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1.发明申请SUBSTRATE PROCESSING METHOD FOR SUPPORTING A CATALYST PARTICLE FOR PLATING PROCESS 有权用于支撑用于镀层工艺的催化剂颗粒的基板处理方法公开(公告)号：US20150237742A1
公开(公告)日：2015-08-20
申请号：US14429702
申请日：2013-09-27
Inventor： Noriaki Nakamura , Junichi Taniuchi , Hitoshi Kubo , Yuusuke Ohshima , Tomoko Ishikawa , Shoso Shingubara , Fumihiro Inoue
CPC classification number: H05K3/422 , C23C18/1893 , C23C18/208 , C23C18/2086 , C23C18/30 , C23C18/34 , H05K3/387 , H05K3/389 , H05K3/426
Abstract: The present invention provides a method for treating a substrate that supports metal fine particles for forming a plating layer on a circuit pattern or TSVs in various substrates, in which further micronization treatment is enabled compared with the conventional methods, and the formation of a stable plating layer is enabled. The present invention is a method for treating a substrate, the method including bringing a substrate into contact with a colloidal solution containing metal particles in order to support the metal particles that serve as a catalyst for forming a plating layer on the substrate, in which the colloidal solution contains metal particles formed of Pd and having a particle size of 0.6 nm to 4.0 nm and a face-to-face dimension of the (111) plane of 2.254 Å or more. When an organic layer such as SAM is formed on a surface of the substrate before this treatment, the binding force of the Pd particles can be increased.
Abstract translation: 本发明提供一种处理基板的方法，该基板用于在各种基板上的电路图形或TSV上支撑用于形成镀层的金属微粒，与常规方法相比，能够进一步进行微粉化处理，并形成稳定的电镀 层被启用。 本发明是一种处理基板的方法，该方法包括使基板与含有金属颗粒的胶体溶液接触，以便支撑用作在基板上形成镀层的催化剂的金属颗粒，其中 胶体溶液含有由Pd形成的并且具有0.6nm至4.0nm的粒径和（111）面的面对面尺寸为2.254或更大的金属颗粒。 当在该处理之前在基板的表面上形成诸如SAM的有机层时，可以增加Pd颗粒的结合力。
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公开(公告)号：US12035470B2
公开(公告)日：2024-07-09
申请号：US17294260
申请日：2019-11-13
Applicant: TANAKA KIKINZOKU KOGYO K.K.
Inventor： Kenjiro Koshiji , Yuichi Makita , Noriaki Nakamura , Masato Kasuga , Yuusuke Ohshima , Hiroki Sato , Hitoshi Kubo
IPC: H05K1/09 , C09D11/037 , H01B1/02 , H05K3/12 , C09D11/52
CPC classification number: H05K1/092 , C09D11/037 , H01B1/026 , H05K3/1258 , C09D11/52
Abstract: An electroconductive substrate including a base material and a metal wiring made of at least either of silver and copper, and the electroconductive substrate has an antireflection region formed on part or all of the metal wiring surface. This antireflection region is composed of roughened particles made of at least either of silver and copper and blackened particles finer than the roughened particles and embedded between the roughened particles. The blackened particles are made of silver or a silver compound, copper or a copper compound, or carbon or an organic substance having a carbon content of 25 wt % or more. The antireflection region has a surface with a center line average roughness of 15 nm or more and 70 nm or less. The electroconductive substrate is formed from metal wiring from a metal ink that forms roughened particles, followed by application of a blackening ink containing blackened particles.
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公开(公告)号：US11149161B2
公开(公告)日：2021-10-19
申请号：US16618095
申请日：2018-08-01
Applicant: TANAKA KIKINZOKU KOGYO K.K.
Inventor： Yuusuke Ohshima , Yuichi Makita , Teruhisa Iwai , Hitoshi Kubo , Shigeki Yamanaka , Masahiro Ito , Shingo Watanabe
IPC: C09D11/52 , C09D11/037 , H01B1/22
Abstract: A metal ink containing metal particles including silver, a protective agent A including an amine compound, and a protective agent B including a fatty acid. The metal ink is configured such that the protective agent A includes at least one C4-12 amine compound, and the protective agent B includes at least one C22-26 fatty acid. It is preferable that the amine compound content is 0.2 mmol/g or more and 1.5 mmol/g or less on a silver particle mass basis. In addition, it is preferable that the fatty acid content is 0.01 mmol/g or more and 0.06 mmol/g or less on a silver particle mass basis.
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公开(公告)号：US10220377B2
公开(公告)日：2019-03-05
申请号：US14370392
申请日：2013-02-08
Applicant: Tanaka Kikinzoku Kogyo K.K.
