公开(公告)号：US07458151B2

公开(公告)日：2008-12-02

申请号：US11288203

申请日：2005-11-29

申请人： Ko Onodera ,  Satoshi Kurimoto ,  Yoji Tozawa ,  Seiichi Nakagawa

发明人： Ko Onodera ,  Satoshi Kurimoto ,  Yoji Tozawa ,  Seiichi Nakagawa

IPC分类号： H01R43/00 ,  H05K3/30 ,  H01G2/20

CPC分类号： H01L23/4828 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/0781 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49169 ,  Y10T29/49204 ,  Y10T29/49213 ,  Y10T29/49222 ,  Y10T29/49224

摘要： The object of the invention is to provide a method of forming an external electrode of an electronic component whereby the external electrode can be formed in a stable fashion. In order to achieve this object, a method of forming an external electrode according to the present invention includes: a step of forming an electrode portion 301a on a side face 30a of a chip 30 constituting an electronic component by applying a conductive paste 20 from a direction facing this side face 30a; a step of forming an electrode portion 301b on a side face 30b of the chip 30 facing the side face 30a by applying the conductive paste 20 from a direction facing this side face 30b; a step of forming an electrode portion 301c so as to connect the electrode portion 301a and electrode portion 301b on the bottom face of the chip 30 respectively adjacent to the side face 30a and the side face 30b; and a step of forming an external electrode 301 comprising the electrode portion 301a, electrode portion 301b and electrode portion 301c by drying this chip 30.

摘要翻译： 本发明的目的是提供一种形成电子部件的外部电极的方法，由此能够以稳定的方式形成外部电极。 为了实现该目的，根据本发明的形成外部电极的方法包括：通过从导电膏20涂覆构成电子部件的芯片30的侧面30a上形成电极部分301a的步骤 朝向该侧面30a的方向; 通过从面向该侧面30b的方向施加导电膏20，在面向侧面30a的芯片30的侧面30b上形成电极部分301b的步骤; 形成电极部分301c以将电极部分301a和分别邻近侧面30a和侧面30b的芯片30的底面上的电极部分301b连接的步骤; 以及通过干燥该芯片30形成包括电极部分301a，电极部分301b和电极部分301c的外部电极301的步骤。

公开(公告)号：US5897984A

公开(公告)日：1999-04-27

申请号：US781184

申请日：1997-01-09

申请人： Toshio Kubota ,  Satoshi Kurimoto ,  Hiroshi Shindo ,  Satoru Takeshima ,  Shingo Kamata

发明人： Toshio Kubota ,  Satoshi Kurimoto ,  Hiroshi Shindo ,  Satoru Takeshima ,  Shingo Kamata

IPC分类号： G11B5/60 ,  G11B21/21 ,  G03C5/00

CPC分类号： G11B5/6005

摘要： A method for manufacturing a flying type magnetic head slider includes an ion etching step for shaping a surface of the slider facing to a magnetic information medium to form a predetermined pattern by using an ion etching method, a step of forming a protection layer of an organic material to cover at least one face of the slider on which at least one electromagnetic transducer element is formed, by injecting the organic material to the at least one face of the slider from a ink jet type printer head, and a step of removing the protection layer of the organic material. The protection layer forming step is executed before the ion etching step, whereas the protection layer removing step is executed after the ion etching step.

摘要翻译： 用于制造飞行型磁头滑块的方法包括离子蚀刻步骤，用于使面向磁信息介质的滑块的表面成形，通过使用离子蚀刻方法形成预定图案，形成有机保护层的步骤 通过从喷墨式打印头将有机材料注入到滑块的至少一个表面上来覆盖其上形成有至少一个电磁换能器元件的滑块的至少一个面的材料，以及去除保护的步骤 有机材料层。 在离子蚀刻步骤之前执行保护层形成步骤，而在离子蚀刻步骤之后执行保护层去除步骤。

公开(公告)号：US20090315659A1

公开(公告)日：2009-12-24

申请号：US12213749

申请日：2008-06-24

申请人： Shinichi Sato ,  Satoshi Kurimoto ,  Makoto Morita ,  Akira Takashima ,  Sumio Takahashi ,  Yoshiaki Kitajima

发明人： Shinichi Sato ,  Satoshi Kurimoto ,  Makoto Morita ,  Akira Takashima ,  Sumio Takahashi ,  Yoshiaki Kitajima

IPC分类号： H01F27/29 ,  H01F7/06

CPC分类号： H01F17/045 ,  H01F27/027 ,  H01F27/292 ,  H01F27/327 ,  H01F2027/065 ,  Y10T29/4902 ,  Y10T29/49071 ,  Y10T29/49073 ,  Y10T29/49174

摘要： A coil component having an easily discernible orientation, and a method of producing such a coil component that facilitates the injection of resin. A coil component includes a core with a winding portion, first and second flanges disposed on either end of the winding portion, and a winding accommodating region defined by the winding portion and the first and second flanges, terminal electrodes disposed on the second flange and a winding wound about the winding portion and connected to the terminal electrodes. An insulating resin is formed over the winding at the winding accommodating region. A marker made from a material the same as the insulating resin is provided at outer peripheral surface of the flanges.

