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11.发明申请公开(公告)号：US20080182428A1
公开(公告)日：2008-07-31
申请号：US11627817
申请日：2007-01-26
申请人： Tushar P. Merchant , Chun-Li Liu , Ramachandran Muralidhar , Marius K. Orlowski , Rajesh A. Rao , Matthew Stoker
发明人： Tushar P. Merchant , Chun-Li Liu , Ramachandran Muralidhar , Marius K. Orlowski , Rajesh A. Rao , Matthew Stoker
IPC分类号： H01L21/31
CPC分类号： H01L21/28273 , B82Y10/00 , H01L27/11524 , H01L29/7887 , Y10S977/932 , Y10S977/943
摘要： An electronic device can include a layer of discontinuous storage elements. A dielectric layer overlying the discontinuous storage elements can be substantially hydrogen-free. A process of forming the electronic device can include forming a layer including silicon over the discontinuous storage elements. In one embodiment, the process includes oxidizing at least substantially all of the layer. In another embodiment, the process includes forming the layer using a substantially hydrogen-free silicon precursor material and oxidizing at least substantially all of the layer.
摘要翻译： 电子设备可以包括不连续的存储元件层。 覆盖不连续存储元件的电介质层可以是基本上无氢的。 形成电子器件的过程可以包括在不连续的存储元件上形成包括硅的层。 在一个实施方案中，该方法包括至少基本上氧化所有该层。 在另一个实施方案中，该方法包括使用基本上无氢的硅前体材料形成该层并至少基本上全部氧化。
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公开(公告)号：US20080182377A1
公开(公告)日：2008-07-31
申请号：US11668210
申请日：2007-01-29
IPC分类号： H01L21/336
CPC分类号： H01L21/28273 , B82Y10/00 , H01L29/42332 , H01L29/513 , H01L29/66772 , H01L29/7887
摘要： In making a multi-bit memory cell, a first insulating layer is formed over a semiconductor substrate. A second insulating layer is formed over the first insulating layer. A layer of gate material is formed over the second insulating layer and patterned to leave a gate portion. The second insulating layer is etched to undercut the gate portion and leave a portion of the second insulating layer between the first insulating layer and the gate portion. Nanocrystals are formed on the first insulating layer. A first portion of the nanocrystals is under the gate portion on a first side of the portion of the second insulating layer and a second portion of the nanocrystals is under the gate portion on a second side of the portion of the second insulating layer. The first and second portions of the nanocrystals are for storing logic states of first and second bits, respectively.
摘要翻译： 在制造多位存储单元时，在半导体衬底上形成第一绝缘层。 在第一绝缘层上形成第二绝缘层。 一层栅极材料形成在第二绝缘层之上并图案化以留下栅极部分。 蚀刻第二绝缘层以切割栅极部分，并将第二绝缘层的一部分留在第一绝缘层和栅极部分之间。 在第一绝缘层上形成纳米晶体。 纳米晶体的第一部分在第二绝缘层部分的第一侧上的栅极部分下方，并且纳米晶体的第二部分在第二绝缘层部分的第二侧上的栅极部分下方。 纳米晶体的第一和第二部分分别用于存储第一和第二位的逻辑状态。
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公开(公告)号：US20080121966A1
公开(公告)日：2008-05-29
申请号：US11530053
申请日：2006-09-08
IPC分类号： H01L29/78 , H01L21/3205
CPC分类号： H01L29/42332 , B82Y10/00 , H01L21/28273 , H01L29/513 , H01L29/7881 , Y10S977/773
摘要： A method of forming a semiconductor device includes forming a first dielectric layer over a semiconductor substrate, forming a plurality of discrete storage elements over the first dielectric layer, thermally oxidizing the plurality of discrete storage elements to form a second dielectrics over the plurality of discrete storage elements, and forming a gate electrode over the second dielectric layer, wherein a significant portion of the gate electrode is between pairs of the plurality of discrete storage elements. In one embodiment, portions of the gate electrode is in the spaces between the discrete storage elements and extends to more than half of the depth of the spaces.
摘要翻译： 一种形成半导体器件的方法包括在半导体衬底上形成第一电介质层，在第一介电层上形成多个离散存储元件，热氧化多个离散的存储元件，以在多个离散存储器上形成第二电介质 元件，并且在所述第二介电层上形成栅电极，其中所述栅电极的重要部分位于所述多个离散存储元件的对之间。 在一个实施例中，栅电极的部分位于离散存储元件之间的空间中并且延伸到空间深度的一半以上。
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14.发明授权Transistor having three electrically isolated electrodes and method of formation 有权具有三个电隔离电极的晶体管和形成方法公开(公告)号：US07098502B2
公开(公告)日：2006-08-29
申请号：US10705317
申请日：2003-11-10
IPC分类号： H01L27/108 , H01L27/12 , H01L21/00 , H01L21/336
CPC分类号： H01L27/108 , B82Y10/00 , H01L21/28273 , H01L21/28282 , H01L27/10826 , H01L27/10879 , H01L27/10894 , H01L29/42332 , H01L29/66825 , H01L29/66833 , H01L29/785 , H01L29/7881
摘要： A transistor (10) is formed having three separately controllable gates (44, 42, 18). The three gate regions may be electrically biased differently and the gate regions may have different conductivity properties. The dielectrics on the channel sidewall may be different than the dielectrics on the top of the channel. Electrical contacts to source, drain and the three gates is selectively made. By including charge storage layers, such as nanoclusters, adjacent the transistor channel and controlling the charge storage layers via the three gate regions, both volatile and non-volatile memory cells are realized using the same process to create a universal memory process. When implemented as a volatile cell, the height of the transistor and the characteristics of channel sidewall dielectrics control the memory retention characteristics. When implemented as a nonvolatile cell, the width of the transistor and the characteristics of the overlying channel dielectrics control the memory retention characteristics.
