公开(公告)号：US12163034B2

公开(公告)日：2024-12-10

申请号：US17272070

申请日：2019-08-15

Applicant: TANAKA KIKINZOKU KOGYO K.K.

Inventor： Yuusuke Ohshima ,  Yuichi Makita ,  Hiroki Sato ,  Noriaki Nakamura ,  Kenjiro Koshiji ,  Masato Kasuga ,  Hitoshi Kubo

IPC: C09D11/037 ,  B22F1/00 ,  B22F9/00 ,  B22F9/30 ,  C09D11/02 ,  C09D11/03 ,  C09D11/033 ,  C09D11/52 ,  H01B1/00 ,  H01B1/22 ,  B82Y30/00 ,  B82Y40/00

Abstract: A silver ink including silver particles and a protective agent containing at least one amine compound dispersed in a dispersion medium containing, as a main solvent, a solvent having a vapor pressure at 20° C. of 40 mmHg or less and a vapor pressure at 70° C. of 0.09 mmHg or more, in an amount of 80% or more on a mass basis relative to the total dispersion medium. The amine compound has a mass average molecular weight of 115 or less, and the total amount of the amine compound is 1 part by weight or more and 14 parts by weight or less per 100 parts by weight of the silver particles. The silver ink has a moisture content of 500 ppm or more and 50,000 ppm or less and enables a practical metal film to be formed even through calcination at a low temperature of 70° C. or less.

公开(公告)号：US11864325B2

公开(公告)日：2024-01-02

申请号：US17613569

申请日：2020-06-18

Applicant: TANAKA KIKINZOKU KOGYO K.K.

Inventor： Kenjiro Koshiji ,  Yuichi Makita ,  Noriaki Nakamura ,  Masato Kasuga ,  Yuusuke Ohshima ,  Hiroki Sato ,  Shigeyuki Ootake ,  Hitoshi Kubo

IPC: H05K3/12 ,  B05D3/10 ,  B05D5/06 ,  B05D7/24 ,  B05D7/00 ,  C09D11/03 ,  C09D11/52

CPC classification number: H05K3/12 ,  B05D3/10 ,  B05D5/067 ,  B05D7/24 ,  B05D7/54 ,  C09D11/03 ,  C09D11/52

Abstract: The present invention relates to a method for forming a metal pattern on a pattern formation section set on a base material. In the present invention, a substrate provided with a fluorine-containing resin layer on a surface of the base material including the pattern formation section is used. The present inventive method for forming a metal pattern includes steps of: forming a functional group on the pattern formation section; and applying a metal ink including an amine compound and a fatty acid as protective agents to the base material surface to fix the metal particles on the pattern formation section. In the present invention, a fluorine-containing resin having a surface free energy measured by the Owens-Wendt method of 13 mN/m or more and 20 mN/m or less is applied as the fluorine-containing resin layer. Further, a metal ink including ethyl cellulose as an additive is applied as the metal ink.

公开(公告)号：US09901985B2

公开(公告)日：2018-02-27

申请号：US14891725

申请日：2014-05-20

Applicant: Tanaka Kikinzoku Kogyo K.K.

Inventor： Yuichi Makita ,  Yuusuke Ohshima ,  Hidekazu Matsuda ,  Noriaki Nakamura ,  Junichi Taniuchi ,  Hitoshi Kubo

IPC: B22F9/30 ,  B22F1/00

CPC classification number: B22F9/30 ,  B22F1/0018 ,  B22F2301/255 ,  B22F2304/054 ,  B22F2304/056 ,  B22F2999/00

Abstract: The present invention provides a method for producing silver particles, the method capable of adjusting the particle diameter to be within the range of several tens of nanometers to several hundreds of nanometers and also producing silver particles with a uniform particle diameter. The present invention relates to a method for producing silver particles by heating of a reaction system containing a thermally-decomposable silver-amine complex precursor, including a process of producing a silver-amine complex, a process of adding an organic compound having an amide (carboxylic amide) as a skeleton to a reaction system, and a process of heating the reaction system, in which a water content in the reaction system before the heating is 20 to 100 parts by weight relative to 100 parts by weight of the silver compound. The present invention can produce uniform silver particles while the particle diameter is controlled.

