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公开(公告)号：US08960002B2
公开(公告)日：2015-02-24
申请号：US13096732
申请日：2011-04-28
IPC分类号： G01P15/08 , G01P15/125 , G01P15/18 , B60R21/0132
CPC分类号： G01P15/0888 , B60R2021/01327 , G01P15/0802 , G01P15/125 , G01P15/18
摘要： Sensors for measuring angular acceleration about three mutually orthogonal axes, X, Y, Z or about the combination of these axes are disclosed. The sensor comprises a sensor subassembly. The sensor subassembly further comprises a base which is substantially parallel to the X-Y sensing plane; a proof mass disposed in the X-Y sensing plane and constrained to rotate substantially about the X, and/or Y, and/or Z, by at least one linkage and is responsive to angular accelerations about the X, and/or Y, and/or Z directions. Finally, the sensor includes at least one electrode at the base plate or perpendicular to the base plate and at least one transducer for each sensing direction of the sensor subassembly responsive to the angular acceleration. Multi-axis detection is enabled by adjusting a configuration of flexures and electrodes.
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2.发明授权Vertically integrated 3-axis MEMS angular accelerometer with integrated electronics 有权垂直集成的3轴MEMS角加速度计与集成电子公开(公告)号：US07934423B2
公开(公告)日：2011-05-03
申请号：US11953762
申请日：2007-12-10
IPC分类号： G01P15/08 , G01P15/125
CPC分类号： G01P15/0888 , B60R2021/01327 , G01P15/0802 , G01P15/125 , G01P15/18
摘要： Sensors for measuring angular acceleration about three mutually orthogonal axes, X, Y, Z or about the combination of these axes are disclosed. The sensor comprises a sensor subassembly. The sensor subassembly further comprises a base which is substantially parallel to the X-Y sensing plane; a proof mass disposed in the X-Y sensing plane and constrained to rotate substantially about the X, and/or Y, and/or Z, by at least one linkage and is responsive to angular accelerations about the X, and/or Y, and/or Z directions. Finally, the sensor includes at least one electrode at the base plate or perpendicular to the base plate and at least one transducer for each sensing direction of the sensor subassembly responsive to the angular acceleration. Multi-axis detection is enabled by adjusting a configuration of flexures and electrodes.
摘要翻译： 公开了用于测量围绕三个相互正交的轴X，Y，Z或围绕这些轴的组合的角加速度的传感器。 传感器包括传感器子组件。 传感器子组件还包括基本上平行于X-Y感测平面的基座; 设置在XY感测平面中并被约束以基于X和/或Y和/或Z 1至少一个连杆旋转的检测质量体，并响应于围绕X和/或Y的角加速度和/ 或Z方向。 最后，传感器在基板处包括至少一个电极或垂直于基板，以及至少一个传感器，用于响应于角加速度的传感器子组件的每个感测方向。 通过调整弯曲和电极的配置可实现多轴检测。
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3.发明申请VERTICALLY INTEGRATED 3-AXIS MEMS ANGULAR ACCELEROMETER WITH INTEGRATED ELECTRONICS 有权具有集成电子的垂直集成三轴MEMS角锥加速度计公开(公告)号：US20110197677A1
公开(公告)日：2011-08-18
申请号：US13096732
申请日：2011-04-28
IPC分类号： G01P15/08
CPC分类号： G01P15/0888 , B60R2021/01327 , G01P15/0802 , G01P15/125 , G01P15/18
摘要： Sensors for measuring angular acceleration about three mutually orthogonal axes, X, Y, Z or about the combination of these axes are disclosed. The sensor comprises a sensor subassembly. The sensor subassembly further comprises a base which is substantially parallel to the X-Y sensing plane; a proof mass disposed in the X-Y sensing plane and constrained to rotate substantially about the X, and/or Y, and/or Z, by at least one linkage and is responsive to angular accelerations about the X, and/or Y, and/or Z directions. Finally, the sensor includes at least one electrode at the base plate or perpendicular to the base plate and at least one transducer for each sensing direction of the sensor subassembly responsive to the angular acceleration. Multi-axis detection is enabled by adjusting a configuration of flexures and electrodes.
摘要翻译： 公开了用于测量围绕三个相互正交的轴X，Y，Z或围绕这些轴的组合的角加速度的传感器。 传感器包括传感器子组件。 传感器子组件还包括基本上平行于X-Y感测平面的基座; 设置在XY感测平面中并被约束以基于X和/或Y和/或Z 1至少一个连杆旋转的检测质量体，并响应于围绕X和/或Y的角加速度和/ 或Z方向。 最后，传感器在基板处包括至少一个电极或垂直于基板，以及至少一个传感器，用于响应于角加速度的传感器子组件的每个感测方向。 通过调整弯曲和电极的配置可实现多轴检测。
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4.发明授权Wafer scale chip scale packaging of vertically integrated MEMS sensors with electronics 有权垂直集成MEMS传感器与电子元件的晶圆级芯片级封装公开(公告)号：US08508039B1
公开(公告)日：2013-08-13
申请号：US12117264
申请日：2008-05-08
IPC分类号： H01L23/12
CPC分类号： B81C1/0023 , B81C1/00238 , B81C2203/0792 , H01L2224/11
摘要： In a method and system in accordance with the present invention, solder balls are added on top of vertically integrated MEMS with CMOS by using wafer scale fabrication compatible with existing chip scale packaging capabilities. In the present invention, both the MEMS and the CMOS dies are fabricated in equal dimensions. On the MEMS level, silicon islands are defined by DRIE etching to be bonded on top of CMOS pads. These conducting silicon islands later provide electrical connections between the CMOS pads and the conducting traces that lead to solder balls on top.
