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公开(公告)号:US20240363675A1
公开(公告)日:2024-10-31
申请号:US18767003
申请日:2024-07-09
Applicant: SEOUL VIOSYS CO., LTD.
Inventor: Jong Hyeon CHAE , Seong Gyu JANG , Ho Joon LEE , Chang Yeon KIM , Chung Hoon LEE
IPC: H01L27/15 , H01L25/065 , H01L25/075 , H01L25/11 , H01L25/13 , H01L33/00 , H01L33/10 , H01L33/38 , H01L33/40 , H01L33/42 , H01L33/50 , H01L33/62 , H10K10/84 , H10K50/813 , H10K50/818 , H10K50/822 , H10K50/828 , H10K59/32 , H10K59/35
CPC classification number: H01L27/156 , H01L25/0756 , H01L25/13 , H01L33/0093 , H01L33/10 , H01L33/405 , H01L33/42 , H01L33/507 , H01L33/62 , H01L25/0655 , H01L25/0753 , H01L25/115 , H01L33/38 , H01L33/382 , H10K10/84 , H10K50/813 , H10K50/818 , H10K50/822 , H10K50/828 , H10K59/32 , H10K59/35
Abstract: A light emitting diode (LED) stack for a display including a first LED stack including a first conductivity-type semiconductor layer and a second conductivity-type semiconductor layer, a second LED stack disposed on the first LED stack, a third LED stack disposed on the second LED stack, an intermediate bonding layer disposed between the first LED stack and the second LED stack to bond the second LED stack to the first LED stack, an upper bonding layer disposed between the second LED stack and the third LED stack to couple the third LED stack to the second LED stack, and a first hydrophilic material layer disposed between the first LED stack and the upper bonding layer.
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公开(公告)号:US20240186300A1
公开(公告)日:2024-06-06
申请号:US18436942
申请日:2024-02-08
Applicant: SEOUL VIOSYS CO., LTD.
Inventor: Seong Gyu JANG , Ho Joon LEE , Jong Hyeon CHAE , Chung Hoon LEE
CPC classification number: H01L25/13 , H01L25/0756 , H01L33/38 , H01L33/405 , H01L33/505 , H01L33/0093 , H01L33/20 , H01L33/62
Abstract: A light emitting diode pixel for a display includes a first subpixel including a first LED sub-unit, a second subpixel including a second LED sub-unit, a third subpixel including a third LED sub-unit, and a bonding layer overlapping the first, second, and third subpixels, in which each of the first, second, and third LED sub-units includes a first type of semiconductor layer and a second type of semiconductor layer, each of the first, second, and third LED sub-units is disposed on a different plane, and light generated from the second subpixel is configured to be emitted to an outside of the light emitting diode pixel by passing through a lesser number of LED sub-units than light generated from the first subpixel and emitted to the outside.
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13.
公开(公告)号:US20240105686A1
公开(公告)日:2024-03-28
申请号:US18535545
申请日:2023-12-11
Applicant: Seoul Viosys Co., Ltd.
Inventor: Seong Kyu JANG , Seom Geun LEE , Chan Seob SHIN , Ho Joon LEE
IPC: H01L25/075 , H01L33/00 , H01L33/58 , H01L33/62
CPC classification number: H01L25/0753 , H01L33/0093 , H01L33/58 , H01L33/62 , H01L2933/0058 , H01L2933/0066
Abstract: A display panel including a circuit board having pads, light emitting devices electrically connected to the pads and arranged on the circuit board, each light emitting device having a first surface facing the circuit board and a second surface opposite to the first surface, a buffer material layer disposed between the circuit board and the light emitting devices to fill a space between the circuit board and the light emitting devices, and a cover layer covering the second surface of the light emitting devices, in which the buffer material layer is disposed under the first surfaces of the light emitting devices and has grooves in a region between adjacent light emitting devices, a portion of a top surface of the buffer material layer is disposed between adjacent light emitting devices, and the cover layer fills the grooves of the buffer material layer.
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公开(公告)号:US20220399399A1
公开(公告)日:2022-12-15
申请号:US17847105
申请日:2022-06-22
Applicant: SEOUL VIOSYS CO., LTD.
Inventor: Chung Hoon LEE , Jong Hyeon CHAE , Seong Gyu JANG , Ho Joon LEE
Abstract: A display device including a substrate, a light emitting stacked structure disposed on the substrate and including a plurality of epitaxial sub-units disposed one over another, a first adhesive layer bonding the epitaxial sub-units to the substrate; and a line part disposed on the substrate and configured to apply a light emitting signal to each of the epitaxial sub-units, in which the light emitting stacked structure is configured to provide light having various colors by a combination of light emitted from each of the epitaxial sub-units, the first adhesive layer includes a conductive and non-transparent material, and the substrate includes a non-transparent material.
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公开(公告)号:US20210351230A1
公开(公告)日:2021-11-11
申请号:US17366462
申请日:2021-07-02
Applicant: SEOUL VIOSYS CO., LTD.
Inventor: Jong Hyeon CHAE , Chung Hoon LEE , Seong Gyu JANG , Chang Yeon KIM , Ho Joon LEE
Abstract: A light emitting diode (LED) stack for a display including a substrate, a first LED stack disposed on the substrate, a second LED stack disposed on the first LED stack, a third LED stack disposed on the second LED stack, a first color filter interposed between the first LED stack and the second LED stack, and a second color filter interposed between the second LED stack and the third LED stack, in which the second LED stack and the third LED stack are configured to transmit light generated from the first LED stack to the outside, and the third LED stack is configured to transmit light generated from the second LED stack to the outside.
