Method of forming sheet having foreign material portions used for forming multi-layer wiring board and sheet having foreign portions
    2.
    发明授权
    Method of forming sheet having foreign material portions used for forming multi-layer wiring board and sheet having foreign portions 失效
    形成具有用于形成多层布线板的异物部分的片材和具有外来部分的片材的方法

    公开(公告)号:US07611982B2

    公开(公告)日:2009-11-03

    申请号:US10553517

    申请日:2004-04-14

    IPC分类号: H01L21/4763

    摘要: The present invention relates to a laminated type electronic part and aims at providing a sheet manufacturing method and a sheet that contribute to high integration, downsizing and enhancement of reliability of the electronic part. To accomplish this object, the manufacturing method according to the present invention involves forming a layer composed of a positive resist on a support body, repeatedly executing an exposure process, a developing process and a depositing process of depositing a substance having a desired electrical characteristic into an obtained pattern space with respect to the layer, and thereafter removing the support body. The sheet composed of portions, having three or more types of different physical properties, of which an aspect ratio in pattern is equal to or larger than 1, is provided by this manufacturing method.

    摘要翻译: 层叠型电子部件技术领域本发明涉及层叠型电子部件,其目的在于提供有助于电子部件的高集成度,小型化和提高可靠性的片材制造方法和片材。 为了实现该目的,根据本发明的制造方法包括在支撑体上形成由正性抗蚀剂构成的层,反复进行曝光处理,显影处理以及将具有期望的电特性的物质沉积到 获得相对于层的图案空间,然后移除支撑体。 通过该制造方法提供由具有三种或更多种类型的不同物理性质的片材组成的片材,其中图案的纵横比等于或大于1。

    Method for manufacturing ceramic green sheet and method for manufacturing electronic part using that ceramic green sheet
    4.
    发明授权
    Method for manufacturing ceramic green sheet and method for manufacturing electronic part using that ceramic green sheet 失效
    制造陶瓷生片的方法和使用该陶瓷生片制造电子部件的方法

    公开(公告)号:US07387870B2

    公开(公告)日:2008-06-17

    申请号:US10926042

    申请日:2004-08-26

    IPC分类号: B29C65/14 G03C5/00 B32B37/02

    摘要: The invention relates to a so-called ceramic green sheet used for manufacturing multilayer ceramic electronic parts. The invention is intended to improve accuracy in shape of an electrode or other element formed on the sheet, accuracy in its position and uniformity in its thickness. In a process according to the invention, a layer made of a photosensitive material including a powder having a desired electric characteristic is formed on a light transmissive base member. A mask having a desired pattern is disposed on the back side of the base member and the photosensitive material is exposed from the back side of the base member through the mask. Then the photosensitive layer after the exposure is subjected to development.

    摘要翻译: 本发明涉及用于制造多层陶瓷电子部件的所谓的陶瓷生片。 本发明旨在提高形成在片材上的电极或其它元件的形状精度,其位置精度及其厚度均匀性。 在根据本发明的方法中,在透光性基材上形成由包含具有所需电特性的粉末的感光材料制成的层。 具有期望图案的掩模设置在基底构件的背面上,并且感光材料通过掩模从基底构件的背面露出。 然后曝光后的感光层显影。

    Multilayer ceramic electronic part, circuit board and method for producing ceramic green sheet used for manufacturing those part and circuit board
    5.
    发明授权
    Multilayer ceramic electronic part, circuit board and method for producing ceramic green sheet used for manufacturing those part and circuit board 失效
    多层陶瓷电子部件,电路板以及用于制造这些部件和电路板的陶瓷生片的制造方法

    公开(公告)号:US07232496B2

    公开(公告)日:2007-06-19

    申请号:US11068781

    申请日:2005-03-02

    摘要: The present invention provides a method for manufacturing an electronic part that can cope with downsizing, improvement in performance and quality of a multilayer electronic part. A ceramic green sheet is produced by forming on a substrate or on a layer formed on a substrate an internal electrode having a predetermined thickness by a discretional process, forming a photosensitive ceramic slurry on a surface of the substrate or the layer and the internal electrode in such a way that its thickness just before exposure will be substantially equal to or smaller than the thickness of the internal electrode from the surface of the substrate or the layer, irradiating the photosensitive ceramic slurry with light from the upper side of the substrate to perform exposure while masking the internal electrode pattern, to selectively harden the surface of the photosensitive ceramic slurry, the exposure amount being controlled in such a way that the surface of the photosensitive ceramic slurry is hardened, and removing the portion of the photosensitive ceramic slurry that has not been exposed by a development process to expose a surface of the internal electrode pattern.

