ELECTRONIC COMPONENT, CONDUCTIVE PASTE, AND METHOD FOR MANUFACTURING AN ELECTRONIC COMPONENT
    3.
    发明申请
    ELECTRONIC COMPONENT, CONDUCTIVE PASTE, AND METHOD FOR MANUFACTURING AN ELECTRONIC COMPONENT 有权
    电子元件,导电胶和制造电子元件的方法

    公开(公告)号:US20120318559A1

    公开(公告)日:2012-12-20

    申请号:US13581178

    申请日:2011-02-17

    摘要: The conductive paste contains the following dispersed in a binder resin dissolved in a solvent: a plurality of particles comprising aluminum and/or an aluminum-containing alloy; and an oxide-comprising powder. The oxide contains vanadium with a valence no greater than 4 and a glass phase. In the method for manufacturing an electronic component, the conductive paste is applied to a substrate and fired, forming electrode wiring. The electronic component is provided with electrode wiring that has: a plurality of particles comprising aluminum and/or an aluminum-containing alloy; and an oxide affixing the particles to a substrate. The oxide contains vanadium with a valence no greater than 4. A compound layer containing vanadium and aluminum is formed on the surfaces of the particles, and the vanadium in the compound layer includes vanadium with a valence no greater than 4. This results in an electrode wiring with high reliability and water resistance.

    摘要翻译: 导电糊料包含以下物质:分散在溶解于溶剂中的粘合剂树脂中:多个包含铝和/或含铝合金的颗粒; 和含氧化物的粉末。 氧化物含有不大于4价的钒和玻璃相。 在电子部件的制造方法中,将导电性糊剂涂布在基板上并烧结,形成电极配线。 所述电子部件设置有电极配线,所述电极配线具有:包含铝和/或含铝合金的多个粒子; 以及将颗粒固定在基材上的氧化物。 氧化物含有价数不大于4的钒。在颗粒表面上形成含有钒和铝的化合物层,化合物层中的钒包含价态不大于4的钒。这导致电极 布线具有高可靠性和防水性。