摘要:
A method for manufacturing a wafer level package including: forming a redistribution line connected to a top surface of a die pad on a wafer with the die pad; additionally preparing a carrier film including a metal post with a concave central portion on one surface; bonding the metal post to a top surface of the redistribution line; molding a space between the metal posts with a molding resin; and removing the carrier film.
摘要:
The present invention relates to a wafer level camera module and a method of manufacturing the same and provides a wafer level camera module including a wafer provided with an image sensor on a top surface; a transparent member bonded to the wafer through anodic bonding to seal the image sensor; a spacer bonded to the transparent member through the anodic bonding by including a window to expose the image sensor; and a wafer lens bonded to the spacer through the anodic bonding to cover the window of the spacer and further a method of manufacturing the same.
摘要:
Disclosed herein is an optical image stabilizer, including: a substrate; a table disposed over the substrate, while levitating, to be movable on the substrate and having an image sensor mounted on the upper end of the substrate; cantilever arms disposed over the substrate, while levitating, and connected to the table to move the table; anchors fixing one ends of the cantilever arms onto the substrate; and electrodes applying voltage for moving the cantilever arm.
摘要:
The present invention provides an energy converting device, which includes: a base substrate; and a plurality of thermoelectric element structures which are sequentially stacked on the base substrate and electrically interconnected in parallel to one another.
摘要:
Disclosed herein is a method of inspecting defects in a circuit pattern of a substrate. At least one laser beam radiation unit for radiating a laser beam onto an inspection target circuit pattern of a substrate in a non-contact manner is prepared. A probe beam radiation unit for radiating a probe beam onto a connection circuit pattern to be electrically connected to the inspection target circuit pattern in a non-contact manner is prepared. The laser beam is radiated onto the inspection target circuit pattern using the laser beam radiation unit. The probe beam is radiated onto the connection circuit pattern using the probe beam radiation unit, thus measuring information about whether the probe beam is diffracted, and a diffraction angle. Accordingly, the method can solve problems such as erroneous measurements caused by contact pressure and can reduce the time required for measurements.
摘要:
Disclosed herein is an optical image stabilizer, including: a substrate; a table disposed over the substrate, while levitating, to be movable on the substrate and having an image sensor mounted on the upper end of the substrate; cantilever arms disposed over the substrate, while levitating, and connected to the table to move the table; anchors fixing one ends of the cantilever arms onto the substrate; and electrodes applying voltage for moving the cantilever arm.
摘要:
There are provided a fixed focus transducer array and an ultrasonic wave transceiving apparatus using the same. The fixed focus transducer array includes: a plurality of transducers, transducing electrical signals into ultrasonic signals to thereby focus the ultrasonic signals on a single focal point and transducing reflected ultrasonic signals from the single focal point into electrical signals to thereby output the electrical signals, wherein the plurality of transducers are disposed to be symmetrical to each other based on one transducer and simultaneously focus the ultrasonic signals on the single focal point at speeds according to the respective natural frequencies thereof. Therefore, a circuit area is reduced, whereby miniaturization may be implemented and a processing speed may be increased.
摘要:
There are provided a fingerprint detection sensor and a method of manufacturing the same. The fingerprint detection sensor includes a plurality of piezoelectric sensors arranged in an array on a two-dimensional plane and having a predetermined height; a filler provided to surround the plurality of piezoelectric sensors and isolating vibrations between the plurality of piezoelectric sensors; and a control unit discharging predetermined output signals through the piezoelectric sensors to detect information of an object in contact with, or close to, the plurality of piezoelectric sensors, wherein the plurality of piezoelectric sensors include first surfaces and second surfaces disposed on both ends thereof in a height direction and areas of the first surfaces and the second surfaces are different from each other.
摘要:
Disclosed herein is a wafer level packaging image sensor module, including a wafer including an image sensor, a circuit portion and a lower electrode on one side thereof, a lens actuator disposed on the lower electrode and made of electroactive polymer, an upper electrode disposed on the lens actuator, and a lens unit disposed on the upper electrode to allow light to be transmitted to the image sensor therethrough. The wafer level packaging image sensor module includes the lens actuator made of electroactive polymer, and thus it enables realization of the autofocusing of the wafer level packaging image sensor module.
摘要:
There is provided a fingerprint detection sensor and a method of detecting a fingerprint. The fingerprint detection sensor according to embodiments of the present invention includes a plurality of piezoelectric sensors arranged on a two-dimensional plane; and a fingerprint detection unit detecting a fingerprint by using ultrasonic signals discharged from the plurality of respective piezoelectric sensors, wherein the fingerprint detection unit determines whether the fingerprint is a forged fingerprint by detecting bloodstreams within a first region on the two-dimensional plane in which the ultrasonic signals discharged from the plurality of respective piezoelectric sensors overlap one another.