摘要翻译： 在根据本发明的方法和系统中，通过使用与现有芯片级封装能力兼容的晶片级制造，将焊球添加到具有CMOS的垂直集成MEMS的顶部上。 在本发明中，MEMS和CMOS晶体管的尺寸相同。 在MEMS级别上，硅岛由DRIE蚀刻限定，以连接在CMOS焊盘之上。 这些导电硅岛稍后提供CMOS焊盘和导致焊球顶部的导电迹线之间的电连接。
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公开(公告)号：US08847693B2
公开(公告)日：2014-09-30
申请号：US13448261
申请日：2012-04-16
摘要： A system and method is disclosed that provides a technique for generating an accurate time base for MEMS sensors and actuators which has a vibrating MEMS structure. The accurate clock is generated from the MEMS oscillations and converted to the usable range by means of a frequency translation circuit.
摘要翻译： 公开了一种系统和方法，其提供了一种用于为具有振动MEMS结构的MEMS传感器和致动器产生精确时基的技术。 精确时钟由MEMS振荡产生，并通过频率转换电路转换成可用的范围。
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公开(公告)号：US08183944B2
公开(公告)日：2012-05-22
申请号：US12418547
申请日：2009-04-03
IPC分类号： H03B5/30
摘要： A system and method is disclosed that provides a technique for generating an accurate time base for MEMS sensors and actuators which has a vibrating MEMS structure. The accurate clock is generated from the MEMS oscillations and converted to the usable range by means of a frequency translation circuit.
摘要翻译： 公开了一种系统和方法，其提供了一种用于为具有振动MEMS结构的MEMS传感器和致动器产生精确时基的技术。 精确时钟由MEMS振荡产生，并通过频率转换电路转换成可用的范围。
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7.发明授权Performance-enhancing two-sided MEMS anchor design for vertically integrated micromachined devices 有权用于垂直集成微加工设备的性能提升双面MEMS锚定设计公开(公告)号：US07863698B2
公开(公告)日：2011-01-04
申请号：US12418554
申请日：2009-04-03
IPC分类号： H01L29/84
CPC分类号： B81C1/00039 , B81B2203/0307
摘要： An anchoring assembly for anchoring MEMS device is disclosed. The anchoring assembly comprises: a top substrate; a bottom substrate substantially parallel to the top substrate; and a first portion of the anchor between the top substrate and the bottom substrate. The first portion of the anchor is rigidly connected to the top substrate; and the first portion of the anchor is rigidly connected to the bottom substrate. A second portion of the anchor is between the top substrate and the bottom substrate. The second portion of the anchor is rigidly connected to the top substrate; the second portion of the anchor being an anchoring point for the MEMS device. A substantially flexible mechanical element coupling the first portion of the anchor and the second portion of the anchor; the flexible element providing the electrical connection between the first portion of the anchor and the second portion of the anchor.
摘要翻译： 公开了一种用于锚定MEMS装置的锚固组件。 锚固组件包括：顶部基底; 基本上平行于顶部衬底的底部衬底; 以及锚固件在顶部基底和底部基底之间的第一部分。 锚的第一部分刚性地连接到顶部基底; 并且锚的第一部分刚性地连接到底部基底。 锚的第二部分在顶部基底和底部基底之间。 锚的第二部分刚性地连接到顶部基底; 锚的第二部分是用于MEMS装置的锚定点。 将锚固件的第一部分和锚固件的第二部分联接的基本上柔性的机械元件; 所述柔性元件提供所述锚固件的第一部分和所述锚固件的第二部分之间的电连接。
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8.发明授权公开(公告)号：US08686555B2
公开(公告)日：2014-04-01
申请号：US13527497
申请日：2012-06-19
申请人： Goksen G. Yaralioglu , Martin Lim
发明人： Goksen G. Yaralioglu , Martin Lim
IPC分类号： H01L23/12
CPC分类号： B81B7/0087 , B81B2207/012 , B81C1/0069 , H01L23/345 , H01L24/48 , H01L2224/48091 , H01L2924/00014 , H01L2924/01322 , H01L2924/1461 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A system and method for controlling temperature of a MEMS sensor are disclosed. In a first aspect, the system comprises a MEMS cap encapsulating the MEMS sensor and a CMOS die vertically arranged to the MEMS cap. The system includes a heater integrated into the MEMS cap. The integrated heater is activated to control the temperature of the MEMS sensor. In a second aspect, the method comprises encapsulating the MEMS sensor with a MEMS cap and coupling a CMOS die to the MEMS cap. The method includes integrating a heater into the MEMS cap. The integrated heater is activated to control the temperature of the MEMS sensor.
