ELECTRONIC DEVICE INCLUDING SPEAKER MODULE
    12.
    发明公开

    公开(公告)号:US20230143417A1

    公开(公告)日:2023-05-11

    申请号:US17980940

    申请日:2022-11-04

    CPC classification number: H04R1/288 H04R1/2857 H04R2499/11

    Abstract: An electronic device is provided. The electronic device includes: a housing at least partially surrounding a space between a front surface and a rear surface of the electronic device, and including a side structure through which a speaker hole is formed; a speaker configured to emit a sound signal through the speaker hole; a vibration motor structure provided adjacent the speaker, and including a plurality of side surfaces, wherein a motor ventilation hole is formed through a first side surface of the plurality of side surfaces; an enclosure provided in the housing, and surrounding at least a portion of the speaker and at least a portion of the vibration motor structure; a sound absorbing structure provided in the enclosure; and a protection structure provided in the enclosure, and overlapping at least a portion of the motor ventilation hole.

    SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME

    公开(公告)号:US20230009932A1

    公开(公告)日:2023-01-12

    申请号:US17838575

    申请日:2022-06-13

    Abstract: A semiconductor device including a substrate including first, second, and third regions; a peripheral circuit structure on the substrate and including a peripheral circuit and wiring layers connected to the peripheral circuit; a common source plate on the peripheral circuit structure and extending in a horizontal direction; gate electrodes on the common source plate on the first and second regions, spaced apart from each other in a first direction perpendicular to an upper surface of the substrate, the gate electrodes having a stair shape on the second region; a channel structure extending in the first direction through the gate electrodes on the first region; a first conductive through-via penetrating the common source plate on the third region and electrically connected to the wiring layers; and a dummy insulating pillar adjacent to the first conductive through-via on the third region and connected to an upper surface of the common source plate.

    SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

    公开(公告)号:US20250081559A1

    公开(公告)日:2025-03-06

    申请号:US18624201

    申请日:2024-04-02

    Abstract: A semiconductor device includes a substrate including an active pattern, a channel pattern including a first semiconductor pattern and a second semiconductor pattern, a source/drain pattern connected to the first and second semiconductor patterns, and a gate electrode including an electrode between the first and second semiconductor patterns, and an insulating layer between the first and second semiconductor patterns and the electrode. The insulating layer includes a dielectric layer enclosing the electrode and a spacer on the dielectric layer. The spacer includes a horizontal portion between the dielectric layer and the second semiconductor pattern, a vertical portion between the dielectric layer and the source/drain pattern, and a corner portion connecting the horizontal portion to the vertical portion. A first thickness of the horizontal portion is smaller than a second thickness of the vertical portion, and the second thickness is smaller than a third thickness of the corner portion.

Patent Agency Ranking