公开(公告)号：US20150070849A1

公开(公告)日：2015-03-12

申请号：US14090445

申请日：2013-11-26

Applicant: Taiyo Yuden Co., Ltd.

Inventor： Masaya SHIMAMURA ,  Takehiko KAI ,  Eiji MUGIYA ,  Tetsuo SAJI ,  Hiroshi NAKAMURA

IPC: H05K1/02

CPC classification number: H05K1/0216 ,  H01L21/561 ,  H01L23/3135 ,  H01L23/552 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2924/12042 ,  H01L2924/15159 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19105 ,  H05K1/0215 ,  H05K1/0269 ,  H05K3/284 ,  H05K5/065 ,  H05K9/0037 ,  H05K9/0083 ,  H05K2201/09036 ,  H05K2201/09145 ,  H05K2201/09972 ,  H05K2201/1056 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012

Abstract: There is provided a circuit module including a circuit substrate having a mount surface; a mount component mounted on the mount surface; a sealing body formed on the mount surface, the sealing body covering the mount component and having a trench formed from a main surface of the sealing body to the mount surface; and a shield having an inner shield section formed within the trench and an outer shield section that covers the sealing body and the inner shield section, the outer shield section including a first section having a flat surface formed on the main surface of the shielding body and a second section formed on the inner shield section and protruded or sagged from the first section.

Abstract translation: 提供一种电路模块，包括具有安装表面的电路基板; 安装在安装表面上的安装部件; 所述密封体形成在所述安装表面上，所述密封体覆盖所述安装部件，并且具有从所述密封体的主表面到所述安装表面形成的沟槽; 以及屏蔽体，其具有形成在所述沟槽内的内屏蔽部和覆盖所述密封体和所述内屏蔽部的外屏蔽部，所述外屏蔽部具有形成在所述屏蔽体的主表面上的平坦面的第一部， 形成在所述内屏蔽部上并从所述第一部分突出或下垂的第二部分。

公开(公告)号：US20150043170A1

公开(公告)日：2015-02-12

申请号：US14086407

申请日：2013-11-21

Applicant: Taiyo Yuden Co., Ltd.

Inventor： Masaya SHIMAMURA ,  Kenzo KITAZAKI ,  Yutaka NAGAI ,  Hiroshi NAKAMURA ,  Tetsuo SAJI ,  Eiji MUGIYA

IPC: H05K9/00 ,  H05K3/30 ,  H05K1/18

CPC classification number: H05K9/00 ,  H01L21/561 ,  H01L23/3121 ,  H01L23/552 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2924/12042 ,  H01L2924/15159 ,  H01L2924/1531 ,  H01L2924/181 ,  H01L2924/19105 ,  H05K1/0218 ,  H05K1/0271 ,  H05K1/186 ,  H05K3/0052 ,  H05K3/284 ,  H05K3/301 ,  H05K2201/0715 ,  Y10T29/4913 ,  H01L2224/81 ,  H01L2924/00

Abstract: A circuit module includes a substrate, a mount component, a sealing body, a trench and a shield. The substrate has a mount surface. The mount component is mounted on the mount surface. The sealing body has a main surface and an outer peripheral surface, the sealing body sealing the mount component, the main surface sandwiching the mount component between the main surface and the mount surface, the outer peripheral surface covering the mount component on the mount surface. The trench has a groove-like shape, the trench being recessed from the main surface of the sealing body to the mount surface, the trench being formed to leave a space between the trench and the outer peripheral surface. The shield covers the main surface and the outer peripheral surface of the sealing body, the shield being filled in the trench.

Abstract translation: 电路模块包括基板，安装部件，密封体，沟槽和屏蔽件。 基板具有安装表面。 安装部件安装在安装表面上。 密封体具有主表面和外周面，密封体密封安装部件，主表面将安装部件夹在主表面和安装表面之间，外周表面覆盖安装部件在安装表面上。 沟槽具有凹槽状形状，沟槽从密封体的主表面凹入到安装表面，沟槽形成为在沟槽和外周表面之间留出空间。 屏蔽覆盖密封体的主表面和外周表面，屏蔽件被填充在沟槽中。

公开(公告)号：US20130271928A1

公开(公告)日：2013-10-17

申请号：US13849364

申请日：2013-03-22

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Masaya SHIMAMURA ,  Eiji MUGIYA

IPC: H05K9/00 ,  H05K13/00

CPC classification number: H05K9/0084 ,  H01L23/552 ,  H01L24/97 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/15192 ,  H01L2924/351 ,  H05K1/0218 ,  H05K3/284 ,  H05K5/0095 ,  H05K9/0037 ,  H05K13/00 ,  H05K2201/09972 ,  H05K2201/10371 ,  Y10T29/49146 ,  H01L2924/00

Abstract: A circuit module pertaining to an embodiment of the present invention has a board, multiple electronic components, a shield member, sealing layer, and cover layer. The board has a mounting surface that includes a first area and second area in which the multiple electronic components are mounted. The shield member is constituted by conductive material and placed between the first area and second area on the mounting surface. The sealing layer has on its top surface a groove having its bottom face including an upper end face of the shield member, is formed on the mounting surface, and is constituted by an insulator that covers the multiple electronic components. The cover layer is constituted by conductive material and has a first cover part that fills the groove as well as a second cover part that covers the first cover part and sealing layer.

Abstract translation: 关于本发明的实施例的电路模块具有板，多个电子部件，屏蔽部件，密封层和覆盖层。 该电路板具有安装表面，该安装表面包括安装多个电子部件的第一区域和第二区域。 屏蔽构件由导电材料构成，并被放置在安装表面上的第一区域和第二区域之间。 密封层在其顶面上具有包括屏蔽部件的上端面的底面的槽，形成在安装面上，由覆盖多个电子部件的绝缘体构成。 覆盖层由导电材料构成，并且具有填充槽的第一盖部以及覆盖第一盖部和密封层的第二盖部。