摘要翻译： 公开了一种用于控制MEMS传感器的温度的系统和方法。 在第一方面，该系统包括封装MEMS传感器的MEMS盖和垂直地布置到MEMS盖的CMOS模头。 该系统包括集成到MEMS盖中的加热器。 集成加热器被激活以控制MEMS传感器的温度。 在第二方面，该方法包括用MEMS盖封装MEMS传感器并将CMOS管芯耦合到MEMS盖。 该方法包括将加热器集成到MEMS盖中。 集成加热器被激活以控制MEMS传感器的温度。
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9.发明授权High quality factor resonators for liquid immersion biological and chemical sensors 失效液体生物和化学传感器的高品质因子谐振器公开(公告)号：US07694552B2
公开(公告)日：2010-04-13
申请号：US12069730
申请日：2008-02-11
CPC分类号： G01N29/022 , G01N2291/014 , G01N2291/02466
摘要： A mechanical resonator capable of providing an intrinsically high mechanical quality factor in immersion is provided. The resonator includes a membrane attached at its perimeter to a frame, such that a front side of the membrane is in contact with the liquid, and the back side of the membrane is not in contact with the liquid or the frame. The membrane can act as a mechanical resonator. The quality factor of this resonator is enhanced by providing a pressure release boundary region on the frame in proximity to the membrane and in contact with the liquid. The pressure release boundary region provides a soft boundary condition, in the sense that a mechanical impedance on the solid side of the solid-liquid interface is less than the liquid mechanical impedance. Providing such a soft boundary condition reduces the mechanical energy loss due to excitation of waves in the liquid, thereby improving resonator quality factor. Such high-Q resonators are particularly useful for sensor applications.
摘要翻译： 提供一种能够提供本质上高的浸入机械品质因子的机械谐振器。 谐振器包括在其周边附接到框架的膜，使得膜的前侧与液体接触，并且膜的背面不与液体或框架接触。 膜可以用作机械谐振器。 通过在框架上靠近膜并与液体接触来提供压力释放边界区域来增强该谐振器的品质因数。 压力释放边界区域提供了软边界条件，这在固体 - 液体界面的固体侧的机械阻抗小于液体机械阻抗的意义上。 提供这样的软边界条件降低了由于液体中的波的激发引起的机械能损失，从而改善了谐振器品质因数。 这种高Q谐振器对于传感器应用特别有用。
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10.发明申请Image-guided delivery of therapeutic tools duing minimally invasive surgeries and interventions 审中-公开以图像为导向的治疗工具，提供微创手术和干预措施公开(公告)号：US20080221448A1
公开(公告)日：2008-09-11
申请号：US12072906
申请日：2008-02-27
CPC分类号： B06B1/0292 , A61B8/0833 , A61B8/0841 , A61B8/12 , A61B8/4483 , A61B8/4488 , A61B8/483 , A61B10/04 , A61B18/24 , A61B90/36 , A61B2090/3782 , A61B2562/028 , A61N7/022
摘要： Imaged-guided therapy for minimally invasive surgeries and interventions is provided. An image-guided device includes an elongate tubular member, such as a catheter, an annular array of capacitive micromachined ultrasound transducers (cMUTs) for real-time three-dimensional forward-looking acoustic imaging, and a therapeutic tool. The therapeutic tool is positioned inside an inner lumen of the elongate tubular member and can be a device for tissue ablation, such as a high intensity focused ultrasound (HIFU) device or a laser. The HIFU device is operable at high frequencies to have a sufficiently small focus spot, thus a high focal intensity. The imaging annular array is also operable at high frequencies for good acoustic imaging resolution. The high resolution forward-looking imaging array, in combination with the high frequency HIFU transducer, provides a single image-guided therapy device for precise tissue ablation and real-time imaging feedback.
摘要翻译： 提供了用于微创手术和干预措施的成像指导治疗。 图像引导装置包括细长管状构件，例如导管，用于实时三维前瞻性声学成像的电容微加工超声换能器（cMUT）的环形阵列和治疗工具。 治疗工具位于细长管状构件的内腔内，并且可以是用于组织消融的装置，例如高强度聚焦超声（HIFU）装置或激光。 HIFU装置可以在高频下操作以具有足够小的焦点，因此具有高焦距。 成像环形阵列也可在高频下操作以获得良好的声学成像分辨率。 高分辨率前瞻性成像阵列与高频HIFU传感器结合，提供了一个单一的图像引导治疗装置，用于精确的组织消融和实时成像反馈。
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