摘要翻译： 晶体管（10）形成有三个可分别控制的栅极（44,42,18）。 三个栅极区域可以被不同地电偏置，并且栅极区域可以具有不同的导电性质。 通道侧壁上的电介质可以不同于通道顶部的电介质。 选择性地制造到源极，漏极和三个栅极的电接触。 通过包括与晶体管沟道相邻的电荷存储层，例如纳米团簇，并通过三个栅极区域控制电荷存储层，使用相同的过程实现易失性和非易失性存储单元，从而创建通用存储器处理。 当实现为易失性单元时，晶体管的高度和通道侧壁电介质的特性控制存储器保持特性。 当被实现为非易失性单元时，晶体管的宽度和上覆通道电介质的特性控制存储器保持特性。
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公开(公告)号：US07018876B2
公开(公告)日：2006-03-28
申请号：US10871772
申请日：2004-06-18
IPC分类号： H01L21/00 , H01L21/84 , H01L21/8238 , H01L21/336
CPC分类号： H01L21/28273 , H01L29/42324 , H01L29/66795 , H01L29/66825 , H01L29/785 , H01L29/7887
摘要： A transistor (103) with a vertical structure (113) that includes a dielectric structure (201) below a semiconductor structure (109). The semiconductor structure includes a channel region (731) and source/drain regions (707, 709). The transistor includes a gate structure (705, 703) that has a portion laterally adjacent to the semiconductor structure and a portion laterally adjacent to the dielectric structure. In one embodiment, the gate structure is a floating gate structure wherein a control gate structure (719) also includes portion laterally adjacent to the dielectric structure and a portion laterally adjacent to the semiconductor structure. In some examples, having a portion of the floating gate and a portion of the control gate adjacent to the dielectric structure acts to increase the control gate to floating gate capacitance without significantly increasing the capacitance of the floating gate to channel region.
摘要翻译： 一种具有垂直结构（113）的晶体管（103），其包括半导体结构（109）下面的电介质结构（201）。 半导体结构包括沟道区（731）和源极/漏极区（707,709）。 晶体管包括具有与半导体结构横向相邻的部分和与电介质结构横向相邻的部分的栅极结构（705,703）。 在一个实施例中，栅极结构是浮动栅极结构，其中控制栅极结构（719）还包括横向邻近电介质结构的部分和与半导体结构横向相邻的部分。 在一些示例中，具有浮置栅极的一部分和与电介质结构相邻的控制栅极的一部分用于将控制栅极增加到浮置栅极电容，而不显着增加浮置栅极到沟道区的电容。
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16.发明授权Method for forming a memory structure using a modified surface topography and structure thereof 有权使用改性表面形貌及其结构形成记忆结构的方法公开(公告)号：US06991984B2
公开(公告)日：2006-01-31
申请号：US10765804
申请日：2004-01-27
IPC分类号： H01L21/336
CPC分类号： H01L29/42324 , B82Y10/00 , H01L21/28273 , H01L27/115 , H01L27/11521 , H01L29/4925 , H01L29/4958
摘要： To increase the gate coupling ratio of a semiconductor device 10, discrete elements 22, such as nanocrystals, are deposited over a floating gate 16. In one embodiment, the discrete elements 22 are pre-formed in a vapor phase and are attached to the semiconductor device 10 by electrostatic force. In one embodiment, the discrete elements 22 are pre-formed in a different chamber than that where they are attached. In another embodiment, the same chamber is used for the entire deposition process. An optional, interfacial layer 17 may be formed between the floating gate 16 and the discrete elements 22.
摘要翻译： 为了增加半导体器件10的栅极耦合比，离散元件22（例如纳米晶体）沉积在浮动栅极16上。 在一个实施例中，分立元件22预先形成为气相并且通过静电力附着到半导体器件10。 在一个实施例中，分立元件22预先形成在不同于它们附接的腔室的腔室中。 在另一个实施例中，相同的室用于整个沉积工艺。 可选的界面层17可以形成在浮动栅极16和离散元件22之间。
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公开(公告)号：US06903967B2
公开(公告)日：2005-06-07
申请号：US10443908
申请日：2003-05-22
IPC分类号： G11C11/34 , G11C16/04 , H01L21/28 , H01L21/336 , H01L29/788 , H01L29/792
CPC分类号： B82Y10/00 , G11C16/0458 , G11C16/0475 , G11C2216/06 , H01L21/28273 , H01L29/66818 , H01L29/66825 , H01L29/785 , H01L29/7855 , H01L29/7887 , H01L29/7923
摘要： A memory having gate structures adjacent opposing sidewalls of a semiconductor structure including a channel region and a plurality of charge storage locations between the gate structures and the opposing sidewalls. The channel region is located between two current terminal regions, which in one example serve as the source/drain regions. A memory cell can be implemented in an array of memory cells wherein one gate structure is coupled to one word line and the other gate structure is coupled to another word line. In one example, each cell includes four charge storage locations, each for storing one bit of data.
