公开(公告)号：US20200242440A1

公开(公告)日：2020-07-30

申请号：US16755398

申请日：2018-10-09

Applicant: Stora Enso OYJ

Inventor： Lauri Huhtasalo ,  Juha Maijala

IPC: G06K19/077 ,  H05K3/34 ,  H05K1/18 ,  H05K1/11 ,  H05K1/14 ,  H05K3/36 ,  B23K1/00 ,  B65H18/10

Abstract: Method and apparatus for producing RFID transponders (400) arranged on a carrying substrate, comprising:providing a first substrate (100), the first substrate having at least one antenna element (101) arranged thereon, and preferably several antenna elements arranged sequentially thereon along a longitudinal extension of the first substrate, each antenna element being formed by an electrically conductive pattern; providing a second substrate (200), the second substrate (200) having at least one RFID strap, each RFID strap comprising an IC (202) and at least one contact pad (201) coupled to the IC, and preferably several RFID straps being arranged sequentially along a longitudinal extension of the second substrate; and electrically connecting an antenna element (101) on the first substrate to the at least one contact pad on the second substrate by bringing said first and second substrates together, thereby bringing said antenna element in mechanical contact with said at least one contact pad, and heating the contact pad(s) to a temperature at least equal to a characteristic melting point of said at least contact pads, thereby electrically connecting the antenna element to said at least one contact pad.

公开(公告)号：US10607950B2

公开(公告)日：2020-03-31

申请号：US15663396

申请日：2017-07-28

Applicant: STORA ENSO OYJ

Inventor： Juha Maijala

IPC: H01L23/66 ,  H05K1/02 ,  H05K3/30 ,  H01L23/498 ,  A61J1/03 ,  B65D25/00 ,  H01L23/00 ,  H01L23/58 ,  H01L23/64 ,  H05K1/11 ,  H05K1/16 ,  H05K3/00

Abstract: A package comprises a body, and an electrically conductive pattern supported by said body. An interface portion is configured to receive a module to a removable attachment with the package. The electrically conductive pattern comprises, at least partly within said interface portion, a wireless coupling pattern that constitutes one half of a wireless coupling arrangement.

公开(公告)号：US20180211207A1

公开(公告)日：2018-07-26

申请号：US15766439

申请日：2016-10-05

Applicant: Stora Enso OYJ

Inventor： Juha Maijala ,  Petri Sirvio

IPC: G06Q10/08 ,  G06K19/07

CPC classification number: G06Q10/087 ,  G06K19/0723 ,  G06Q10/0833

Abstract: A system for monitoring the life cycle of a product even in open-loop retail environment having regard to the associated supply or value chain, comprising tag provision equipment arranged to obtain product information and to configure a wirelessly interrogatable electronic identification tag provided with externally readable identification information to a product item, wherein configuring incorporates at least partially automated determination, according to predefined decision logic, of at least one technical characteristic of tag implementation based on the product information to optimize the operation of the tag, and electronic data management system accessible via a communications network, preferably the Internet, comprising a data interface configured to receive and transmit data, and a data repository configured to store indications of received digital notifications of tag reading events in a plurality of activities of the associated supply or value chain, said notifications conveying said tag identification information. A corresponding method for execution by the system is presented.

公开(公告)号：US09773743B2

公开(公告)日：2017-09-26

申请号：US14430173

申请日：2013-09-23

Applicant: STORA ENSO OYJ

Inventor： Juha Maijala

IPC: H01L23/66 ,  A61J1/03 ,  B65D25/00 ,  H05K3/30 ,  H01L23/498 ,  H01L23/00 ,  H01L23/58 ,  H01L23/64 ,  H05K1/02 ,  H05K1/11 ,  H05K1/16 ,  H05K3/00

CPC classification number: H01L23/66 ,  A61J1/035 ,  A61J2200/30 ,  A61J2205/60 ,  B65D25/00 ,  B65D2203/10 ,  H01L23/4985 ,  H01L23/564 ,  H01L23/585 ,  H01L23/642 ,  H01L23/645 ,  H01L2924/0002 ,  H05K1/0216 ,  H05K1/0239 ,  H05K1/0275 ,  H05K1/028 ,  H05K1/0292 ,  H05K1/111 ,  H05K1/165 ,  H05K3/0052 ,  H05K3/301 ,  H05K3/303 ,  H05K3/305 ,  H05K2201/053 ,  H05K2201/056 ,  H05K2201/09045 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2201/09254 ,  H05K2201/09263 ,  H05K2201/09954 ,  H05K2201/0999 ,  H05K2201/2036 ,  H05K2203/0195 ,  H05K2203/0228 ,  H01L2924/00

Abstract: A package comprises a body, and an electrically conductive pattern supported by said body. An interface portion is configured to receive a module to a removable attachment with the package. The electrically conductive pattern comprises, at least partly within said interface portion, a wireless coupling pattern that constitutes one half of a wireless coupling arrangement.

公开(公告)号：US09352351B2

公开(公告)日：2016-05-31

申请号：US14375680

申请日：2013-01-30

Applicant: STORA ENSO OYJ

Inventor： Petri Sirviö ,  Juha Maijala

IPC: B05D5/12 ,  B05C1/00 ,  B05D3/12 ,  H05K3/10 ,  B05C19/00 ,  B05D1/00 ,  B05D1/28 ,  B05D3/02 ,  B05D3/06 ,  C23C26/02 ,  H05K1/03 ,  H05K3/12

CPC classification number: B05C1/003 ,  B05C19/008 ,  B05D1/007 ,  B05D1/28 ,  B05D3/0263 ,  B05D3/029 ,  B05D3/06 ,  B05D3/12 ,  C23C26/02 ,  H05K1/038 ,  H05K1/0386 ,  H05K3/102 ,  H05K3/1241 ,  H05K3/1266 ,  H05K3/1283 ,  H05K2201/0293 ,  H05K2203/0126 ,  H05K2203/0517 ,  H05K2203/0522 ,  H05K2203/102 ,  H05K2203/1105 ,  H05K2203/1476 ,  H05K2203/1545 ,  H05K2203/1581

Abstract: A method and an arrangement are disclosed for producing an electrically conductive pattern on a surface. Electrically conductive solid particles are transferred onto an area of predetermined form on a surface of a substrate. The electrically conductive solid particles are heated to a temperature that is higher than a characteristic melting point of the electrically conductive solid particles, thus creating a melt. The melt is pressed against the substrate in a nip, wherein a surface temperature of a portion of the nip that comes against the melt is lower than said characteristic melting point.

Abstract translation: 公开了用于在表面上产生导电图案的方法和装置。 将导电固体颗粒转移到基板表面上的预定形式的区域上。 将导电固体颗粒加热到高于导电固体颗粒的特征熔点的温度，从而产生熔体。 熔融物在辊隙中被压靠在基底上，其中一部分辊隙对熔体的表面温度低于所述特征熔点。