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公开(公告)号:US20090170227A1
公开(公告)日:2009-07-02
申请号:US12362461
申请日:2009-01-29
CPC分类号: G03F1/66 , C23C14/042 , G03F7/70741 , H01L51/0011
摘要: The present invention provides a large mask with a high mask accuracy for conducting selective deposition on a substrate with a large surface area. In accordance with the present invention, the mask body is fixed in a fixing position disposed on a line passing through a thermal expansion center in the width of the mask frame. Further, in accordance with the present invention, the substrate and mask body are fixed and deposition is carried out by moving the deposition source in the X direction or Y direction. A method comprising moving the deposition source in the X direction or Y direction is suitable for deposition on large substrates.
摘要翻译: 本发明提供了具有高掩模精度的大掩模,用于在具有大表面积的基板上进行选择性沉积。 根据本发明,掩模体固定在布置在通过荫罩框架的宽度的热膨胀中心的线上的固定位置。 此外,根据本发明,通过在X方向或Y方向移动沉积源来固定基板和掩模体并进行沉积。 包括在X方向或Y方向上移动沉积源的方法适合于沉积在大的衬底上。
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公开(公告)号:US20110031491A1
公开(公告)日:2011-02-10
申请号:US12846603
申请日:2010-07-29
IPC分类号: H01L29/786 , H01L21/34
CPC分类号: H01L29/78606 , G02F1/1339 , G02F1/134336 , G02F1/1345 , G02F1/136227 , G02F1/136286 , G02F1/1368 , G02F1/167 , G02F2001/13606 , G02F2201/123 , G09G3/344 , G09G3/3677 , G09G2300/0426 , G09G2310/0286 , G09G2310/08 , H01L27/1218 , H01L27/1225 , H01L27/124 , H01L27/1248 , H01L27/1255 , H01L27/1274 , H01L27/3262 , H01L29/45 , H01L29/513 , H01L29/518 , H01L29/66742 , H01L29/66969 , H01L29/786 , H01L29/78648 , H01L29/7869 , H01L29/78696
摘要: An object is to provide a semiconductor device having a structure in which parasitic capacitance between wirings can be efficiently reduced. In a bottom gate thin film transistor using an oxide semiconductor layer, an oxide insulating layer used as a channel protection layer is formed above and in contact with part of the oxide semiconductor layer overlapping with a gate electrode layer, and at the same time an oxide insulating layer covering a peripheral portion (including a side surface) of the stacked oxide semiconductor layer is formed. Further, a source electrode layer and a drain electrode layer are formed in a manner such that they do not overlap with the channel protection layer. Thus, a structure in which an insulating layer over the source electrode layer and the drain electrode layer is in contact with the oxide semiconductor layer is provided.
摘要翻译: 目的在于提供一种半导体器件,其具有可以有效地减少布线之间的寄生电容的结构。 在使用氧化物半导体层的底栅薄膜晶体管中,用作沟道保护层的氧化物绝缘层形成在与栅电极层重叠的氧化物半导体层的一部分上方并与其形成接触,同时氧化物 形成覆盖层叠氧化物半导体层的周边部(包括侧面)的绝缘层。 此外,以与沟道保护层不重叠的方式形成源极电极层和漏极电极层。 因此,提供了源极电极层和漏电极层上的绝缘层与氧化物半导体层接触的结构。
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公开(公告)号:US20120280230A1
公开(公告)日:2012-11-08
申请号:US13552805
申请日:2012-07-19
IPC分类号: H01L29/786
CPC分类号: H01L29/78618 , H01L27/1225 , H01L29/7869
摘要: An object is to provide a method for manufacturing a highly reliable semiconductor device including thin film transistors which have stable electric characteristics and are formed using an oxide semiconductor. A method for manufacturing a semiconductor device includes the steps of: forming an oxide semiconductor film over a gate electrode with a gate insulating film interposed between the oxide semiconductor film and the gate electrode, over an insulating surface; forming a first conductive film including at least one of titanium, molybdenum, and tungsten, over the oxide semiconductor film; forming a second conductive film including a metal having lower electronegativity than hydrogen, over the first conductive film; forming a source electrode and a drain electrode by etching of the first conductive film and the second conductive film; and forming an insulating film in contact with the oxide semiconductor film, over the oxide semiconductor film, the source electrode, and the drain electrode.
