (CPU) to control the error correction circuit. The error correction circuit includes an error correction code (ECC) decoder and a memory to store a parity check matrix. The ECC decoder performs an ECC decoding on a codeword read from the memory module to: (i) generate a first syndrome and a second syndrome, (ii) generate a decoding mode flag associated with a type of errors in the codeword based on the second syndrome and a decision syndrome, (iii) operate in one of a first decoding mode and a second decoding mode based on the decoding mode flag, and (iv) selectively correct one of a chip error associated with one of the data chips and one or more symbol errors in the codeword.

    SEMICONDUCTOR MEMORY DEVICE AND OPERATING METHOD THEREOF

    公开(公告)号:US20250036521A1

    公开(公告)日:2025-01-30

    申请号:US18770435

    申请日:2024-07-11

    Abstract: An example CXL (Compute eXpress Link)-based memory module includes a memory device and a controller. The memory device includes a plurality of volatile memory cells and stores data or reads the stored data. The controller communicates with a host device through a CXL interface and controls the memory device. The controller includes an error correction code (ECC) circuit that generates a first codeword by adding a parity vector generated based on Reed-Solomon encoding to data received from the host device, an error injecting circuit that generates an error symbol and generates a second codeword by injecting the error symbol into at least a portion of the first codeword, and a memory device interface that controls the memory device such that the second codeword where the error symbol is injected is stored in the memory device. The controller determines a number of error symbols to be injected into the second codeword.

    Semiconductor memory devices and memory systems

    公开(公告)号:US11860734B2

    公开(公告)日:2024-01-02

    申请号:US17736154

    申请日:2022-05-04

    CPC classification number: G06F11/1068 G06F11/0772 G06F11/1048 H03M13/1108

    Abstract: A semiconductor memory device includes a memory cell array, an on-die error correction code (ECC) engine, and a control logic circuit. The on-die ECC engine, based on an ECC, in a write operation, performs an ECC encoding on main data to generate first parity data, selectively replaces a portion of the first parity data with a poison flag to generate second parity data based on a poison mode signal, provides the main data to a normal cell region in a target page of the memory cell array, and provides the first parity data to a parity cell region in the target page or provides the poison flag and the second parity data to the parity cell region. The control logic circuit controls the on-die ECC engine and generates the poison mode signal, based on a command and an address from a memory controller.

    Semiconductor memory devices and methods of operating semiconductor memory devices

    公开(公告)号:US11829614B2

    公开(公告)日:2023-11-28

    申请号:US17842981

    申请日:2022-06-17

    CPC classification number: G06F3/0626 G06F3/064 G06F3/0679 G06F11/1068

    Abstract: A semiconductor memory device includes a buffer die and a plurality of memory dies. An error correction code (ECC) engine in one of the memory dies performs an RS encoding on a main data to generate a parity data and performs a RS decoding, using a parity check matrix, on the main data and the parity data. The parity check matrix includes sub matrixes and each of the sub matrixes corresponds to two different symbols. Each of the sub matrixes includes two identity sub matrixes and two same alpha matrixes, the two identity sub matrixes are disposed in a first diagonal direction of the sub matrix and the two same alpha matrixes are disposed in a second diagonal direction. A number of high-level value elements in a y-th row of the parity check matrix is the same as a number of high-level value elements in a (y+p)-th row.

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