公开(公告)号：US09565776B2

公开(公告)日：2017-02-07

申请号：US14429702

申请日：2013-09-27

Applicant: Tanaka Kikinzoku Kogyo K.K. ,  A School Corporation Kansai University

Inventor： Noriaki Nakamura ,  Junichi Taniuchi ,  Hitoshi Kubo ,  Yuusuke Ohshima ,  Tomoko Ishikawa ,  Shoso Shingubara ,  Fumihiro Inoue

IPC: B05D5/12 ,  H05K3/42 ,  H05K3/38

CPC classification number: H05K3/422 ,  C23C18/1893 ,  C23C18/208 ,  C23C18/2086 ,  C23C18/30 ,  C23C18/34 ,  H05K3/387 ,  H05K3/389 ,  H05K3/426

Abstract: The present invention provides a method for treating a substrate that supports metal fine particles for forming a plating layer on a circuit pattern or TSVs in various substrates, in which further micronization treatment is enabled compared with the conventional methods, and the formation of a stable plating layer is enabled. The present invention is a method for treating a substrate, the method including bringing a substrate into contact with a colloidal solution containing metal particles in order to support the metal particles that serve as a catalyst for forming a plating layer on the substrate, in which the colloidal solution contains metal particles formed of Pd and having a particle size of 0.6 nm to 4.0 nm and a face-to-face dimension of the (111) plane of 2.254 Å or more. When an organic layer such as SAM is formed on a surface of the substrate before this treatment, the binding force of the Pd particles can be increased.

Abstract translation: 本发明提供一种处理基板的方法，该基板用于在各种基板上的电路图形或TSV上支撑用于形成镀层的金属微粒，与常规方法相比，能够进一步进行微粉化处理，并形成稳定的电镀 层被启用。 本发明是一种处理基板的方法，该方法包括使基板与含有金属颗粒的胶体溶液接触，以便支撑用作在基板上形成镀层的催化剂的金属颗粒，其中 胶体溶液含有由Pd形成的并且具有0.6nm至4.0nm的粒径和（111）面的面对面尺寸为2.254或更大的金属颗粒。 当在该处理之前在基板的表面上形成诸如SAM的有机层时，可以增加Pd颗粒的结合力。

公开(公告)号：US20150245480A1

公开(公告)日：2015-08-27

申请号：US14614196

申请日：2013-07-11

Applicant: TANAKA KIKINZOKU KOGYO K.K.

Inventor： Hitoshi Kubo ,  Yusuke Ohshima ,  Noriaki Nakamura ,  Hiroshi Noguchi ,  Junichi Taniuchi ,  Yuichi Makita

IPC: H05K1/09 ,  H01B1/22 ,  B22F1/00 ,  C09D11/52

CPC classification number: H05K1/097 ,  B22F1/0044 ,  B22F1/0062 ,  B22F9/30 ,  B22F2001/0066 ,  B22F2998/10 ,  C09D11/52 ,  H01B1/22 ,  H05K3/1291 ,  Y10T428/268 ,  B22F3/10

Abstract: Provided are a fine silver particle ink composed of hexylamine, dodecylamine, oleic acid, fine silver particles and a solvent, in which the volume resistivity of a sintered body at 100° C. obtained after the ink is applied on a substrate by spin coating is 8 to 25 μΩcm, a sintered body thereof, and a method for producing a fine silver particle ink. When a fine silver particle ink containing coated fine silver particles is produced by a silver-amine complex decomposition method, production can be carried out smoothly. The fine silver particle ink can be sintered even at a low temperature, and a sintered body thereof has a mirror surface and low volume resistance.

Abstract translation: 提供一种由己胺，十二烷胺，油酸，细银粒子和溶剂构成的细银粒子墨，其中通过旋涂将油墨施加到基底上后获得的在100℃下的烧结体的体积电阻率是 8〜25μΩ·cm，其烧结体及其制造方法。 当通过银 - 胺络合物分解方法产生含有包覆的细银颗粒的细银颗粒油墨时，可以顺利进行生产。 即使在低温下也可以烧结细银粒子墨，并且其烧结体具有镜面和低体积电阻。