Solventless silicone pressure-sensitive adhesive composition
    12.
    发明授权
    Solventless silicone pressure-sensitive adhesive composition 有权
    无溶剂硅氧烷压敏粘合剂组合物

    公开(公告)号:US07728080B2

    公开(公告)日:2010-06-01

    申请号:US12057595

    申请日:2008-03-28

    申请人: Shunji Aoki

    发明人: Shunji Aoki

    摘要: A solventless silicone pressure-sensitive adhesive composition is provided. The composition includes (A) a polyorganosiloxane with a polymerization degree of 300 to 2,000 and having at least two alkenyl group-containing organic groups, (B) a polyorganohydrosiloxane having at least three silicon-bonded hydrogen atoms, (C) a polydiorganosiloxane having alkenyl groups at both terminals, (D) a polydiorganosiloxane having SiH groups at both terminals, (E) a polyorganosiloxane composed of R23SiO1/2 units and SiO2 units (R2 is a monovalent hydrocarbon group), and (F) a platinum-based catalyst. The composition enables the prevention of problems caused by residual or volatilized organic substances, such as the absorption of ultraviolet radiation or the like, and also enables ready removal of the composition without deforming or damaging the adherend.

    摘要翻译: 提供无溶剂的硅氧烷压敏粘合剂组合物。 所述组合物包含(A)聚合度为300〜2,000且具有至少2个含烯基的有机基团的聚有机硅氧烷,(B)具有至少三个与硅键合的氢原子的聚有机氢硅氧烷,(C)具有烯基的聚二有机硅氧烷 (D)在两端具有SiH基的聚二有机硅氧烷,(E)由R23SiO1 / 2单元组成的聚有机硅氧烷和SiO 2单元(R2是一价烃基),和(F)铂系催化剂。 该组合物能够防止由残留或挥发的有机物质引起的问题,例如紫外线辐射等的吸收,并且还能够使组合物的即时去除而不会使被粘物变形或损坏。

    Method of forming sheet having foreign material portions used for forming multi-layer wiring board and sheet having foreign portions
    13.
    发明授权
    Method of forming sheet having foreign material portions used for forming multi-layer wiring board and sheet having foreign portions 失效
    形成具有用于形成多层布线板的异物部分的片材和具有外来部分的片材的方法

    公开(公告)号:US07611982B2

    公开(公告)日:2009-11-03

    申请号:US10553517

    申请日:2004-04-14

    IPC分类号: H01L21/4763

    摘要: The present invention relates to a laminated type electronic part and aims at providing a sheet manufacturing method and a sheet that contribute to high integration, downsizing and enhancement of reliability of the electronic part. To accomplish this object, the manufacturing method according to the present invention involves forming a layer composed of a positive resist on a support body, repeatedly executing an exposure process, a developing process and a depositing process of depositing a substance having a desired electrical characteristic into an obtained pattern space with respect to the layer, and thereafter removing the support body. The sheet composed of portions, having three or more types of different physical properties, of which an aspect ratio in pattern is equal to or larger than 1, is provided by this manufacturing method.

    摘要翻译: 层叠型电子部件技术领域本发明涉及层叠型电子部件,其目的在于提供有助于电子部件的高集成度,小型化和提高可靠性的片材制造方法和片材。 为了实现该目的,根据本发明的制造方法包括在支撑体上形成由正性抗蚀剂构成的层,反复进行曝光处理,显影处理以及将具有期望的电特性的物质沉积到 获得相对于层的图案空间,然后移除支撑体。 通过该制造方法提供由具有三种或更多种类型的不同物理性质的片材组成的片材,其中图案的纵横比等于或大于1。

    Silicone adhesive composition and an adhesive tape thereof
    15.
    发明申请
    Silicone adhesive composition and an adhesive tape thereof 有权
    硅酮粘合剂组合物及其胶带

    公开(公告)号:US20060189777A1

    公开(公告)日:2006-08-24

    申请号:US11410926

    申请日:2006-04-26

    申请人: Shunji Aoki

    发明人: Shunji Aoki

    IPC分类号: C08G77/08 C08L83/04 C08K5/33

    摘要: A peroxide curable silicon adhesive composition comprising a diorganopolysiloxane (A), a polyorganosiloxane (B) comprising R13SiO0.5 unit and SiO2 unit in a molar ratio of the R13SiO0.5 unit to the SiO2 unit of from 0.6 to 1.7, a hindered amine compound (C), and an organic peroxide (D), and an adhesive tape thereof are provided. Also provided are an addition-reactive silicon adhesive composition comprising a diorganopolysiloxane (A′) having 2 or more alkenyl groups, a polyorganosiloxane (B), a hindered amine compound (C), a polyorganosiloxane (E) having SiH group, a retarder (F), and a platinum catalyst (G), and an adhesive tape thereof.