摘要翻译： 具有容易识别的取向的线圈部件，以及制造有助于树脂注入的这种线圈部件的方法。 线圈部件包括具有绕组部分的芯部，布置在绕组部分的任一端上的第一和第二凸缘以及由绕组部分和第一和第二凸缘限定的绕组容纳区域，设置在第二凸缘上的端子电极和 缠绕在绕组部分上并连接到端子电极。 在卷绕容纳区域的绕组上形成绝缘树脂。 由与绝缘树脂相同的材料制成的标记设置在凸缘的外周面上。

公开(公告)号：US20050247407A1

公开(公告)日：2005-11-10

申请号：US11183751

申请日：2005-07-19

申请人： Ko Onodera ,  Satoshi Kurimoto

发明人： Ko Onodera ,  Satoshi Kurimoto

IPC分类号： H01L23/48 ,  H01G13/00 ,  B32B31/00

CPC分类号： H01G13/006 ,  Y10S156/922 ,  Y10S156/941 ,  Y10T29/417 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T156/11 ,  Y10T156/17 ,  Y10T156/1702 ,  Y10T156/1707 ,  Y10T156/19 ,  Y10T156/1906

摘要： The invention provides an electrode forming method with steps of arraying chip-style electronic components on an arraying flat bed thereby positioning and aligning the components, lowering a film coated with an adhesive in relative manner together with an adhering top plate parallel to the arraying flat bed thereby adhering ends of the positioned and aligned chip-style electronic components to the adhesive, then lowering the first film to which the chip-style electronic components are adhered in relative manner together with a coating top plate parallel to a coating flat bed provided with a conductive paste layer of a constant thickness thereby pressing the other ends of the chip-style electronic components to the coating flat bed and coating the ends of the electronic components with the conductive paste.

摘要翻译： 本发明提供了一种电极形成方法，该方法具有以下步骤：在阵列平板上排列芯片式电子部件，由此定位和对准部件，相对于平行于排列平板的粘合顶板，以相对的方式将涂覆有粘合剂的膜降低 从而将定位的和对准的芯片式电子部件的端部粘合到粘合剂上，然后将与芯片式电子部件粘附的第一膜相对于平行于涂覆平板的涂层顶板相对降低， 导电浆料层，从而将芯片式电子部件的另一端压入涂布平板，并用导电膏涂覆电子部件的端部。

公开(公告)号：US06749890B2

公开(公告)日：2004-06-15

申请号：US09820846

申请日：2001-03-30

申请人： Ko Onodera ,  Satoshi Kurimoto

发明人： Ko Onodera ,  Satoshi Kurimoto

IPC分类号： B05D512

CPC分类号： H01G13/006 ,  Y10S156/922 ,  Y10S156/941 ,  Y10T29/417 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T156/11 ,  Y10T156/17 ,  Y10T156/1702 ,  Y10T156/1707 ,  Y10T156/19 ,  Y10T156/1906

摘要： The invention provides an electrode forming method with steps of arraying chip-style electronic components on an arraying flat bed thereby positioning and aligning the components, lowering a film coated with an adhesive in relative manner together with an adhering top plate parallel to the arraying flat bed thereby adhering ends of the positioned and aligned chip-style electronic components to the adhesive, then lowering the first film to which the chip-style electronic components are adhered in relative manner together with a coating top plate parallel to a coating flat bed provided with a conductive paste layer of a constant thickness thereby pressing the other ends of the chip-style electronic components to the coating flat bed and coating the ends of the electronic components with the conductive paste.

