摘要:
A laminating method and a machine are provided for successively heating and compression-bonding a film-shaped organic die-bonding material on a leadframe with good productivity but without voids and further to avoid package cracking upon mounting a chip. A leadframe 7 is placed on a travelling table 8 and is heated there. A film-shaped organic die-bonding material 2 is punched out and the resulting film is tack-bonded to a die pad on the leadframe. The leadframe with the film tack-bonded thereon is then moved to a position b by the travelling table. After the film is pressed by a compression-bonding element at the position B, a chip is mounted on the film-shaped organic die-bonding material 2.
摘要:
A setting resin composition, comprising:(A) an unsaturated polyester having at least 30% of all the terminal groups thereof sealed each with a group represented by the general formula (I): ##STR1## wherein, n stands for an integer of 0 to 8, and (B) a dicyclopentadiene type resin containing 50 to 100% by weight of polymerized dicyclopentadiene units.
摘要:
An oligomer having, as the constitutional component thereof, (dihydrodicyclopentadienyl)-maleates or -fumarates of the general formula I: ##STR1## (I) wherein, R is H or ##STR2## and possessing a softening point in the range of from 50.degree. to 180.degree. C. and solubility in organic solvents. It is obtained by polymerizing the compound having the above general formula I under heating at a temperature of 220.degree. to 300.degree. C. in the absence of a catalyst.
摘要:
A resinous composition comprising(1) 40-90 parts by weight of one or more oligomers obtained by reacting a polyhydric alcohol or its derivative with a monobasic acid of the formula, ##STR1## wherein X is an .alpha.,.beta.-unsaturated hydrocarbon group having 2 or 3 carbon atoms, and(2) 10-60 parts by weight of one or more polymerizable monomers having at least one polymerizable double bond in the molecule, has high solid content and gives molded articles excellent in water resistance, chemical resistance and hardness rise in addition to excellent properties of conventional unsaturated polyester resins.
摘要:
A thermosetting resin composition comprising (I) a polybutadiene derivative obtained by conducting reaction of (A) a compound having active hydrogen obtained by reacting dicyclopentadiene or hydroxylated dicyclopentadiene with maleic anhydride or acid to yield partially esterified dicyclopentadienecarboxylic acid, which is further reacted with monoglycidyl ether or ester, (B) a butadiene homopolymer or copolymer having one or more hydroxyl groups and number average molecular weight of 1000 to 5000, and (C) a diisocyanate in ratios in terms of functional group equivalent ratio of (A)/(B)/(C) being 0.6-1.0/1.0/1.2-2.0, and (II) a polymerizable monomer having at least one polymerizable double bond in the molecule can be handled easily and cured at normal temperatures to give cured articles having good properties without losing excellent properties of polybutadiene as elastomer.
摘要:
There is disclosed a sheet-state ink-jet recording material which comprises a water-resistant support and at least one ink-receptive layer provided on the support, wherein at least one of the ink-receptive layers contains inorganic fine particles having an average primary particle size of 30 nm or less and a hydrophilic binder, and a longitudinal direction of the sheet-state ink-jet recording material is cut at a right angle to a flowing direction of the recording material at a time of coating the ink-receptive layer.
摘要:
A resin composition which comprises (A) 50 to 90 parts by weight of an unsaturated ester oligomer produced by reacting a glycol, hydroxylated dicyclopentadiene, and at least one unsaturated dibasic acid or anhydride thereof until an acid value of less than 40, (B) 50 to 10 parts by weight of one or more polymerizable monomers, and (C) 3 to 15 parts by weight of polystyrene based on 100 parts by weight of the total of the components (A) and (B), can give molded articles having low shrink properties and improved color shading, cracks, etc.
摘要:
An electroconductive resin paste, comprising a resin obtained by reacting 0.01 to 0.5 carboxylic acid equivalent of a homopolymer or a copolymer of butadiene having carboxylic acid terminal groups with 1 epoxy equivalent of an epoxy resin having two or more epoxy groups in one molecule, a curing agent and an electroconductive filler which is (i) an electroconductive metal powder or (ii) an inorganic insulating powder coated with a surface electroconductive film, said electroconductive filler being in an amount of from 60 to 95% by weight based on the resin and the electroconductive filler.
摘要:
A method for the manufacture of a polybutadiene-modified unsaturated polyester, comprising the steps of: (I) reacting (A) an .alpha.,.beta.-unsaturated dicarboxylic acid or anhydride with (B) at least one compound selected from the group consisting of (i) air-drying allyl compounds, (ii) animal and vegetable oils or derivatives thereof and (iii) dicyclopentadiene or derivatives thereof at a (B)/(A) molar ratio within the range of from 0.8 to 1.2, and (II) reacting the resultant reaction product with (C) at least one compound selected from the group consisting of .alpha.,.omega.-polybutadiene glycol and .alpha.,.omega.-hydrogenated polybutadiene glycol. A polybutadiene-modified unsaturated polyester comprising said polybutadiene-modified unsaturated polyester and a polymerizable monomer possessing at least one double bond.
摘要:
Disclosed are an ink-jet recording material for proof including a water-resistant support and at least one ink-receptive layer containing inorganic fine particles and a hydrophilic binder provided on the support, wherein the water-resistant support has a center line average roughness Ra75 with a cut off value of 0.8 mm according to JIS-B0601 of 1.0 μm or less, and an uppermost ink-receptive layer farthest from the water-resistant support contains a colorless or white matting agent having an average particle size of 1 to 10 μm and a colored pigment having an average particle size of 1 μm or less, and use of the same for proof.