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166 条记录 (耗时 0.057 秒)

    Glass composition and conductive paste for aluminum electrode wiring, electronic component provided with that aluminum electrode wiring and method for producing this electronic component
    12.
    发明授权
    Glass composition and conductive paste for aluminum electrode wiring, electronic component provided with that aluminum electrode wiring and method for producing this electronic component 有权
    用于铝电极布线的玻璃组合物和导电膏，具有该铝电极布线的电子部件和用于制造该电子部件的方法

    公开(公告)号：US09142708B2

    公开(公告)日：2015-09-22

    申请号：US13581237

    申请日：2011-02-17

    申请人： Takashi Naito ,  Takuya Aoyagi ,  Shinichi Tachizono ,  Kei Yoshimura ,  Yuji Hashiba

    发明人： Takashi Naito ,  Takuya Aoyagi ,  Shinichi Tachizono ,  Kei Yoshimura ,  Yuji Hashiba

    IPC分类号： H01B1/02 ,  H01L31/18 ,  C03C8/00 ,  H01L31/0224 ,  H01B1/22

    CPC分类号： H01L31/1804 ,  C03C8/00 ,  H01B1/22 ,  H01L31/022425 ,  Y02E10/547 ,  Y02P70/521

    摘要： Disclosed is a constitution formed from an oxide of an element having a smaller work function than aluminum. This oxide is comprises an oxide of vanadium (V), an oxide of an alkaline earth metal and an oxide of an alkali metal. The elements for the alkaline earth metal are comprise one or more elements out of the elements calcium (Ca), strontium (Sr) and barium (Ba) and at least contain barium. The elements for the alkali metal include at least one or more of sodium (Na), potassium (K), rubidium (Rb) and cesium (Cs). When the element vanadium is included as vanadium pentoxide (V2O5), the vanadium pentoxide content is 40-70 wt %. Thus, a glass composition for aluminum electrode wiring with an apparent work function for electrode wiring that is smaller than the work function for aluminum (Al) can be provided without the inclusion of lead.

    摘要翻译： 公开了由具有比铝更小的功函数的元素的氧化物形成的结构。 该氧化物包括钒（V）的氧化物，碱土金属的氧化物和碱金属的氧化物。 碱土金属的元素包括元素钙（Ca），锶（Sr）和钡（Ba）中的一种或多种元素，并且至少含有钡。 碱金属的元素包括钠（Na），钾（K），铷（Rb）和铯（Cs）中的至少一种或多种。 当钒元素作为五氧化二钒（V2O5）包含时，五氧化二钒含量为40-70重量％。 因此，可以提供具有比铝（Al）的功函数小的用于电极布线的表观功函数的铝电极布线用玻璃组合物，而不包含铅。

    Wiring member, method of manufacturing the wiring member and electronic element
    18.
    发明授权
    Wiring member, method of manufacturing the wiring member and electronic element 失效
    接线构件，配线构件和电子元件的制造方法

    公开(公告)号：US08217274B2

    公开(公告)日：2012-07-10

    申请号：US12793335

    申请日：2010-06-03

    申请人： Hiroki Yamamoto ,  Takashi Naito ,  Takuya Aoyagi ,  Yuuichi Sawai ,  Takahiko Kato

    发明人： Hiroki Yamamoto ,  Takashi Naito ,  Takuya Aoyagi ,  Yuuichi Sawai ,  Takahiko Kato

    IPC分类号： H05K1/09

    CPC分类号： H05K3/244 ,  H05K1/0306 ,  H05K3/388 ,  H05K2203/0315 ,  H05K2203/1105 ,  Y10T29/49142

    摘要： A wiring member comprising a substrate, a copper wiring layer having an electrical resistivity of not larger than 4×10−6 Ωcm in directly or indirectly contact with the substrate, an aluminum diffusion layer, contiguous to the copper wiring layer, having an aluminum concentration gradient descending towards the inside, and an aluminum oxide layer contiguous to and covering the aluminum diffusion layer, wherein a ratio of a thickness of the copper wiring layer to a thickness of the aluminum diffusion layer is 1.5 to 5. The disclosure is also concerned with a method of manufacturing the wiring member and an electronic device.

    摘要翻译： 一种布线构件，包括基板，与基板直接或间接接触的电阻率不大于4×10-6＆OHgr; cm的铜布线层，与铜布线层邻接的铝扩散层，具有 铝浓度梯度向内侧下降，以及与铝扩散层相邻并覆盖铝氧化物层，其中铜布线层的厚度与铝扩散层的厚度的比率为1.5〜5。还公开了 涉及制造布线构件和电子装置的方法。

    CONDUCTIVE PASTE AND ELECTRONIC PART EQUIPPED WITH ELECTRODE WIRING FORMED FROM SAME
    20.
    发明申请
    CONDUCTIVE PASTE AND ELECTRONIC PART EQUIPPED WITH ELECTRODE WIRING FORMED FROM SAME 有权
    导电胶和电子部件配有电极从其形成的接线

    公开(公告)号：US20110315937A1

    公开(公告)日：2011-12-29

    申请号：US13203876

    申请日：2009-03-27

    申请人： Takuya Aoyagi ,  Takashi Naito ,  Hiroki Yamamoto ,  Takahiko Kato

    发明人： Takuya Aoyagi ,  Takashi Naito ,  Hiroki Yamamoto ,  Takahiko Kato

    IPC分类号： H01B1/20 ,  H01B1/02

    CPC分类号： H01L31/022425 ,  H01B1/16 ,  H01J11/22 ,  H01J2211/225 ,  H01L31/03529 ,  H01L31/068 ,  H01L31/0682 ,  Y02E10/547

    摘要： Provided is a conductive paste which contains an inexpensive metal, such as copper or aluminum, as an electrode wiring material and has oxidation resistance that enables the paste to withstand a high-temperature process performed in an oxidizing atmosphere and an electronic part equipped with electrode wiring formed from the paste. The electronic part in accordance with the present invention is equipped with electrode wiring that comprises a conductive glass phase containing transition metals and phosphorus, metal particles, and none of the substances prohibited by the RoHS directive. The electronic part is characterized in that each of the transition metals contained in the conductive glass phase is present in the state of having a plurality of oxidation numbers and that the proportion of the atoms which have the largest oxidation number for each transition metal satisfies a given relationship.

    摘要翻译： 本发明提供一种导电性糊剂，其含有诸如铜或铝的廉价金属作为电极配线材料，并且具有能够使膏体经受在氧化气氛中进行的高温处理和具有电极配线的电子部件的抗氧化性 由膏形成。 根据本发明的电子部件配备有包含含有过渡金属和磷，金属颗粒以及RoHS指令禁止的物质的导电玻璃相的电极配线。 电子部件的特征在于，导电性玻璃相中含有的过渡金属中的每一种以具有多个氧化数的状态存在，并且每个过渡金属具有最大氧化数的原子的比例满足给定的 关系。