公开(公告)号：US20180093205A1

公开(公告)日：2018-04-05

申请号：US15818855

申请日：2017-11-21

Applicant: Tokyo Electron Limited

Inventor： Kousuke Yoshihara ,  Katsunori Ichino ,  Toshinobu Furusho ,  Takashi Sasa ,  Katsuhiro Tsuchiya ,  Yuichi Terashita ,  Hirofumi Takeguchi

IPC: B01D19/00 ,  H01L21/67 ,  G03F7/30 ,  G03F7/16

CPC classification number: B01D19/0063 ,  B01D19/0031 ,  B01D19/0068 ,  G03F7/16 ,  G03F7/30 ,  H01L21/6715

Abstract: A solution treatment apparatus connected to a supply nozzle that supplies a treatment solution to a substrate, includes: a supply pipeline connecting a treatment solution storage container and the supply nozzle; a filter apparatus provided in the supply pipeline; a pump on a secondary side of the filter apparatus; a circulation pipeline connecting a discharge side of the pump and an intake side of the filter apparatus; a supply control valve provided in the supply pipeline on a secondary side of the pump; a circulation control valve provided in the circulation pipeline; and a control unit, wherein the control unit opens the circulation control valve and drives the pump when supply of the treatment solution from the supply nozzle to the substrate is stopped by closing the supply control valve, to thereby circulate the treatment solution between the supply pipeline having the filter apparatus and the circulation pipeline.

公开(公告)号：US09293320B2

公开(公告)日：2016-03-22

申请号：US13865311

申请日：2013-04-18

Applicant: Tokyo Electron Limited

Inventor： Yuichi Yoshida ,  Kousuke Yoshihara

IPC: H01L21/02 ,  H01L21/67 ,  G03F7/16 ,  G03F7/30 ,  G03F7/32

CPC classification number: G03F7/70975 ,  G03F7/162 ,  G03F7/3021 ,  G03F7/325 ,  H01L21/02052 ,  H01L21/02104 ,  H01L21/67017 ,  H01L21/67051 ,  H01L21/6715

Abstract: A liquid treatment method includes: supplying a first organic solvent to a substrate with the substrate being held horizontally by a substrate holder; and thereafter supplying a second organic solvent to a substrate held by the substrate holder, the second solvent having a higher cleanliness than the first solvent.

Abstract translation: 液体处理方法包括：将基板由基板保持器水平保持的基板供给第一有机溶剂; 然后将第二有机溶剂供给到由所述基板保持件保持的基板上，所述第二溶剂具有比所述第一溶剂更高的清洁度。

公开(公告)号：US09256131B2

公开(公告)日：2016-02-09

申请号：US14452929

申请日：2014-08-06

Applicant: TOKYO ELECTRON LIMITED

Inventor： Hirofumi Takeguchi ,  Taro Yamamoto ,  Kousuke Yoshihara

IPC: G03F7/16 ,  G03F7/30

CPC classification number: G03F7/162 ,  G03F7/3021

Abstract: A developing method including a developing step in which, while a wafer horizontally held by a spin chuck is being rotated, the wafer is developed by supplying a developer onto a surface of the wafer, wherein provided before the developing step is a pre-wetting step in which, simultaneously with the developer being supplied from a first nozzle that is located on a position near a central part of the surface of the rotating wafer, a deionized water as a second liquid is supplied from a second nozzle that is located on a position nearer to an outer peripheral part of the wafer than the first nozzle, to thereby spread out the developer in the rotating direction of the wafer by a wall that is formed by the deionized water flowing to the outer peripheral side of the wafer with the rotation of the wafer.

Abstract translation: 一种显影方法，其包括显影步骤，其中当由旋转卡盘水平保持的晶片正在旋转时，通过将显影剂供应到晶片的表面上来显影晶片，其中在显影步骤之前提供预润湿步骤 其中与来自位于旋转晶片表面的中心附近的位置的第一喷嘴一起供给显影剂，作为第二液体的去离子水从位于位置上的第二喷嘴供给 比第一喷嘴更靠近晶片的外周部分，从而通过由去离子水流到晶片的外周侧而形成的壁沿着晶片的旋转方向展开显影剂 晶圆。

公开(公告)号：US20150090340A1

公开(公告)日：2015-04-02

申请号：US14497930

申请日：2014-09-26

Applicant: TOKYO ELECTRON LIMITED

Inventor： Koji Takayanagi ,  Kousuke Yoshihara ,  Yuichi Terashita ,  Toshinobu Furusho ,  Takashi Sasa

IPC: F17D3/01

CPC classification number: F17D3/01 ,  F17C1/00 ,  Y10T137/0318 ,  Y10T137/794

Abstract: A processing-liquid supply apparatus includes a source, a discharge device, a supply channel connecting the source and discharge device, a filter device positioned in the channel to form first side having the source and second side having the discharge device, a pump device positioned in the channel, and a control device which controls suction and discharge by the pump device. The control device controls the pump device such that the liquid is discharged from the discharge device, that remaining of the liquid on the second side is suctioned to be returned to the first side and that the remaining of the liquid returned to the first side flows from the first toward second side together with refill of the liquid from the source, and the control device is set such that return amount of the liquid to the filter device is equal to or greater than amount of the discharge.