    摘要翻译: 本发明提供一种能够应对小型化,提高多层电子部件的性能和质量的电子部件的制造方法。 通过在基板上或在基板上形成具有预定厚度的内部电极的层来形成陶瓷生片,在基板或层和内部电极的表面上形成感光陶瓷浆料 使其刚刚曝光之前的厚度将基本上等于或小于从基板或层的表面的内部电极的厚度,用来自基板的上侧的光照射感光陶瓷浆料以进行曝光 同时掩蔽内部电极图案,以选择性地硬化感光陶瓷浆料的表面,曝光量被控制为使得感光陶瓷浆料的表面硬化,并且去除不具有感光陶瓷浆料的部分感光陶瓷浆料 通过显影处理曝光以暴露内部电极图案的表面。

    Multilayer ceramic electronic part, circuit board and method for producing ceramic green sheet used for manufacturing those part and circuit board
    9.
    发明申请
    Multilayer ceramic electronic part, circuit board and method for producing ceramic green sheet used for manufacturing those part and circuit board 失效
    多层陶瓷电子部件,电路板以及用于制造这些部件和电路板的陶瓷生片的制造方法

    公开(公告)号:US20050194084A1

    公开(公告)日:2005-09-08

    申请号:US11068781

    申请日:2005-03-02

    摘要: The present invention provides a method for manufacturing an electronic part that can cope with downsizing, improvement in performance and quality of a multilayer electronic part. A ceramic green sheet is produced by forming on a substrate or on a layer formed on a substrate an internal electrode having a predetermined thickness by a discretional process, forming a photosensitive ceramic slurry on a surface of the substrate or the layer and the internal electrode in such a way that its thickness just before exposure will be substantially equal to or smaller than the thickness of the internal electrode from the surface of the substrate or the layer, irradiating the photosensitive ceramic slurry with light from the upper side of the substrate to perform exposure while masking the internal electrode pattern, to selectively harden the surface of the photosensitive ceramic slurry, the exposure amount being controlled in such a way that the surface of the photosensitive ceramic slurry is hardened, and removing the portion of the photosensitive ceramic slurry that has not been exposed by a development process to expose a surface of the internal electrode pattern.

    摘要翻译: 本发明提供一种能够应对小型化,提高多层电子部件的性能和质量的电子部件的制造方法。 通过在基板上或在基板上形成具有预定厚度的内部电极的层来形成陶瓷生片,在基板或层和内部电极的表面上形成感光陶瓷浆料 使其刚刚曝光之前的厚度将基本上等于或小于从基板或层的表面的内部电极的厚度,用来自基板的上侧的光照射感光陶瓷浆料以进行曝光 同时掩蔽内部电极图案,以选择性地硬化感光陶瓷浆料的表面,曝光量被控制为使得感光陶瓷浆料的表面硬化,并且去除不具有感光陶瓷浆料的部分感光陶瓷浆料 通过显影处理曝光以暴露内部电极图案的表面。

    High dielectric porcelain composition and method of reducing sintering
temperature thereof
    10.
    发明授权
    High dielectric porcelain composition and method of reducing sintering temperature thereof 失效
    高介电瓷组合物及其烧结温度降低的方法

    公开(公告)号:US4692422A

    公开(公告)日:1987-09-08

    申请号:US858945

    申请日:1986-05-02

    CPC分类号: C04B35/499 H01G4/1254

    摘要: A high dielectric porcelain composition having, as a main component, a Pb(Mg 1/3, Nb 2/3)O.sub.3 -PbTiO.sub.3 -Pb(Mn 1/3, Nb 2/3)O.sub.3 system including 95 mol. % of Pb(Mg 1/3, Nb 2/3)O.sub.3, 5 mol. % of PbTiO.sub.3 and 0.5 weight % of Pb(Mn 1/3, Nb 2/3)O.sub.3, and, in addition, a sub-component including PbO and ZnO. Such a dielectric porcelain is capable of being sintered at a temperature lower than 1000.degree. C. A method of reducing the sintering temperature of such a high dielectric porcelain composition, is also provided.

    摘要翻译: 作为主要成分的含有95摩尔的Pb(Mg 1/3,Nb 2/3)O 3 -PbTiO 3-Pb(Mn 1/3,Nb 2/3)O 3体系的高介电瓷组合物。 %的Pb(Mg 1/3,Nb 2/3)O 3,5mol。 PbTiO 3的百分比和Pb(Mn 1/3,Nb 2/3)O 3的0.5重量%,以及包含PbO和ZnO的亚成分。 这种电介质陶瓷能够在低于1000℃的温度下烧结。还提供了降低这种高介电瓷组合物的烧结温度的方法。