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41 条记录 (耗时 0.041 秒)

    Method of making an X-Y axis dual-mass tuning fork gyroscope with vertically integrated electronics and wafer-scale hermetic packaging
    11.
    发明授权
    Method of making an X-Y axis dual-mass tuning fork gyroscope with vertically integrated electronics and wafer-scale hermetic packaging 有权
    制造具有垂直集成电子元件和晶片级密封包装的X-Y轴双质量音叉陀螺仪的方法

    公开(公告)号：US07250112B2

    公开(公告)日：2007-07-31

    申请号：US11193127

    申请日：2005-07-28

    申请人： Steven S. Nasiri ,  Anthony Francis Flannery, Jr.

    发明人： Steven S. Nasiri ,  Anthony Francis Flannery, Jr.

    IPC分类号： H01L21/00 ,  C23F1/00

    CPC分类号： G01C19/5719

    摘要： A method for making an angular velocity sensor having two masses which are laterally disposed in an X-Y plane and indirectly connected to a frame is provided. The two masses are linked together by a linkage such that they necessarily move in opposite directions along Z. Angular velocity of the sensor about the Y axis can be sensed by driving the two masses into Z-directed antiphase oscillation and measuring the angular oscillation amplitude thereby imparted to the frame.

    摘要翻译： 提供一种用于制造具有横向设置在X-Y平面中并间接连接到框架的两个质量的角速度传感器的方法。 两个质量通过联动使得它们必须沿着相反方向移动。传感器绕Y轴的角速度可以通过将两个质量驱动成Z向反相振荡并测量角振荡幅度来感测 传给框架。

    Multiple axis accelerometer
    13.
    发明授权
    Multiple axis accelerometer 有权

    公开(公告)号：US07258011B2

    公开(公告)日：2007-08-21

    申请号：US11285493

    申请日：2005-11-21

    申请人： Steven S. Nasiri ,  Joseph Seeger

    发明人： Steven S. Nasiri ,  Joseph Seeger

    IPC分类号： G01P15/125

    CPC分类号： G01P15/18 ,  G01P1/023 ,  G01P15/0802 ,  G01P15/125 ,  G01P2015/082

    摘要： A sensor for measuring acceleration in three mutually orthogonal axes, X, Y and Z is disclosed. The sensor comprises a sensor subassembly. The sensor subassembly further comprises a base which is substantially parallel to the X-Y sensing plane; a proof mass disposed in the X-Y sensing plane and constrained to move substantially in the X, Y, and Z, about by at least one linkage and is responsive to accelerations in the X, Y and Z directions. The sensor includes at least one paddle disposed in the sensing plane; and at least one pivot on the linkage. Finally, the sensor includes at least one electrode at the base plate and at least one transducer for each sensing direction of the sensor subassembly responsive to the acceleration.

    Vertically integrated 3-axis MEMS accelerometer with electronics
    14.
    发明授权
    Vertically integrated 3-axis MEMS accelerometer with electronics 有权
    垂直集成的3轴MEMS加速度计与电子

    公开(公告)号：US08047075B2

    公开(公告)日：2011-11-01

    申请号：US11766776

    申请日：2007-06-21

    申请人： Steven S. Nasiri ,  Joseph Seeger ,  Goksen Yaralioglu

    发明人： Steven S. Nasiri ,  Joseph Seeger ,  Goksen Yaralioglu

    IPC分类号： G01P15/125

    CPC分类号： G01P15/125 ,  G01P15/18 ,  G01P2015/0814 ,  G01P2015/0831

    摘要： A system and method in accordance with the present invention provides for a low cost, bulk micromachined accelerometer integrated with electronics. The accelerometer can also be integrated with rate sensors that operate in a vacuum environment. The quality factor of the resonances is suppressed by adding dampers. Acceleration sensing in each axis is achieved by separate structures where the motion of the proof mass affects the value of sense capacitors differentially. Two structures are used per axis to enable full bridge measurements to further reduce the mechanical noise, immunity to power supply changes and cross axis coupling. To reduce the sensitivity to packaging and temperature changes, each mechanical structure is anchored to a single anchor pillar bonded to the top cover.