摘要翻译: 本发明的目的是提供一种用于制造具有稳定电特性并使用氧化物半导体形成的薄膜晶体管的高可靠性半导体器件的方法。 一种制造半导体器件的方法包括以下步骤:在绝缘表面上,在栅极上形成氧化物半导体膜,其中栅极绝缘膜置于氧化物半导体膜和栅电极之间; 在所述氧化物半导体膜上形成包括钛,钼和钨中的至少一种的第一导电膜; 在所述第一导电膜上形成包含具有比氢更低的电负性的金属的第二导电膜; 通过蚀刻第一导电膜和第二导电膜形成源电极和漏电极; 以及在所述氧化物半导体膜,所述源电极和所述漏电极上方形成与所述氧化物半导体膜接触的绝缘膜。
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公开(公告)号:US20120149147A1
公开(公告)日:2012-06-14
申请号:US13399369
申请日:2012-02-17
申请人: Shunpei YAMAZAKI , Junichiro SAKATA , Hiroki OHARA
发明人: Shunpei YAMAZAKI , Junichiro SAKATA , Hiroki OHARA
IPC分类号: H01L21/36
CPC分类号: H01L21/465 , H01L21/02565 , H01L21/28176 , H01L21/324 , H01L21/477 , H01L29/04 , H01L29/045 , H01L29/66742 , H01L29/66969 , H01L29/78603 , H01L29/78606 , H01L29/78618 , H01L29/78642 , H01L29/78648 , H01L29/7869 , H01L29/78696
摘要: A semiconductor device for high power application in which a novel semiconductor material having high mass productivity is provided. An oxide semiconductor film is formed, and then, first heat treatment is performed on the exposed oxide semiconductor film in order to reduce impurities such as moisture or hydrogen in the oxide semiconductor film. Next, in order to further reduce impurities such as moisture or hydrogen in the oxide semiconductor film, oxygen is added to the oxide semiconductor film by an ion implantation method, an ion doping method, or the like, and after that, second heat treatment is performed on the exposed oxide semiconductor film.
摘要翻译: 一种用于大功率应用的半导体器件,其中提供了具有高质量生产率的新型半导体材料。 形成氧化物半导体膜,然后对暴露的氧化物半导体膜进行第一热处理,以便减少氧化物半导体膜中的杂质如水分或氢。 接下来,为了进一步减少氧化物半导体膜中的杂质,例如水分或氢气,通过离子注入法,离子掺杂法等将氧添加到氧化物半导体膜中,之后,第二热处理为 在暴露的氧化物半导体膜上进行。
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公开(公告)号:US20110210328A1
公开(公告)日:2011-09-01
申请号:US13104548
申请日:2011-05-10
申请人: Shunpei YAMAZAKI , Junichiro SAKATA , Jun KOYAMA
发明人: Shunpei YAMAZAKI , Junichiro SAKATA , Jun KOYAMA
IPC分类号: H01L29/786
CPC分类号: H01L29/7869 , H01L21/02554 , H01L21/02565 , H01L21/02631 , H01L27/1225 , H01L27/124 , H01L29/24 , H01L29/66969 , H01L29/78696
摘要: A semiconductor device which includes a thin film transistor having an oxide semiconductor layer and excellent electrical characteristics is provided. Further, a method for manufacturing a semiconductor device in which plural kinds of thin film transistors of different structures are formed over one substrate to form plural kinds of circuits and in which the number of steps is not greatly increased is provided. After a metal thin film is formed over an insulating surface, an oxide semiconductor layer is formed thereover. Then, oxidation treatment such as heat treatment is performed to oxidize the metal thin film partly or entirely. Further, structures of thin film transistors are different between a circuit in which emphasis is placed on the speed of operation, such as a logic circuit, and a matrix circuit.
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公开(公告)号:US20110210324A1
公开(公告)日:2011-09-01
申请号:US12869327
申请日:2010-08-26
申请人: Masayuki SAKAKURA , Yoshiaki OIKAWA , Shunpei YAMAZAKI , Junichiro SAKATA , Masashi TSUBUKU , Kengo AKIMOTO , Miyuki HOSOBA
发明人: Masayuki SAKAKURA , Yoshiaki OIKAWA , Shunpei YAMAZAKI , Junichiro SAKATA , Masashi TSUBUKU , Kengo AKIMOTO , Miyuki HOSOBA
IPC分类号: H01L33/16
CPC分类号: H01L27/1225 , H01L27/322 , H01L27/3262
摘要: It is an object to provide a light-emitting device in which plural kinds of circuits are formed over one substrate and plural kinds of thin film transistors corresponding to characteristics of the plural kinds of circuits are provided. An inverted coplanar thin film transistor in which an oxide semiconductor layer overlaps with a source electrode layer and a drain electrode layer is used for a pixel, and a channel-etched thin film transistor is used for a driver circuit. A color filter layer is provided between the pixel thin film transistor and a light-emitting element which is electrically connected to the pixel thin film transistor so as to overlap with the light-emitting element.