Inventor： Yuusuke Ohshima , Hitoshi Kubo , Tomoko Ishikawa , Noriaki Nakamura , Junichi Taniuchi , Yoshiteru Tsuchiya , Hiroaki Takahashi , Hidenori Takanezawa , Kenichi Inoue , Syunsuke Kato , Hirokazu Shiraishi
IPC: B22F1/00 , B22F9/24 , B01J31/26 , B01J31/28 , B01D61/14 , B01J13/00 , B01J31/30 , B82Y30/00 , B82Y40/00
Abstract: The present invention is a metal colloid solution comprising: colloidal particles consisting of metal particles consisting of one or two or more metal(s) and a protective agent bonding to the metal particles; and a solvent as a dispersion medium of the colloidal particles, wherein: a chloride ion concentration per a metal concentration of 1 mass % is 25 ppm or less; and a nitrate ion concentration per a metal concentration of 1 mass % is 7500 ppm or less. In the present invention, adsorption performance can be improved with adjustment of the amount of the protective agent of the colloidal particles. It is preferable to bind the protective agent of 0.2 to 2.5 times the mass of the metal particles.
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公开(公告)号：US20140357470A1
公开(公告)日：2014-12-04
申请号：US14370392
申请日：2013-02-08
Applicant: Tanaka Kikinzoku Kogyo K.K.
Inventor： Yuusuke Ohshima , Hitoshi Kubo , Tomoko Ishikawa , Noriaki Nakamura , Junichi Taniuchi , Yoshiteru Tsuchiya , Hiroaki Takahashi , Hidenori Takanezawa , Kenichi Inoue , Syunsuke Kato , Hirokazu Shiraishi
CPC classification number: B01J31/30 , B01D61/145 , B01J13/0039 , B01J13/0043 , B01J31/26 , B01J31/28 , B22F1/0062 , B22F9/24 , B22F2001/0092 , B82Y30/00 , B82Y40/00
Abstract: The present invention is a metal colloid solution comprising: colloidal particles consisting of metal particles consisting of one or two or more metal(s) and a protective agent bonding to the metal particles; and a solvent as a dispersion medium of the colloidal particles, wherein: a chloride ion concentration per a metal concentration of 1 mass % is 25 ppm or less; and a nitrate ion concentration per a metal concentration of 1 mass % is 7500 ppm or less. In the present invention, adsorption performance can be improved with adjustment of the amount of the protective agent of the colloidal particles. It is preferable to bind the protective agent of 0.2 to 2.5 times the mass of the metal particles.
Abstract translation: 本发明是一种金属胶体溶液，其包括：由一种或两种以上金属组成的金属颗粒和与金属颗粒结合的保护剂组成的胶体颗粒; 和作为胶体粒子的分散介质的溶剂，其中，每1质量％的金属浓度的氯离子浓度为25ppm以下; 每1质量％的金属浓度的硝酸根离子浓度为7500ppm以下。 在本发明中，通过调整胶体粒子的保护剂的量，能够提高吸附性能。 优选将保护剂结合金属颗粒的质量的0.2〜2.5倍。
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Patent Agency Ranking
公开(公告)号：US12163034B2
公开(公告)日：2024-12-10
申请号：US17272070
申请日：2019-08-15
Applicant: TANAKA KIKINZOKU KOGYO K.K.
Inventor： Yuusuke Ohshima , Yuichi Makita , Hiroki Sato , Noriaki Nakamura , Kenjiro Koshiji , Masato Kasuga , Hitoshi Kubo
IPC: C09D11/037 , B22F1/00 , B22F9/00 , B22F9/30 , C09D11/02 , C09D11/03 , C09D11/033 , C09D11/52 , H01B1/00 , H01B1/22 , B82Y30/00 , B82Y40/00
Abstract: A silver ink including silver particles and a protective agent containing at least one amine compound dispersed in a dispersion medium containing, as a main solvent, a solvent having a vapor pressure at 20° C. of 40 mmHg or less and a vapor pressure at 70° C. of 0.09 mmHg or more, in an amount of 80% or more on a mass basis relative to the total dispersion medium. The amine compound has a mass average molecular weight of 115 or less, and the total amount of the amine compound is 1 part by weight or more and 14 parts by weight or less per 100 parts by weight of the silver particles. The silver ink has a moisture content of 500 ppm or more and 50,000 ppm or less and enables a practical metal film to be formed even through calcination at a low temperature of 70° C. or less.
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公开(公告)号：US11967441B2
公开(公告)日：2024-04-23
申请号：US18012647
申请日：2021-06-28
Applicant: TANAKA KIKINZOKU KOGYO K.K.
Inventor： Hiroki Sato , Yuusuke Ohshima , Shigeyuki Ootake
CPC classification number: H01B1/22 , B22F1/056 , B22F1/107 , B22F3/10 , B22F5/12 , B22F2003/1042 , B22F2301/255 , B22F2304/056
Abstract: The present invention relates to a metal wiring, to be formed on a flexible substrate, including a sintered body of silver particles. The sintered body constituting the metal wiring has a volume resistivity of 20 μΩ·cm or less, hardness of 0.38 GPa or less, and a Young's modulus of 7.0 GPa or less. A conductive sheet provided with the metal wiring can be produced by applying/calcinating, on a substrate, a metal paste containing, as a solid content, silver particles having prescribed particle size and particle size distribution, and further containing, as a conditioner, an ethyl cellulose having a number average molecular weight of 10,000 or more and 90,000 or less. The metal wiring of the present invention is excellent in bending resistance with change in electrical characteristics suppressed even through repetitive bending deformation.