Abstract translation: 一种处理液供给装置，包括源，排出装置，连接源放出装置的供给路，位于通道内的过滤装置，形成具有源的第一侧，具有排出装置的第二侧， 在通道中，以及控制装置，其通过泵装置控制吸入和排出。 控制装置控制泵装置使得液体从排出装置排出，第二侧的液体的剩余部分被抽吸回到第一侧，并且剩余的返回到第一侧的液体从 首先朝向第二侧，同时从源的液体的再填充，并且控制装置被设定为使得到过滤装置的液体的返回量等于或大于排出量。

公开(公告)号：US20150000517A1

公开(公告)日：2015-01-01

申请号：US14378337

申请日：2013-02-22

Applicant: Tokyo Electron Limited

Inventor： Kousuke Yoshihara ,  Katsunori Ichino ,  Toshinobu Furusho ,  Takashi Sasa ,  Katsuhiro Tsuchiya ,  Yuichi Terashita ,  Hirofumi Takeguchi

IPC: B01D19/00

CPC classification number: B01D19/0063 ,  B01D19/0031 ,  B01D19/0068 ,  G03F7/16 ,  G03F7/30 ,  H01L21/6715

Abstract: A solution treatment apparatus connected to a supply nozzle that supplies a treatment solution to a substrate, includes: a supply pipeline connecting a treatment solution storage container and the supply nozzle; a filter apparatus provided in the supply pipeline; a pump on a secondary side of the filter apparatus; a circulation pipeline connecting a discharge side of the pump and an intake side of the filter apparatus; a supply control valve provided in the supply pipeline on a secondary side of the pump; a circulation control valve provided in the circulation pipeline; and a control unit, wherein the control unit opens the circulation control valve and drives the pump when supply of the treatment solution from the supply nozzle to the substrate is stopped by closing the supply control valve, to thereby circulate the treatment solution between the supply pipeline having the filter apparatus and the circulation pipeline.

Abstract translation: 一种与供给处理溶液供给到基板的供给喷嘴连接的固溶处理装置，具备：将处理液储存容器与供给喷嘴连接的供给管路; 设置在所述供给管道中的过滤装置; 过滤装置的二次侧的泵; 连接泵的排出侧和过滤装置的进气侧的循环管路; 供给控制阀，其设置在所述供给管路中的所述泵的次级侧; 设置在循环管道中的循环控制阀; 以及控制单元，其中，当通过关闭所述供给控制阀来停止从所述供给喷嘴向所述基板供给所述处理液时，所述控制单元打开所述循环控制阀并驱动所述泵，从而使所述处理液在所述供给管线 具有过滤装置和循环管道。

公开(公告)号：US08851011B2

公开(公告)日：2014-10-07

申请号：US13841880

申请日：2013-03-15

Applicant: Tokyo Electron Limited

Inventor： Kousuke Yoshihara ,  Tomohiro Iseki ,  Koji Takayanagi

IPC: B05B13/04 ,  B05C5/00 ,  B05C11/10 ,  B05D1/00 ,  H01L21/67 ,  G03F7/16 ,  H01L21/02

CPC classification number: H01L21/02104 ,  B05D1/005 ,  G03F7/162 ,  H01L21/02282 ,  H01L21/6715

Abstract: In a coating step, a substrate is rotated at a high speed, and in that state a resist solution is discharged from a first nozzle to a central portion of the substrate to apply the resist solution over the substrate. Subsequently, in a flattening step, the rotation of the substrate is decelerated and the substrate is rotated at a low speed to flatten the resist solution on the substrate. In this event, the discharge of the resist solution by the first nozzle in the coating step is performed until a middle of the flattening step, and when the discharge of the resist solution is finished in the flattening step, the first nozzle is moved to move a discharge position of the resist solution from the central portion of the substrate. According to the present invention, the resist solution can be applied uniformly within the substrate.