    摘要翻译: 一种过氧化物可固化硅粘合剂组合物,其包含二有机聚硅氧烷(A),包含R 1 SiO 2 SiO 1/2单元的聚有机硅氧烷(B)和SiO 2 单元,其中R 1,R 2,R 3,SiO 2,H 2单元与SiO 2 SiO 2单元的摩尔比 >单位为0.6〜1.7,受阻胺化合物(C)和有机过氧化物(D)及其粘合带。 还提供了包含具有2个以上烯基的二有机聚硅氧烷(A'),聚有机硅氧烷(B),受阻胺化合物(C),具有SiH基的聚有机硅氧烷(E),延迟剂( F)和铂催化剂(G)及其粘合带。

    Electroconductive silicone pressure-sensitive adhesive composition
    16.
    发明授权
    Electroconductive silicone pressure-sensitive adhesive composition 失效
    导电硅氧烷压敏粘合剂组合物

    公开(公告)号:US06991751B2

    公开(公告)日:2006-01-31

    申请号:US10652074

    申请日:2003-09-02

    IPC分类号: H01B1/22

    摘要: A conductive powder is incorporated in a pressure-sensitive adhesive composition comprising a silicone gum, an MQ resin, and a crosslinking agent. The conductive powder consists of core particles of inorganic material or organic resin, an interlayer of silicon-base polymer, and a metal plating. The resulting conductive silicone pressure-sensitive adhesive composition is satisfactorily adherent to silicone rubber and cures into a product that exhibits stable conductivity and adhesive properties in the temperature region where silicone rubber is used.

    摘要翻译: 将导电粉末掺入包含硅酮胶,MQ树脂和交联剂的压敏粘合剂组合物中。 导电粉末由无机材料或有机树脂的核心颗粒,硅基聚合物的中间层和金属电镀组成。 得到的导电硅氧烷压敏粘合剂组合物令人满意地粘附于硅橡胶,并固化成在使用硅橡胶的温度区域中显示出稳定的导电性和粘合性能的产品。

    Addition-reaction silicone pressure sensitive adhesive composition
    19.
    发明授权
    Addition-reaction silicone pressure sensitive adhesive composition 失效
    加成反应硅胶压敏胶组合物

    公开(公告)号:US06406793B1

    公开(公告)日:2002-06-18

    申请号:US09667557

    申请日:2000-09-22

    申请人: Shunji Aoki

    发明人: Shunji Aoki

    IPC分类号: B32B2508

    摘要: A silicone pressure sensitive adhesive composition utilizing addition reaction between alkenyl groups of alkenyl group-containing diorganopolysiloxanes and SiH groups of organohydrogenpolysiloxanes, which comprises (A) diorganopolysiloxanes containing alkenyl groups the number of which is on average at least two a molecule, (B) an organopolysiloxane comprising R23SiOC.5 units, wherein R2 is an unsubstituted or substituted 1-10C monovalent hydrocarbon group, and SiO2 units in a R23SiOC.5/SiO2 ratio of from 0.6 to 1.3 by mole, (C) an organohydrogenpolysiloxane containing at least two per molecule of silicon-bonded hydrogen atoms, (D) an acetylene alcohol compound represented by the following formula wherein R3 and R4 are each a monovalent 1-8C hydrocarbon group and R5 is a divalent 3-8C hydrocarbon group, (E) a silylated acetylene alcohol compound represented by the following formula wherein R3, R4 and R6 are each a monovalent 1-8C hydrocarbon group and R5 is a divalent 3-8C hydrocarbon group, and (F) a platinum catalyst.

    摘要翻译: 一种硅氧烷压敏粘合剂组合物,其利用含链烯基的二有机聚硅氧烷的链烯基和有机氢聚硅氧烷的SiH基团之间的加成反应,其包含(A)含有数个平均至少两个分子的烯基的二有机聚硅氧烷,(B) 包含R23SiOC.5单元的有机聚硅氧烷,其中R2是未取代或取代的1-10C单价烃基,R23SiOC.5 / SiO2比例为0.6-1.3摩尔的SiO 2单元,(C)含有至少两个的有机氢聚硅氧烷 硅键合氢原子的分子,(D)由下列化学式表示的乙炔醇化合物R3和R4各自为一价1-8C烃基,R5为二价3-8C烃基,(E)甲硅烷基化乙炔醇 由以下化学式表示的化合物R3,R4和R6各自为一价1-8C烃基,R5为二价3-8C烃gr 和(F)铂催化剂。

    Silicone composition and a pressure sensitive adhesive film having a pressure sensitive adhesive layer made from the composition
    20.
    发明授权
    Silicone composition and a pressure sensitive adhesive film having a pressure sensitive adhesive layer made from the composition 有权
    硅酮组合物和具有由该组合物制成的压敏粘合剂层的压敏粘合剂膜

    公开(公告)号:US08057909B2

    公开(公告)日:2011-11-15

    申请号:US12348199

    申请日:2009-01-02

    IPC分类号: B32B9/04

    摘要: A pressure sensitive adhesive film comprising a substrate film and a pressure sensitive adhesive layer formed on a surface of the substrate film, said pressure sensitive adhesive layer being prepared from (A) a silicone composition comprising a diorganopolysiloxane having at least two alkenyl groups per molecule and (C) a polyorganosiloxane having an SiH bond, characterized in that the alkenyl groups are contained in an amount of from 0.0007 to 0.05 mole per 100 g of the diorganopolysiloxane (A) and that the polyorganosiloxane (C) is contained in such an amount that a molar ratio of the SiH bond to the alkenyl group of the diorganopolysiloxane (A) ranges from 0.5 to 20. The adhesive film is useful in protecting the surface of a flat panel display.

    摘要翻译: 一种压敏粘合剂膜,包括在基材膜的表面上形成的基材膜和压敏粘合剂层,所述压敏粘合剂层由(A)含有每分子具有至少两个烯基的二有机聚硅氧烷的有机硅组合物制备, (C)具有SiH键的聚有机硅氧烷,其特征在于,所述链烯基的含量为每100g所述二有机聚硅氧烷(A)为0.0007〜0.05摩尔,所述聚有机硅氧烷(C)的含量为 二有机基聚硅氧烷(A)的SiH键与烯基的摩尔比为0.5至20.粘合膜可用于保护平板显示器的表面。