    摘要翻译： 根据本发明的系统和方法提供了一种与电子器件集成的低成本，体积微机械加速度计。 加速度计也可以与在真空环境中运行的速率传感器集成。 通过加入阻尼器来抑制谐振的品质因数。 每个轴上的加速度感测通过单独的结构实现，其中检测质量的运动差异地影响感测电容器的值。 每个轴使用两个结构，以实现全桥测量，以进一步降低机械噪声，对电源变化的抗扰度和交叉轴耦合。 为了降低对包装和温度变化的敏感性，每个机械结构被锚定到结合到顶盖的单个锚柱上。

    X-Y axis dual-mass tuning fork gyroscope with vertically integrated electronics and wafer-scale hermetic packaging
    15.
    发明授权
    X-Y axis dual-mass tuning fork gyroscope with vertically integrated electronics and wafer-scale hermetic packaging 有权
    X-Y轴双质量音叉陀螺仪，具有垂直集成电子和晶片级密封包装

    公开(公告)号：US06892575B2

    公开(公告)日：2005-05-17

    申请号：US10690224

    申请日：2003-10-20

    申请人： Steven S. Nasiri ,  Joseph Seeger

    发明人： Steven S. Nasiri ,  Joseph Seeger

    IPC分类号： G01C19/00 ,  G01P9/04

    CPC分类号： G01C19/5712 ,  G01C19/5719 ,  H03H2009/02354

    摘要： An angular velocity sensor has two masses which are laterally disposed in an X-Y plane and indirectly connected to a frame. The two masses are linked together by a linkage such that they necessarily move in opposite directions along Z. Angular velocity of the sensor about the Y axis can be sensed by driving the two masses into Z-directed antiphase oscillation and measuring the angular oscillation amplitude thereby imparted to the frame.In a preferred embodiment, the angular velocity sensor is fabricated from a bulk MEMS gyroscope wafer, a cap wafer and a reference wafer. In a further preferred embodiment, this assembly of wafers provides a hermetic barrier between the masses and an ambient environment.

    摘要翻译： 角速度传感器具有横向设置在X-Y平面中并间接连接到框架的两个质量块。 两个质量通过联动使得它们必须沿着相反方向移动。传感器绕Y轴的角速度可以通过将两个质量驱动成Z向反相振荡并测量角振荡幅度来感测 传给框架。 在优选实施例中，角速度传感器由体MEMS陀螺仪晶片，盖晶片和参考晶片制成。 在另一优选实施例中，晶片组件提供了质量和周围环境之间的密封屏障。

    Vertically integrated 3-axis MEMS angular accelerometer with integrated electronics
    16.
    发明授权
    Vertically integrated 3-axis MEMS angular accelerometer with integrated electronics 有权
    垂直集成的3轴MEMS角加速度计与集成电子

    公开(公告)号：US07934423B2

    公开(公告)日：2011-05-03

    申请号：US11953762

    申请日：2007-12-10

    申请人： Steven S. Nasiri ,  Goksen G. Yaralioglu ,  Joseph Seeger ,  Babak Taheri

    发明人： Steven S. Nasiri ,  Goksen G. Yaralioglu ,  Joseph Seeger ,  Babak Taheri

    IPC分类号： G01P15/08 ,  G01P15/125

    CPC分类号： G01P15/0888 ,  B60R2021/01327 ,  G01P15/0802 ,  G01P15/125 ,  G01P15/18

    摘要： Sensors for measuring angular acceleration about three mutually orthogonal axes, X, Y, Z or about the combination of these axes are disclosed. The sensor comprises a sensor subassembly. The sensor subassembly further comprises a base which is substantially parallel to the X-Y sensing plane; a proof mass disposed in the X-Y sensing plane and constrained to rotate substantially about the X, and/or Y, and/or Z, by at least one linkage and is responsive to angular accelerations about the X, and/or Y, and/or Z directions. Finally, the sensor includes at least one electrode at the base plate or perpendicular to the base plate and at least one transducer for each sensing direction of the sensor subassembly responsive to the angular acceleration. Multi-axis detection is enabled by adjusting a configuration of flexures and electrodes.