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16.
公开(公告)号:US20200343227A1
公开(公告)日:2020-10-29
申请号:US16855258
申请日:2020-04-22
Applicant: Seoul Viosys Co., Ltd
Inventor: Seong Kyu JANG , Seom Geun LEE , Chan Seob SHIN , Ho Joon LEE
IPC: H01L25/075 , H01L33/58 , H01L33/62 , H01L33/00
Abstract: A display panel including a circuit board having pads, light emitting devices electrically connected to the pads and arranged on the circuit board, each light emitting device having a first surface facing the circuit board, and a buffer material layer disposed between the circuit board and the light emitting devices to fill a space between the circuit board and the light emitting devices, in which the buffer material layer is disposed under the first surfaces of the light emitting devices
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公开(公告)号:US20200066691A1
公开(公告)日:2020-02-27
申请号:US16673184
申请日:2019-11-04
Applicant: SEOUL VIOSYS CO., LTD.
Inventor: Jong Hyeon CHAE , Chang Yeon KIM , Seong Gyu JANG , Ho Joon LEE , Jong Min JANG , Dae Sung CHO
IPC: H01L25/075 , H01L33/50 , H01L33/08 , H01L33/38
Abstract: A light emitting device for a display includes a pixel region including first, second, and third LED stacks, an adhesive layer disposed between the first and second LED stacks, or between the second and third LED stacks, a metal bonding layer at least partially surrounded by the adhesive layer, and disposed between and is electrically connected to the first and second LED stacks, or the second and third LED stacks, and a common electrode pad connected to the first, second, and third LED stacks, first, second, and third electrode pads connected to the first, second, and third LED stacks, respectively, and the first, second, and third LED stacks are configured to be independently driven using the electrode pads.
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公开(公告)号:US20250070100A1
公开(公告)日:2025-02-27
申请号:US18940305
申请日:2024-11-07
Applicant: Seoul Viosys Co., Ltd.
Inventor: Jong Hyeon CHAE , Chang Yeon KIM , Ho Joon LEE , Seong Gyu JANG , Chung Hoon LEE , Dae Sung CHO
Abstract: A light emitting device including a first LED sub-unit having a thickness in a first direction, a second LED sub-unit disposed on a portion of the first LED sub-unit in the first direction, each of the first and second LED sub-units comprising a first-type semiconductor layer, a second-type semiconductor layer, and an active layer, a reflective electrode disposed adjacent to the first LED sub-unit and electrically connected to the first-type semiconductor layer of the first LED sub-unit, and a first ohmic electrode forming ohmic contact with the second-type semiconductor layer of the first LED sub-unit, in which the active layer of the first LED sub-unit is configured to generate light, includes AlxGa(1-x-y)InyP (0≤x≤1, 0≤y≤1), and overlaps the active layer of the second LED sub-unit in the first direction, and the active layer of the second LED sub-unit includes the same material as the active layer of the first LED sub-unit.
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公开(公告)号:US20250048793A1
公开(公告)日:2025-02-06
申请号:US18924883
申请日:2024-10-23
Applicant: SEOUL VIOSYS CO., LTD.
Inventor: Seong Kyu JANG , Chan Seob SHIN , Seom Geun LEE , Ho Joon LEE
IPC: H01L33/24 , G02B27/01 , G06F1/16 , H01L25/075 , H01L33/62
Abstract: A method of fabricating a light emitting device for a display, the method including the steps of growing a first LED stack on a first growth substrate, the first LED stack including a first conductivity type semiconductor layer and a second conductivity type semiconductor layer, growing a second LED stack on a second growth substrate, the second LED stack including a first conductivity type semiconductor layer and a second conductivity type semiconductor layer, bonding the second LED stack to a first temporary substrate, removing the second growth substrate from the second LED stack, bonding the second LED stack to the first LED stack, and removing the first temporary substrate from the second LED stack.
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公开(公告)号:US20240297206A1
公开(公告)日:2024-09-05
申请号:US18645663
申请日:2024-04-25
Applicant: SEOUL VIOSYS CO., LTD.
Inventor: Jong Hyeon CHAE , Seong Gyu JANG , Ho Joon LEE , Chang Yeon KIM , Chung Hoon LEE
IPC: H01L27/15 , H01L25/065 , H01L25/075 , H01L25/11 , H01L25/13 , H01L33/00 , H01L33/10 , H01L33/38 , H01L33/40 , H01L33/42 , H01L33/50 , H01L33/62 , H10K10/84 , H10K50/813 , H10K50/818 , H10K50/822 , H10K50/828 , H10K59/32 , H10K59/35
CPC classification number: H01L27/156 , H01L25/0756 , H01L25/13 , H01L33/0093 , H01L33/10 , H01L33/405 , H01L33/42 , H01L33/507 , H01L33/62 , H01L25/0655 , H01L25/0753 , H01L25/115 , H01L33/38 , H01L33/382 , H10K10/84 , H10K50/813 , H10K50/818 , H10K50/822 , H10K50/828 , H10K59/32 , H10K59/35
Abstract: A light emitting diode (LED) stack for a display including a first LED stack including a first conductivity-type semiconductor layer and a second conductivity-type semiconductor layer, a second LED stack disposed on the first LED stack, a third LED stack disposed on the second LED stack, an intermediate bonding layer disposed between the first LED stack and the second LED stack to bond the second LED stack to the first LED stack, an upper bonding layer disposed between the second LED stack and the third LED stack to couple the third LED stack to the second LED stack, and a first hydrophilic material layer disposed between the first LED stack and the upper bonding layer.
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