利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

42 条记录 (耗时 0.042 秒)

    CMOS IC and high-gain antenna integration for point-to-point wireless communication
    15.
    发明申请
    CMOS IC and high-gain antenna integration for point-to-point wireless communication 有权
    CMOS IC和高增益天线集成，用于点对点无线通信

    公开(公告)号：US20080297429A1

    公开(公告)日：2008-12-04

    申请号：US11807987

    申请日：2007-05-31

    申请人： Debabani Choudhury

    发明人： Debabani Choudhury

    IPC分类号： H01Q13/02 ,  H01Q1/38

    CPC分类号： H01Q13/0283 ,  H01Q1/243 ,  H01Q13/02

    摘要： A point-to-point radio communications device, with an integrated antenna-IC module, includes highly-directional antenna elements and silicon CMOS-based ICs in plastic packaging material. The high-gain horn-type antenna includes two sections made of molded plastic and covered in a metallic coating. When combined, the two sections form an aperture and an opening on a face. The face of the antenna element can be mounted directly to an integrated circuit with an antenna coupling element, such that the aperture forms a horn-IC module. The module can be completely enclosed in a plastic-packaging environment using low-cost approach. The antenna-IC module can be manufactured as an integral part of a case for a point-to-point wireless electronic device such as a mobile video phone or a set-top box with tens of gigabits of video downloading capability.

    摘要翻译： 具有集成天线IC模块的点对点无线电通信设备包括高度定向的天线元件和基于硅的CMOS基于IC的塑料包装材料。 高增益喇叭型天线包括由模制塑料制成的两个部分，并覆盖在金属涂层中。 当组合时，两个部分在面上形成孔和开口。 天线元件的表面可以直接安装到具有天线耦合元件的集成电路，使得该孔形成喇叭IC模块。 该模块可以使用低成本的方法完全封闭在塑料包装环境中。 天线IC模块可以被制造成用于诸如移动视频电话的点对点无线电子设备或具有数十兆比特的视频下载能力的机顶盒的盒子的组成部分。

    Platform integrated phased array transmit/receive module
    19.
    发明授权
    Platform integrated phased array transmit/receive module 有权
    平台集成相控阵发射/接收模块

    公开(公告)号：US08706049B2

    公开(公告)日：2014-04-22

    申请号：US12347316

    申请日：2008-12-31

    申请人： Debabani Choudhury ,  Richard S. Perry

    发明人： Debabani Choudhury ,  Richard S. Perry

    IPC分类号： H04B1/38

    CPC分类号： H01Q3/26 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01Q1/02 ,  H01Q21/0025 ,  H01Q21/065 ,  H01Q23/00 ,  H01L2224/0401

    摘要： Disclosed are integration approaches for mm-wave planar phased array type architectures using multilayer substrate technologies. For instance, an apparatus may include a plurality of substrate layers, an integrated circuit, and a connector module. The plurality of substrate layers includes a first substrate layer having one or more phased array elements. The integrated circuit exchange one or more radio frequency (RF) signals (e.g., mm-wave signals) with the one or more phased array elements. The connector module exchange further signals with the integrated circuit that correspond to the one or more RF signals. For example, these further signals may be baseband or intermediate frequency (IF) signals.

    摘要翻译： 公开了使用多层衬底技术的毫米波平面相控阵列型结构的集成方法。 例如，设备可以包括多个基板层，集成电路和连接器模块。 多个基底层包括具有一个或多个相控阵列元件的第一基底层。 集成电路与一个或多个相控阵列元件交换一个或多个射频（RF）信号（例如，毫米波信号）。 连接器模块与对应于一个或多个RF信号的集成电路交换进一步的信号。 例如，这些另外的信号可以是基带或中频（IF）信号。