公开(公告)号：US08112872B2

公开(公告)日：2012-02-14

申请号：US12213749

申请日：2008-06-24

申请人： Shinichi Sato ,  Satoshi Kurimoto ,  Makoto Morita ,  Akira Takashima ,  Sumio Takahashi ,  Yoshiaki Kitajima

发明人： Shinichi Sato ,  Satoshi Kurimoto ,  Makoto Morita ,  Akira Takashima ,  Sumio Takahashi ,  Yoshiaki Kitajima

IPC分类号： H01F7/128 ,  H01F7/127

CPC分类号： H01F17/045 ,  H01F27/027 ,  H01F27/292 ,  H01F27/327 ,  H01F2027/065 ,  Y10T29/4902 ,  Y10T29/49071 ,  Y10T29/49073 ,  Y10T29/49174

摘要： A coil component having an easily discernible orientation, and a method of producing such a coil component that facilitates the injection of resin. A coil component includes a core with a winding portion, first and second flanges disposed on either end of the winding portion, and a winding accommodating region defined by the winding portion and the first and second flanges, terminal electrodes disposed on the second flange and a winding wound about the winding portion and connected to the terminal electrodes. An insulating resin is formed over the winding at the winding accommodating region. A marker made from a material the same as the insulating resin is provided at outer peripheral surface of the flanges.

摘要翻译： 具有容易识别的取向的线圈部件，以及制造有助于树脂注入的这种线圈部件的方法。 线圈部件包括具有绕组部分的芯部，布置在绕组部分的任一端上的第一和第二凸缘以及由绕组部分和第一和第二凸缘限定的绕组容纳区域，设置在第二凸缘上的端子电极和 缠绕在绕组部分上并连接到端子电极。 在卷绕容纳区域的绕组上形成绝缘树脂。 由与绝缘树脂相同的材料制成的标记设置在凸缘的外周面上。

公开(公告)号：US07803421B2

公开(公告)日：2010-09-28

申请号：US11636622

申请日：2006-12-11

申请人： Ko Onodera ,  Satoshi Kurimoto ,  Yoji Tozawa ,  Shirou Ootsuki

发明人： Ko Onodera ,  Satoshi Kurimoto ,  Yoji Tozawa ,  Shirou Ootsuki

IPC分类号： B05D5/12 ,  B05D1/18 ,  H01G7/00

CPC分类号： H01G13/006 ,  H01L21/4867 ,  H01L23/49805 ,  H01L24/11 ,  H01L2224/1131 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01082 ,  H05K3/403 ,  Y10T29/43

摘要： An element forming an electronic component has a first face and a second face facing each other, and a third face adjacent to each of the first face and the second face. A method of forming an external electrode of the electronic component involves a pre-formation step, first to third formation steps, and an electrode formation step. The pre-formation step is to apply a conductive paste onto the third face and to evaporate at least a part of a liquid contained in the applied conductive paste, to form a precoat portion expected to become a part of a third electrode portion. The first formation step is to apply the conductive paste from a direction opposite to the first face, onto the first face to form a first electrode portion. The second formation step is to apply the conductive paste from a direction opposite to the second face, onto the second face to form a second electrode portion. The third formation step is to apply the conductive paste onto the third face so as to cover the precoat portion, to form the third electrode portion. The electrode formation step is to dry the element to form the external electrode consisting of the first electrode portion, the second electrode portion, and the third electrode portion. The first electrode portion, the second electrode portion, and the third electrode portion are formed so as to connect with each other.

摘要翻译： 形成电子部件的元件具有彼此相对的第一面和第二面以及与第一面和第二面中的每一个相邻的第三面。 形成电子部件的外部电极的方法包括预成形工序，第一〜第三形成工序以及电极形成工序。 预成形步骤是将导电浆料涂敷在第三面上，蒸发所涂敷的导电浆料中含有的液体的至少一部分，形成预期成为第三电极部分的一部分的预涂部分。 第一形成步骤是将导电膏从与第一面相反的方向涂覆到第一面上以形成第一电极部分。 第二形成步骤是将导电膏从与第二面相反的方向涂覆到第二面上以形成第二电极部分。 第三形成步骤是将导电膏涂覆到第三面以覆盖预涂部分，以形成第三电极部分。 电极形成步骤是干燥元件以形成由第一电极部分，第二电极部分和第三电极部分组成的外部电极。 第一电极部分，第二电极部分和第三电极部分形成为彼此连接。

公开(公告)号：US20100043221A1

公开(公告)日：2010-02-25

申请号：US12588613

申请日：2009-10-21

申请人： Ko Onodera ,  Satoshi Kurimoto ,  Yoji Tozawa ,  Shirou Ootsuki

发明人： Ko Onodera ,  Satoshi Kurimoto ,  Yoji Tozawa ,  Shirou Ootsuki

IPC分类号： H01R43/00

CPC分类号： H01G13/006 ,  Y10T29/49098 ,  Y10T29/49101 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49155

