公开(公告)号：US5126829A

公开(公告)日：1992-06-30

申请号：US412130

申请日：1989-09-25

申请人： Takahiro Daikoku ,  Nobuo Kawasaki ,  Noriyuki Ashiwake ,  Shizuo Zushi

发明人： Takahiro Daikoku ,  Nobuo Kawasaki ,  Noriyuki Ashiwake ,  Shizuo Zushi

IPC分类号： H01L23/433 ,  H05K7/20

CPC分类号： H01L23/4338 ,  H01L2224/16

摘要： A cooling apparatus for an electronic device makes a cooling solid body in contact with the electronic device so as to cool the electronic device. The apparatus has a high viscous thermal conductive fluid provided on a heat transfer portion of the electronic device, and a cooling solid body in close contact through the thermal conductive fluid with the heat transfer portion of the electronic device. The close contact portion of at least one of the cooling solid body and the electronic device has multiple grooves open to the outside of the one of the cooling solid body and the electronic device.

摘要翻译： 一种用于电子设备的冷却装置使冷却固体与电子设备接触，以冷却电子设备。 该设备具有设置在电子设备的传热部分上的高粘性导热流体和通过导电流体与电子设备的传热部分紧密接触的冷却固体。 冷却固体和电子装置中的至少一个的紧密接触部分具有向冷却固体和电子装置之一的外部开口的多个凹槽。

公开(公告)号：US5089936A

公开(公告)日：1992-02-18

申请号：US404341

申请日：1989-09-07

申请人： Hiroyuki Kojima ,  Toshio Hatsuda ,  Takahiro Daikoku ,  Shizuo Zushi ,  Fumiyuki Kobayashi

发明人： Hiroyuki Kojima ,  Toshio Hatsuda ,  Takahiro Daikoku ,  Shizuo Zushi ,  Fumiyuki Kobayashi

IPC分类号： H01L23/40 ,  H01L23/473

CPC分类号： H01L23/473 ,  H01L23/4006 ,  H01L2023/4043 ,  H01L2023/4062 ,  H01L2023/4081 ,  H01L2224/16225 ,  H01L2224/73253

摘要： In a semiconductor module including a wiring substrate having one or a plurality of semiconductor devices electrically connected thereon, a housing constituted of a sealing frame and a ceiling board to enclose the semiconductor devices therein, and a cooling jacket to cool the semiconductor devices. The semiconductor module comprises an elastic arm placed on the cooling jacket for exerting pressure to cause the cooling jacket to be uniformly contacted with the housing ceiling board, and clamping jigs press the cooling jacket and the ceiling board through the elastic arm, so that the clamping jigs may serve to press the respective intermediate positions of the four sides of the cooling jacket through the elastic arm, or screw fasteners may be provided on the elastic arm for controlling the displacements and pressing force.

摘要翻译： 在包括具有电连接在其上的一个或多个半导体器件的布线基板的半导体模块中，由密封框架和顶板组成的壳体以封装其中的半导体器件，以及用于冷却半导体器件的冷却套。 半导体模块包括放置在冷却套上的弹性臂，用于施加压力以使冷却套与壳体天花板均匀地接触，并且夹具通过弹性臂挤压冷却套和顶板，使得夹紧 夹具可以用于通过弹性臂挤压冷却套的四个侧面的相应中间位置，或者可以在弹性臂上设置螺钉紧固件以控制位移和按压力。

公开(公告)号：US06182742B2

公开(公告)日：2001-02-06

申请号：US08879303

申请日：1997-06-19

申请人： Tatsuya Takahashi ,  Shizuo Zushi ,  Tetsuo Ogata

发明人： Tatsuya Takahashi ,  Shizuo Zushi ,  Tetsuo Ogata

IPC分类号： F28D1500

CPC分类号： H05K7/20281

摘要： A cooling apparatus for use with an electronic system provides an uninterrupted operation capability. A pump supplies a cooling liquid to a liquid-cooled electronic system. The pump is controlled by a controller that also controls a three way valve for controlling the operation of a three-way valve for regulating the flow quantity of the cooling liquid flowing into a heat exchanger for cooling the cooling liquid. The cooling apparatus has a plurality of cooling control units. While one cooling control unit is in operation, the other is in the standby state. If one cooling control unit fails, the standby cooling control unit is automatically put in the operating state, thereby allowing servicing of the failing unit without interrupting the operation of the liquid-cooled electronic system and the cooling apparatus.

摘要翻译： 用于电子系统的冷却装置提供不间断的操作能力。 泵将冷却液供给液冷电子系统。 该泵由控制器控制，该控制器还控制用于控制三通阀的操作的三通阀，用于调节流入用于冷却冷却液体的热交换器中的冷却液的流量。 冷却装置具有多个冷却控制单元。 一个冷却控制单元正在运行时，另一个处于待机状态。 如果一个冷却控制单元发生故障，则备用冷却控制单元自动处于运行状态，从而允许对故障单元进行维修而不中断液冷式电子系统和冷却装置的运行。

公开(公告)号：US5515912A

公开(公告)日：1996-05-14

申请号：US664605

申请日：1991-03-04

申请人： Takahiro Daikoku ,  Noriyuki Ashiwake ,  Nobuo Kawasaki ,  Shizuo Zushi

发明人： Takahiro Daikoku ,  Noriyuki Ashiwake ,  Nobuo Kawasaki ,  Shizuo Zushi

IPC分类号： H01L23/36 ,  H01L23/433 ,  H01L23/34

CPC分类号： H01L23/4338 ,  H01L2224/16225

摘要： A cooling apparatus of electronic devices including thermal conductive members each of which is positioned with one side thereof being in contact with a surface of each electronic device, the other side thereof being fitted to a housing with a small clearance provided therebetween, so as to diffuse and remove heat generated in the electronic devices. In order to press each thermal conductive member onto the associated electronic device, a resilient member is provided between the housing and the thermal conductive member, and is arranged to have a width larger than a width of grooves between fins formed on the housing and also larger than a width of grooves between fins formed on the thermal conductive member. A setting space to receive each resilient member therein is formed in a region where the fins are fitted to each other, so that the resilient member and the thermal conductive member can be fitted and positioned with respect to the housing when the resilient member is provided in this setting space.

