公开(公告)号：US20220068565A1

公开(公告)日：2022-03-03

申请号：US17521500

申请日：2021-11-08

Applicant: TDK CORPORATION

Inventor： Yoji TOZAWA ,  Masashi SHIMOYASU ,  Makoto YOSHINO ,  Takuo ABE ,  Akihiko OIDE ,  Tsutomu ONO ,  Shinichi SATO ,  Makoto MORITA ,  Shinichi SATO ,  Hidekazu SATO

IPC: H01G4/232 ,  H01G4/252 ,  H01G13/00 ,  H05K1/03 ,  H01B1/22 ,  H01G4/30 ,  H03H7/42 ,  H01F17/00 ,  H01F27/29 ,  H01F27/32

Abstract: An electronic component includes an element body, an external electrode, and a resin film having electrical insulation properties. The element body includes a principal surface and a side surface adjacent to the principal surface. The external electrode includes a first electrode portion disposed on the principal surface and a second electrode portion disposed on the side surface. The resin film is disposed on the principal surface and is in contact with the principal surface. Each of the first electrode portion and the second electrode portion includes a conductive resin layer disposed on the element body. A conductive resin layer included in the first electrode portion is disposed on the resin film and is in contact with the resin film.

公开(公告)号：US20190221344A1

公开(公告)日：2019-07-18

申请号：US16234921

申请日：2018-12-28

Applicant: TDK CORPORATION

Inventor： Takeshi SHIBAYAMA ,  Yukio TAKAHASHI ,  Takashi SUZUKI ,  Hiroyuki TANOUE ,  Masashi SHIMOYASU ,  Masahiro KATO

IPC: H01F1/36 ,  H01F27/28 ,  H01F41/04 ,  H01F27/40 ,  C04B35/26

CPC classification number: H01F1/36 ,  C04B35/265 ,  C04B2235/3244 ,  C04B2235/3274 ,  C04B2235/3409 ,  C04B2235/3418 ,  C04B2235/786 ,  C04B2235/96 ,  H01F27/2804 ,  H01F27/40 ,  H01F41/043 ,  H01F2027/2809

Abstract: A ferrite sintered body of the invention includes; a main component including 48.65 to 49.45 mol % of iron oxide in terms of Fe2O3, 2 to 16 mol % of copper oxide in terms of CuO, 28.00 to 33.00 mol % of zinc oxide in terms of ZnO, and a balance including nickel oxide, and a subcomponent including boron oxide in an amount of 5 to 100 ppm in terms of B2O3 with respect to 100 parts by weight of the main component, in which the ferrite sintered body includes crystal grains having an average crystal grain size of 2 to 30 μm.

公开(公告)号：US20180337001A1

公开(公告)日：2018-11-22

申请号：US15821998

申请日：2017-11-24

Applicant: TDK CORPORATION

Inventor： Yoji TOZAWA ,  Masashi SHIMOYASU ,  Makoto YOSHINO ,  Takuo ABE ,  Akihiko OIDE ,  Tsutomu ONO ,  Shinichi SATO ,  Makoto MORITA ,  Shinichi SATO ,  Hidekazu SATO ,  Masashi KITAZAKI ,  Naoki UCHIDA ,  Masahiro KATO

IPC: H01G4/232 ,  H01G4/252 ,  H01G13/00 ,  H05K1/03 ,  H01B1/22 ,  H01G4/30 ,  H01F17/00 ,  H03H7/42

CPC classification number: H01G4/2325 ,  H01B1/22 ,  H01F17/0013 ,  H01F2017/0093 ,  H01G4/12 ,  H01G4/252 ,  H01G4/30 ,  H01G13/006 ,  H03H7/427 ,  H03H2001/0085 ,  H05K1/0306

Abstract: An electronic component includes an element body, an external electrode, and a resin film having electrical insulation properties. The element body includes a principal surface and a side surface adjacent to the principal surface. The external electrode includes a first electrode portion disposed on the principal surface and a second electrode portion disposed on the side surface. The resin film is disposed on the principal surface and is in contact with the principal surface. Each of the first electrode portion and the second electrode portion includes a conductive resin layer disposed on the element body. A conductive resin layer included in the first electrode portion is disposed on the resin film and is in contact with the resin film.

公开(公告)号：US20170345553A1

公开(公告)日：2017-11-30

申请号：US15598606

申请日：2017-05-18

Applicant: TDK CORPORATION

Inventor： Masashi SHIMOYASU ,  Shinichi SATO ,  Seiichi NAKAGAWA ,  Mamoru KAWAUCHI ,  Shigetoshi KINOUCHI ,  Mitsuru ITO ,  Yuto SHIGA

IPC: H01F27/28 ,  H01F27/29 ,  H01F27/32

CPC classification number: H01F27/2804 ,  H01F17/0013 ,  H01F27/29 ,  H01F27/292 ,  H01F27/324 ,  H01F2027/2809

Abstract: A multilayer coil component includes an element body, a coil disposed in the element body, and an external electrode disposed in the element body and electrically connected to the coil. The element body includes a principal surface that is a mounting surface, and an end surface positioned adjacent to the principal surface and extending in a direction crossing to the principal surface. The external electrode includes an underlying metal layer and a conductive resin layer. The underlying metal layer is formed on the principal surface and the end surface. The conductive resin layer is formed to cover the underlying metal layer. A thickness of the conductive resin layer at an end positioned above the principal surface of the underlying metal layer is equal to or greater than 50% of a maximum thickness of a portion positioned above the principal surface of the conductive resin layer.