公开(公告)号：US11037913B2

公开(公告)日：2021-06-15

申请号：US16854971

申请日：2020-04-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yunhyeok Im ,  Kyoung-Min Lee ,  Kyungsoo Lee ,  Horang Jang

IPC: H01L25/10 ,  H01L23/367 ,  H01L23/498 ,  H01L23/42 ,  H01L23/552 ,  H01L23/538 ,  H01L23/00

Abstract: A semiconductor package includes a bottom package having a lower substrate and a lower semiconductor chip mounted on the lower substrate, an interposer substrate on the bottom package, a first top package and a second top package that are mounted on the interposer substrate, and a heat spreader that is interposed between the first top package and the second top package and separates the first and second top packages from each other. The heat spreader is adhered to the interposer substrate through a plurality of first connection terminals.

公开(公告)号：US09029998B2

公开(公告)日：2015-05-12

申请号：US14243165

申请日：2014-04-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Eon Soo Jang ,  Kyol Park ,  Yunhyeok Im

IPC: H01L23/02 ,  H01L23/34 ,  H01L23/12 ,  H01L23/31 ,  H01L25/10 ,  H01L23/00 ,  H01L25/065

CPC classification number: H01L23/34 ,  H01L23/12 ,  H01L23/3128 ,  H01L23/42 ,  H01L23/49811 ,  H01L23/5389 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/29194 ,  H01L2224/2929 ,  H01L2224/29309 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1076 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/1431 ,  H01L2924/1433 ,  H01L2924/1436 ,  H01L2924/1438 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor package device includes a lower package including a lower semiconductor chip mounted on the lower package substrate, a lower molding compound layer disposed on the lower package substrate, a first trench formed in the lower molding compound layer to surround the lower semiconductor chip, and a second trench connected to the first trench to extend to an outer wall of the lower package, the second trench being formed in the lower molding compound layer, an upper package disposed on the lower package. The upper package includes an upper package substrate and at least one upper semiconductor chip mounted on the upper package substrate and a heat transfer member disposed between the lower package and the upper package.

Abstract translation: 半导体封装器件包括下封装，其包括安装在下封装基板上的下半导体芯片，设置在下封装基板上的下模塑复合层，形成在下模塑复合层中以围绕下半导体芯片的第一沟槽，以及 连接到所述第一沟槽以延伸到所述下封装的外壁的第二沟槽，所述第二沟槽形成在所述下模塑复合层中，所述上封装设置在所述下封装上。 上封装包括上封装基板和安装在上封装基板上的至少一个上半导体芯片和设置在下封装和上封装之间的传热构件。

公开(公告)号：US20230290701A1

公开(公告)日：2023-09-14

申请号：US18052187

申请日：2022-11-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yunhyeok Im ,  Youngsang Cho

IPC: H01L23/367 ,  H01L23/31 ,  H01L23/373 ,  H01L23/498

CPC classification number: H01L23/367 ,  H01L23/3128 ,  H01L23/3736 ,  H01L23/49811 ,  H01L23/49822 ,  H01L24/16 ,  H01L2224/16227

Abstract: A semiconductor package includes a first substrate, a semiconductor chip disposed on the first substrate, a mold layer disposed on the first substrate and at least partially covering the semiconductor chip, and a heat dissipation structure disposed on a first top surface of the semiconductor chip and in the mold layer. The heat dissipation structure covers an inner side surface of the mold layer. A surface roughness of the first top surface of the semiconductor chip is greater than a surface roughness of a side surface of the semiconductor chip, and a surface roughness of the inner side surface of the mold layer is greater than a surface roughness of a top surface of the mold layer. The heat dissipation structure includes voids therein.

公开(公告)号：US11251102B2

公开(公告)日：2022-02-15

申请号：US17030092

申请日：2020-09-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yunhyeok Im ,  Youngsang Cho

IPC: H01L23/36 ,  H01L23/498 ,  H01L23/00

Abstract: A semiconductor module may include a substrate including a first region and a second region, a first chip mounted in the first region, a second chip and passive devices mounted in the second region, and a heat dissipation layer being in contact with a top surface of the first chip. The heat dissipation layer may be provided on top surfaces and side surfaces of the first chip, the second chip and the passive devices.