摘要翻译: 本发明的目的是提供一种在一个衬底上形成多种电路的发光器件,并且提供与多种电路的特性对应的多种薄膜晶体管。 将其中与源电极层和漏电极层重叠的氧化物半导体层用于像素的反转共面薄膜晶体管,并且将沟道蚀刻薄膜晶体管用于驱动器电路。 像素薄膜晶体管和与像素薄膜晶体管电连接以与发光元件重叠的发光元件设置滤色器层。
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公开(公告)号:US20110124153A1
公开(公告)日:2011-05-26
申请号:US12948222
申请日:2010-11-17
IPC分类号: H01L21/20
CPC分类号: H01L29/78696 , G02F1/133528 , G02F1/1339 , G02F1/134336 , G02F1/136286 , G02F1/1368 , G02F1/167 , G02F2001/133302 , G02F2001/133531 , G02F2201/121 , G02F2201/123 , G09G3/3677 , G09G2310/0286 , G09G2310/08 , H01L21/02107 , H01L21/02554 , H01L21/02565 , H01L21/02631 , H01L21/02672 , H01L21/324 , H01L21/477 , H01L21/67115 , H01L27/1225 , H01L27/127 , H01L27/3262 , H01L29/66969 , H01L29/7869
摘要: An object is to provide a semiconductor device having stable electric characteristics in which an oxide semiconductor is used. An oxide semiconductor layer is subjected to heat treatment for dehydration or dehydrogenation treatment in a nitrogen gas or an inert gas atmosphere such as a rare gas (e.g., argon or helium) or under reduced pressure and to a cooling step for treatment for supplying oxygen in an atmosphere of oxygen, an atmosphere of oxygen and nitrogen, or the air (having a dew point of preferably lower than or equal to −40° C., still preferably lower than or equal to −50° C.) atmosphere. The oxide semiconductor layer is thus highly purified, whereby an i-type oxide semiconductor layer is formed. A semiconductor device including a thin film transistor having the oxide semiconductor layer is manufactured.
摘要翻译: 目的在于提供一种使用氧化物半导体的具有稳定电特性的半导体器件。 在氮气或惰性气体气氛(例如氩气或氦气)或减压下对氧化物半导体层进行脱水或脱氢处理的热处理,并进行用于在 氧气和氮气气氛或空气(露点优选低于或等于-40℃,更优选低于或等于-50℃)气氛。 因此,氧化物半导体层被高度纯化,从而形成i型氧化物半导体层。 制造包括具有氧化物半导体层的薄膜晶体管的半导体器件。
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公开(公告)号:US20110114942A1
公开(公告)日:2011-05-19
申请号:US12943558
申请日:2010-11-10
IPC分类号: H01L29/786
CPC分类号: H01L29/7869 , H01L29/45
摘要: It is an object to provide a method for manufacturing a highly reliable semiconductor device having a thin film transistor formed using an oxide semiconductor and having stable electric characteristics. The semiconductor device includes an oxide semiconductor film overlapping with a gate electrode with a gate insulating film interposed therebetween; and a source electrode and a drain electrode which are in contact with the oxide semiconductor film. The source electrode and the drain electrode include a mixture, metal compound, or alloy containing one or more of a metal with a low electronegativity such as titanium, magnesium, yttrium, aluminum, tungsten, and molybdenum. The concentration of hydrogen in the source electrode and the drain electrode is 1.2 times, preferably 5 times or more as high as that of hydrogen in the oxide semiconductor film.