    摘要翻译： 公开了用于测量围绕三个相互正交的轴X，Y，Z或围绕这些轴的组合的角加速度的传感器。 传感器包括传感器子组件。 传感器子组件还包括基本上平行于X-Y感测平面的基座; 设置在XY感测平面中并被约束以基于X和/或Y和/或Z 1至少一个连杆旋转的检测质量体，并响应于围绕X和/或Y的角加速度和/ 或Z方向。 最后，传感器在基板处包括至少一个电极或垂直于基板，以及至少一个传感器，用于响应于角加速度的传感器子组件的每个感测方向。 通过调整弯曲和电极的配置可实现多轴检测。

    VERTICALLY INTEGRATED 3-AXIS MEMS ACCELEROMETER WITH ELECTRONICS
    17.
    发明申请
    VERTICALLY INTEGRATED 3-AXIS MEMS ACCELEROMETER WITH ELECTRONICS 有权
    具有电子学功能的垂直集成三轴MEMS加速度计

    公开(公告)号：US20080314147A1

    公开(公告)日：2008-12-25

    申请号：US11766776

    申请日：2007-06-21

    申请人： Steven S. Nasiri ,  Joseph Seeger ,  Goksen Yaralioglu

    发明人： Steven S. Nasiri ,  Joseph Seeger ,  Goksen Yaralioglu

    IPC分类号： G01P15/125

    CPC分类号： G01P15/125 ,  G01P15/18 ,  G01P2015/0814 ,  G01P2015/0831

    摘要： A system and method in accordance with the present invention provides for a low cost, bulk micromachined accelerometer integrated with electronics. The accelerometer can also be integrated with rate sensors that operate in a vacuum environment. The quality factor of the resonances is suppressed by adding dampers. Acceleration sensing in each axis is achieved by separate structures where the motion of the proof mass affects the value of sense capacitors differentially. Two structures are used per axis to enable full bridge measurements to further reduce the mechanical noise, immunity to power supply changes and cross axis coupling. To reduce the sensitivity to packaging and temperature changes, each mechanical structure is anchored to a single anchor pillar bonded to the top cover.

    摘要翻译： 根据本发明的系统和方法提供了一种与电子器件集成的低成本，体积微机械加速度计。 加速度计也可以与在真空环境中运行的速率传感器集成。 通过加入阻尼器来抑制谐振的品质因数。 每个轴上的加速度感测通过单独的结构实现，其中检测质量的运动差异地影响感测电容器的值。 每个轴使用两个结构，以实现全桥测量，以进一步降低机械噪声，对电源变化的抗扰度和交叉轴耦合。 为了降低对包装和温度变化的敏感性，每个机械结构被锚定到结合到顶盖的单个锚柱上。

    MEMS device including an electrical interconnect through a substrate
    20.
    发明授权
    MEMS device including an electrical interconnect through a substrate 有权
    MEMS器件包括通过衬底的电互连

    公开(公告)号：US08384134B2

    公开(公告)日：2013-02-26

    申请号：US13455494

    申请日：2012-04-25

    申请人： Michael J. Daneman ,  Steven S. Nasiri ,  Martin Lim

    发明人： Michael J. Daneman ,  Steven S. Nasiri ,  Martin Lim

    IPC分类号： H01L27/148 ,  H01L29/84 ,  H01L21/00

    CPC分类号： A45D27/42 ,  B81C1/00238 ,  B81C2203/0792 ,  H01L21/76898

    摘要： A MEMS device is disclosed. The MEMS device comprises a MEMS substrate and a CMOS substrate having a front surface, a back surface and one or more metallization layers. The front surface being bonded to the MEMS substrate. The MEMS device includes one or more conductive features on the back surface of the CMOS substrate and electrical connections between the one or more metallization layers and the one or more conductive features.

    摘要翻译： 公开了MEMS器件。 MEMS器件包括MEMS衬底和具有前表面，后表面和一个或多个金属化层的CMOS衬底。 前表面接合到MEMS基板上。 MEMS器件包括在CMOS衬底的背面上的一个或多个导电特征以及一个或多个金属化层与一个或多个导电特征之间的电连接。