摘要： A method of forming an external electrode of an electronic component involving: a paste preparation step, a removal step, an element preparation step, a contact step, and a formation step. A jig with a groove into which an element forming the electronic component can be inserted is prepared. A conductive paste is filled in the groove, and then removed, so as to leave the conductive paste along a first wall surface of the groove and remove the rest. Then, element immediately above the groove is located, and inserted into the groove and moved toward the first wall surface. Finally, the element is moved along the first wall surface and toward the aperture in a state in which the ridgeline of the element is kept in contact with the first wall surface, and moved away from the first wall surface so as to separate the ridgeline from the first wall surface.

摘要翻译： 一种形成电子部件的外部电极的方法，包括：糊剂制备步骤，去除步骤，元件制备步骤，接触步骤和形成步骤。 准备具有可插入形成电子部件的元件的槽的夹具。 将导电浆料填充在凹槽中，然后除去，以便沿沟槽的第一壁表面离开导电膏，并将其余部分除去。 然后，立即在凹槽上方的元件被定位并且插入凹槽中并朝向第一壁表面移动。 最后，元件在元件的棱线与第一壁表面保持接触的状态下沿着第一壁表面移动并朝向孔径移动，并且从第一壁表面移开，以将棱线与第一壁表面分开 第一个墙面。

公开(公告)号：US08181340B2

公开(公告)日：2012-05-22

申请号：US12588613

申请日：2009-10-21

申请人： Ko Onodera ,  Satoshi Kurimoto ,  Yoji Tozawa ,  Shirou Ootsuki

发明人： Ko Onodera ,  Satoshi Kurimoto ,  Yoji Tozawa ,  Shirou Ootsuki

IPC分类号： H05K3/02 ,  H05K3/10

CPC分类号： H01G13/006 ,  Y10T29/49098 ,  Y10T29/49101 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49155

摘要： A method of forming an external electrode of an electronic component involving: a paste preparation step, a removal step, an element preparation step, a contact step, and a formation step. A jig with a groove into which an element forming the electronic component can be inserted is prepared. A conductive paste is filled in the groove, and then removed, so as to leave the conductive paste along a first wall surface of the groove and remove the rest. Then, element immediately above the groove is located, and inserted into the groove and moved toward the first wall surface. Finally, the element is moved along the first wall surface and toward the aperture in a state in which the ridgeline of the element is kept in contact with the first wall surface, and moved away from the first wall surface so as to separate the ridgeline from the first wall surface.

摘要翻译： 一种形成电子部件的外部电极的方法，包括：糊剂制备步骤，去除步骤，元件制备步骤，接触步骤和形成步骤。 准备具有可插入形成电子部件的元件的槽的夹具。 将导电浆料填充在凹槽中，然后除去，以便沿沟槽的第一壁表面离开导电膏，并将其余部分除去。 然后，立即在凹槽上方的元件被定位并且插入凹槽中并朝向第一壁表面移动。 最后，元件在元件的棱线与第一壁表面保持接触的状态下沿着第一壁表面移动并朝向孔径移动，并且从第一壁表面移开，以将棱线与第一壁表面分开 第一个墙面。

公开(公告)号：US08106506B2

公开(公告)日：2012-01-31

申请号：US12406688

申请日：2009-03-18

申请人： Yukihiro Murakami ,  Yoshihiko Satoh ,  Katsunari Moriai ,  Kazuto Takeya ,  Satoshi Kurimoto

发明人： Yukihiro Murakami ,  Yoshihiko Satoh ,  Katsunari Moriai ,  Kazuto Takeya ,  Satoshi Kurimoto

IPC分类号： H01L23/34 ,  H01L23/48

CPC分类号： H01G2/06 ,  H01G4/005 ,  H05K3/3436

摘要： An electronic component has an element body, and a plurality of external electrodes formed on one principal face of the element body. Each external electrode has a first electrode layer joined to the one principal face of the element body, and a second electrode layer joined as laid on an inside region inside an edge of the first electrode layer. An apical surface of the second electrode layer is planar. A joint portion in the second electrode layer to the first electrode layer is rounded.

摘要翻译： 电子部件具有元件主体和形成在元件主体的一个主面上的多个外部电极。 每个外部电极具有接合到元件主体的一个主面的第一电极层和接合成第一电极层的边缘内侧的内部区域的第二电极层。 第二电极层的顶面是平面的。 第二电极层与第一电极层的接合部分是圆形的。