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公开(公告)号：US11864325B2
公开(公告)日：2024-01-02
申请号：US17613569
申请日：2020-06-18
Applicant: TANAKA KIKINZOKU KOGYO K.K.
Inventor： Kenjiro Koshiji , Yuichi Makita , Noriaki Nakamura , Masato Kasuga , Yuusuke Ohshima , Hiroki Sato , Shigeyuki Ootake , Hitoshi Kubo
CPC classification number: H05K3/12 , B05D3/10 , B05D5/067 , B05D7/24 , B05D7/54 , C09D11/03 , C09D11/52
Abstract: The present invention relates to a method for forming a metal pattern on a pattern formation section set on a base material. In the present invention, a substrate provided with a fluorine-containing resin layer on a surface of the base material including the pattern formation section is used. The present inventive method for forming a metal pattern includes steps of: forming a functional group on the pattern formation section; and applying a metal ink including an amine compound and a fatty acid as protective agents to the base material surface to fix the metal particles on the pattern formation section. In the present invention, a fluorine-containing resin having a surface free energy measured by the Owens-Wendt method of 13 mN/m or more and 20 mN/m or less is applied as the fluorine-containing resin layer. Further, a metal ink including ethyl cellulose as an additive is applied as the metal ink.
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公开(公告)号：US09901985B2
公开(公告)日：2018-02-27
申请号：US14891725
申请日：2014-05-20
Applicant: Tanaka Kikinzoku Kogyo K.K.
Inventor： Yuichi Makita , Yuusuke Ohshima , Hidekazu Matsuda , Noriaki Nakamura , Junichi Taniuchi , Hitoshi Kubo
CPC classification number: B22F9/30 , B22F1/0018 , B22F2301/255 , B22F2304/054 , B22F2304/056 , B22F2999/00
Abstract: The present invention provides a method for producing silver particles, the method capable of adjusting the particle diameter to be within the range of several tens of nanometers to several hundreds of nanometers and also producing silver particles with a uniform particle diameter. The present invention relates to a method for producing silver particles by heating of a reaction system containing a thermally-decomposable silver-amine complex precursor, including a process of producing a silver-amine complex, a process of adding an organic compound having an amide (carboxylic amide) as a skeleton to a reaction system, and a process of heating the reaction system, in which a water content in the reaction system before the heating is 20 to 100 parts by weight relative to 100 parts by weight of the silver compound. The present invention can produce uniform silver particles while the particle diameter is controlled.
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10.发明授权Method for treating substrate that support catalyst particles for plating processing 有权用于处理支撑用于电镀处理的催化剂颗粒的基材的方法公开(公告)号：US09565776B2
公开(公告)日：2017-02-07
申请号：US14429702
申请日：2013-09-27
Inventor： Noriaki Nakamura , Junichi Taniuchi , Hitoshi Kubo , Yuusuke Ohshima , Tomoko Ishikawa , Shoso Shingubara , Fumihiro Inoue
CPC classification number: H05K3/422 , C23C18/1893 , C23C18/208 , C23C18/2086 , C23C18/30 , C23C18/34 , H05K3/387 , H05K3/389 , H05K3/426
Abstract: The present invention provides a method for treating a substrate that supports metal fine particles for forming a plating layer on a circuit pattern or TSVs in various substrates, in which further micronization treatment is enabled compared with the conventional methods, and the formation of a stable plating layer is enabled. The present invention is a method for treating a substrate, the method including bringing a substrate into contact with a colloidal solution containing metal particles in order to support the metal particles that serve as a catalyst for forming a plating layer on the substrate, in which the colloidal solution contains metal particles formed of Pd and having a particle size of 0.6 nm to 4.0 nm and a face-to-face dimension of the (111) plane of 2.254 Å or more. When an organic layer such as SAM is formed on a surface of the substrate before this treatment, the binding force of the Pd particles can be increased.
Abstract translation: 本发明提供一种处理基板的方法，该基板用于在各种基板上的电路图形或TSV上支撑用于形成镀层的金属微粒，与常规方法相比，能够进一步进行微粉化处理，并形成稳定的电镀 层被启用。 本发明是一种处理基板的方法，该方法包括使基板与含有金属颗粒的胶体溶液接触，以便支撑用作在基板上形成镀层的催化剂的金属颗粒，其中 胶体溶液含有由Pd形成的并且具有0.6nm至4.0nm的粒径和（111）面的面对面尺寸为2.254或更大的金属颗粒。 当在该处理之前在基板的表面上形成诸如SAM的有机层时，可以增加Pd颗粒的结合力。
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