摘要翻译: 本发明的目的是提供一种用于制造具有使用氧化物半导体形成并且具有稳定的电特性的薄膜晶体管的高度可靠的半导体器件的方法。 半导体器件包括与栅电极重叠的氧化物半导体膜,其间插入有栅极绝缘膜; 以及与氧化物半导体膜接触的源电极和漏电极。 源电极和漏极包括含有一种或多种具有低电负性的金属如钛,镁,钇,铝,钨和钼的混合物,金属化合物或合金。 源电极和漏电极中的氢浓度是氧化物半导体膜中的氢的浓度的1.2倍,优选为5倍以上。
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公开(公告)号:US20110084271A1
公开(公告)日:2011-04-14
申请号:US12899962
申请日:2010-10-07
申请人: Shunpei YAMAZAKI , Junichiro SAKATA , Kengo AKIMOTO , Kosei NODA
发明人: Shunpei YAMAZAKI , Junichiro SAKATA , Kengo AKIMOTO , Kosei NODA
CPC分类号: H01L27/1225 , B82Y30/00 , H01L27/1214 , H01L27/124 , H01L27/1255 , H01L29/45 , H01L29/4908
摘要: Disclosed is a highly reliable semiconductor device and a manufacturing method thereof, which is achieved by using a transistor with favorable electrical characteristics and high reliability as a switching element. The semiconductor device includes a driver circuit portion and a pixel portion over one substrate, and the pixel portion comprises a light-transmitting bottom-gate transistor. The light-transmitting bottom-gate transistor comprises: a transparent gate electrode layer; an oxide semiconductor layer over the gate electrode layer, a superficial layer of the oxide semiconductor layer including comprising a microcrystal group of nanocrystals; and source and drain electrode layers formed over the oxide semiconductor layer, the source and drain electrode layers comprising a light-transmitting oxide conductive layer.
摘要翻译: 公开了一种高可靠性的半导体器件及其制造方法,其通过使用具有良好的电特性和高可靠性的晶体管作为开关元件来实现。 半导体器件包括驱动电路部分和一个衬底上的像素部分,并且像素部分包括透光底栅晶体管。 透光底栅晶体管包括:透明栅极电极层; 在所述栅极电极层上的氧化物半导体层,所述氧化物半导体层的表面层包括微晶纳米晶体组; 以及形成在所述氧化物半导体层上的源极和漏极电极层,所述源极和漏极电极层包括透光氧化物导电层。
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公开(公告)号:US20110032444A1
公开(公告)日:2011-02-10
申请号:US12848404
申请日:2010-08-02
申请人: Shunpei YAMAZAKI , Junichiro SAKATA , Masayuki SAKAKURA , Yoshiaki OIKAWA , Kenichi OKAZAKI , Hotaka MARUYAMA , Masashi TSUBUKU
发明人: Shunpei YAMAZAKI , Junichiro SAKATA , Masayuki SAKAKURA , Yoshiaki OIKAWA , Kenichi OKAZAKI , Hotaka MARUYAMA , Masashi TSUBUKU
CPC分类号: H01L27/1225 , G02F1/13306 , G02F1/133345 , G02F1/133528 , G02F1/1337 , G02F1/1339 , G02F1/13394 , G02F1/134336 , G02F1/13439 , G02F1/13454 , G02F1/136204 , G02F1/136286 , G02F1/1368 , G02F2001/133302 , G02F2001/133357 , G02F2201/123 , G11C19/28 , H01L27/124 , H01L27/1255 , H01L27/127 , H01L27/1288 , H01L29/247 , H01L29/78618 , H01L29/78648 , H01L29/78693 , H01L29/78696
摘要: An object is to improve reliability of a semiconductor device. A semiconductor device including a driver circuit portion and a display portion (also referred to as a pixel portion) over the same substrate is provided. The driver circuit portion and the display portion include thin film transistors in which a semiconductor layer includes an oxide semiconductor; a first wiring; and a second wiring. The thin film transistors each include a source electrode layer and a drain electrode layer. In the thin film transistor in the driver circuit portion, the semiconductor layer is sandwiched between a gate electrode layer and a conductive layer. The first wiring and the second wiring are electrically connected to each other in an opening provided in a gate insulating film through an oxide conductive layer.
摘要翻译: 目的是提高半导体器件的可靠性。 提供了包括驱动电路部分和在相同基板上的显示部分(也称为像素部分)的半导体器件。 驱动器电路部分和显示部分包括其中半导体层包括氧化物半导体的薄膜晶体管; 第一布线 和第二布线。 薄膜晶体管各自包括源极电极层和漏极电极层。 在驱动电路部分的薄膜晶体管中,半导体层夹在栅电极层和导电层之间。 第一布线和第二布线在通过氧化物导电层设置在栅极绝缘膜中的开口中彼此电连接。
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