摘要翻译： 一种存储器，其具有邻近半导体结构的相对侧壁的栅极结构，该半导体结构包括沟道区和栅极结构与相对侧壁之间的多个电荷存储位置。 沟道区域位于两个电流端子区域之间，在一个示例中，该区域用作源极/漏极区域。 存储器单元可以在存储单元的阵列中实现，其中一个栅极结构耦合到一个字线，而另一个栅极结构耦合到另一个字线。 在一个示例中，每个单元包括四个电荷存储位置，每个用于存储一位数据。
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公开(公告)号：US20050057964A1
公开(公告)日：2005-03-17
申请号：US10443908
申请日：2003-05-22
IPC分类号： G11C11/34 , G11C16/04 , H01L21/28 , H01L21/336 , H01L29/788 , H01L29/792
CPC分类号： B82Y10/00 , G11C16/0458 , G11C16/0475 , G11C2216/06 , H01L21/28273 , H01L29/66818 , H01L29/66825 , H01L29/785 , H01L29/7855 , H01L29/7887 , H01L29/7923
摘要： A memory having gate structures adjacent opposing sidewalls of a semiconductor structure including a channel region and a plurality of charge storage locations between the gate structures and the opposing sidewalls. The channel region is located between two current terminal regions, which in one example serve as the source/drain regions. A memory cell can be implemented in an array of memory cells wherein one gate structure is coupled to one word line and the other gate structure is coupled to another word line. In one example, each cell includes four charge storage locations, each for storing one bit of data.
摘要翻译： 一种存储器，其具有邻近半导体结构的相对侧壁的栅极结构，该半导体结构包括沟道区和栅极结构与相对侧壁之间的多个电荷存储位置。 沟道区域位于两个电流端子区域之间，在一个示例中，该区域用作源极/漏极区域。 存储器单元可以在存储单元的阵列中实现，其中一个栅极结构耦合到一个字线，而另一个栅极结构耦合到另一个字线。 在一个示例中，每个单元包括四个电荷存储位置，每个用于存储一位数据。
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公开(公告)号：US06808986B2
公开(公告)日：2004-10-26
申请号：US10231556
申请日：2002-08-30
IPC分类号： H01L21336
CPC分类号： B82Y10/00 , C23C16/02 , C23C16/24 , H01L21/0237 , H01L21/02488 , H01L21/02532 , H01L21/0259 , H01L21/0262 , H01L21/28273 , H01L29/42332
摘要： Nanocrystals (22) are formed in a semiconductor, such as for example, in a memory having a floating gate. A dielectric (18) overlies a substrate (12) and is placed in a chemical vapor deposition chamber (34). A first precursor gas, such as disilane (36), is flowed into the chemical vapor deposition chamber during a first phase to nucleate the nanocrystals (22) on the dielectric with first predetermined processing conditions existing within the chemical vapor deposition chamber for a first time period. A second precursor gas, such as silane, is flowed into the chemical vapor deposition chamber during a second phase subsequent to the first phase to grow the nanocrystals under second predetermined processing conditions existing within the chemical vapor deposition chamber for a second time period.
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公开(公告)号：US08895384B2
公开(公告)日：2014-11-25
申请号：US13293210
申请日：2011-11-10
IPC分类号： H01L21/8238 , H01L21/8234
CPC分类号： H01L27/0922 , H01L21/823807 , H01L21/823842 , H01L21/823857 , H01L29/42364
摘要： A metal gate structure with a channel material and methods of manufacture such structure is provided. The method includes forming dummy gate structures on a substrate. The method further includes forming sidewall structures on sidewalls of the dummy gate structures. The method further includes removing the dummy gate structures to form a first trench and a second trench, defined by the sidewall structures. The method further includes forming a channel material on the substrate in the first trench and in the second trench. The method further includes removing the channel material from the second trench while the first trench is masked. The method further includes filling remaining portions of the first trench and the second trench with gate material.
摘要翻译： 提供了具有通道材料的金属栅极结构及其制造方法。 该方法包括在衬底上形成虚拟栅极结构。 该方法还包括在虚拟栅极结构的侧壁上形成侧壁结构。 该方法还包括去除伪栅极结构以形成由侧壁结构限定的第一沟槽和第二沟槽。 该方法还包括在第一沟槽和第二沟槽中的衬底上形成沟道材料。 该方法还包括在第一沟槽被掩蔽的同时从第二沟槽去除沟道材料。 该方法还包括用栅极材料填充第一沟槽和第二沟槽的剩余部分。
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