Abstract translation: 在涂布步骤中，基板高速旋转，并且在该状态下，将抗蚀剂溶液从第一喷嘴排出到基板的中心部分，以将抗蚀剂溶液涂覆在基板上。 随后，在平坦化步骤中，基板的旋转减速，并且基板以低速旋转以使基板上的抗蚀剂溶液平坦化。 在这种情况下，在涂布步骤中，通过第一喷嘴对抗蚀剂溶液的排出进行到平坦化阶段的中间，并且当在平坦化步骤中完成抗蚀剂溶液的排出时，第一喷嘴移动 抗蚀剂溶液从衬底的中心部分的放电位置。 根据本发明，能够将抗蚀剂溶液均匀地涂布在基板内。

公开(公告)号：US11465168B2

公开(公告)日：2022-10-11

申请号：US17040206

申请日：2019-03-20

Applicant: Tokyo Electron Limited

Inventor： Hiroyuki Ide ,  Hideo Shite ,  Kousuke Yoshihara

IPC: B05C11/10 ,  B05D1/26 ,  H01L21/027 ,  B05C11/02 ,  B05C11/08

Abstract: A liquid processing device includes: a nozzle configured to discharge, onto a substrate, a processing liquid supplied from a processing liquid source, the processing liquid being configured to process the substrate; a main flow path which connects the processing liquid source and the nozzle; a filter provided in the main flow path; a branch path branched from the main flow path; a pump provided at an end of the branch path; and a controller configured to output a control signal to perform a first process of sucking the processing liquid supplied from the processing liquid source by the pump to flow the processing liquid into the branch path and then a second process of discharging the processing liquid of a smaller amount than a capacity of the branch path from the pump to the branch path to discharge the processing liquid from the nozzle.

公开(公告)号：US11342198B2

公开(公告)日：2022-05-24

申请号：US16052875

申请日：2018-08-02

Applicant: Tokyo Electron Limited

Inventor： Yuichi Terashita ,  Kousuke Yoshihara ,  Koji Takayanagi ,  Toshinobu Furusho ,  Takashi Sasa

IPC: H01L21/67

Abstract: Disclosed is a processing liquid supplying apparatus. The apparatus includes: a processing liquid supply source configured to supply a processing liquid for processing a substrate to be processed; an ejection unit configured to eject the processing liquid to the substrate to be processed; a filter device configured to remove foreign matters in the processing liquid; a supply pump and an ejection pump which are provided in the supply path at a primary side and a secondary side of the filter device, respectively; and a control unit configured to output a control signal to decompress and degas the processing liquid supplied from the processing liquid supply source by using one of the supply pump and the ejection pump, and subsequently, pass the degassed processing liquid through the filter device beginning from the primary side to the secondary side of the filter device by using the supply pump and the ejection pump.

公开(公告)号：US11235350B2

公开(公告)日：2022-02-01

申请号：US16266310

申请日：2019-02-04

Applicant: Tokyo Electron Limited

Inventor： Satoshi Shimmura ,  Yuji Sakai ,  Kousuke Yoshihara

IPC: B05C21/00 ,  B08B9/08 ,  B05C5/02 ,  G03F7/16 ,  H01L21/67 ,  B05C11/10

Abstract: A solution treatment apparatus includes: a substrate holding unit holds and rotates a substrate; a coating solution supply unit applies a coating solution to the substrate held by the substrate holding unit; a cup unit arranged outside the substrate holding unit in a manner to be able to surround the substrate held by the substrate holding unit; an exhaust path provided between the substrate holding unit and an inner peripheral surface of the cup unit; a coating solution collection unit provided above the exhaust path in a manner to cover the exhaust path and including an opening part communicating in a vertical direction; a solvent supply unit supplies a solvent for the coating solution to the coating solution collection unit; and a relay unit located above the coating solution collection unit and projecting from the inner peripheral surface of the cup unit toward the coating solution collection unit.

公开(公告)号：US10734251B2

公开(公告)日：2020-08-04

申请号：US14101669

申请日：2013-12-10

Applicant: TOKYO ELECTRON LIMITED

Inventor： Koji Takayanagi ,  Yukie Minekawa ,  Yuichi Yoshida ,  Kousuke Yoshihara ,  Yuichi Terashita ,  Toshinobu Furusho ,  Takashi Sasa

IPC: H01L21/00 ,  F04B49/06 ,  F04B43/00 ,  H01L21/67

Abstract: A filtration efficiency, which is similar to the filtration efficiency obtained when a plurality of filters are provided, can be obtained by one filter, and decrease in throughput can be prevented. Based on a control signal from a control unit 101, a resist liquid L is sucked into a pump 70 through a filter. A part of the resist liquid sucked in the pump is discharged from a discharge nozzle 7. The remaining resist liquid is returned to a supply conduit 51b on a primary side of the filter. A process is synthesized by adding a replenishment amount equal to the discharge amount to the return amount. The discharge of the synthesized process liquid and the filtration thereof by the filter are performed the number of times corresponding to a rate between the discharge amount and the return amount.