摘要翻译： 一种电子设备的冷却装置，包括导热构件，每个导热构件的一侧与每个电子装置的表面接触，其另一侧装配到具有设置在其间的小间隙的壳体，以便扩散 并去除电子设备中产生的热量。 为了将每个导热构件按压到相关联的电子装置上，弹性构件设置在壳体和导热构件之间，并且布置成具有比形成在壳体上的翅片之间的沟槽宽度更大的宽度，并且还更大 比形成在导热构件上的翅片之间的槽宽度大。 在翅片彼此装配的区域中形成有用于接收其中的每个弹性构件的设置空间，使得当弹性构件设置在弹性构件中时，可以将弹性构件和导热构件相对于壳体配合和定位 这个设置空间。

公开(公告)号：US5144531A

公开(公告)日：1992-09-01

申请号：US637690

申请日：1991-01-07

申请人： Hiroshi Go ,  Shizuo Zushi ,  Mitsuo Miyamoto

发明人： Hiroshi Go ,  Shizuo Zushi ,  Mitsuo Miyamoto

IPC分类号： H01L23/427 ,  H01L23/473 ,  H05K7/20

CPC分类号： H01L23/473 ,  H01L2924/0002

摘要： In a liquid cooling system comprising cold plates attached to their respective circuit modules, quick couplers are provided for connecting flexible hoses to these cold plates, a supply duct and a return duct to form strings of cold plates connected between the supply duct and the return duct. Valved quick couplers are used for the connection to the supply duct and the return duct, and valveless quick couplers are used for the connection to the cold plates. When a circuit module is to be serviced, a desired string of cold plates is disconnected from the supply duct and the return duct by disjoining the valved quick couplers for the connection thereto. The disconnected string of cold plates is drained of the coolant, and then the cold plate attached to the desired circuit module is disconnected from the hoses. Subsequently the desired circuit module and the cold plate attached thereto can be detached as one body from an associated connector.

摘要翻译： 在包括连接到它们各自的电路模块的冷板的液体冷却系统中，提供快速联接器用于将柔性软管连接到这些冷板，供应管道和回流管道，以形成连接在供应管道和回流管道 。 带阀的快速接头用于连接到供气管道和回流管道，无阀快速接头用于连接冷板。 当要对电路模块进行维修时，将所需的一系列冷板与供应管道和回流管道分离，通过分离与阀连接的带阀的快速联接器。 断开的冷却板串排出冷却液，然后连接到所需电路模块的冷板与软管断开连接。 随后，所需的电路模块和附接到其上的冷板可以作为一个主体从相关联的连接器分离。

公开(公告)号：US5040992A

公开(公告)日：1991-08-20

申请号：US444859

申请日：1989-12-04

申请人： Mitsuo Miyamoto ,  Fumiyuki Kobayashi ,  Shizuo Zushi ,  Norio Sengoku ,  Yoshiaki Horita

发明人： Mitsuo Miyamoto ,  Fumiyuki Kobayashi ,  Shizuo Zushi ,  Norio Sengoku ,  Yoshiaki Horita

IPC分类号： G06F1/18 ,  H05K1/14 ,  H05K7/14

CPC分类号： H05K7/1449 ,  H05K1/14 ,  H05K1/148 ,  Y10S439/928

摘要： A first mother board among a plurality of mother boards is mounted adjacent to a reference mother board and a second mother board among said plurality of mother boards is mounted in a position rotated 180.degree. about the horizontal centerline of the second mother board and mounted back to back to the first mother board, whereby the reference mother board and the first and second mother boards can be interconnected at a minimal distance.

摘要翻译： 多个母板中的第一母板安装在参考母板附近，并且所述多个母板中的第二母板安装在围绕第二母板的水平中心线旋转180°的位置，并安装回 返回到第一母板，由此参考母板和第一和第二母板可以以最小的距离相互连接。

公开(公告)号：US5934368A

公开(公告)日：1999-08-10

申请号：US530670

申请日：1995-09-19

申请人： Tetsuya Tanaka ,  Toshio Hatada ,  Takayuki Atarashi ,  Junichi Kobayashi ,  Akihiro Takanashi ,  Takahiro Daikoku ,  Yutaka Watanabe ,  Shizuo Zushi

发明人： Tetsuya Tanaka ,  Toshio Hatada ,  Takayuki Atarashi ,  Junichi Kobayashi ,  Akihiro Takanashi ,  Takahiro Daikoku ,  Yutaka Watanabe ,  Shizuo Zushi

IPC分类号： F24F11/00 ,  G05D22/02 ,  G05D23/19 ,  H01L23/34 ,  H01L23/427 ,  H01L23/467 ,  H05K5/02 ,  H05K7/20 ,  F25D17/06

CPC分类号： H05K7/207 ,  F24F11/0008 ,  G05D22/02 ,  G05D23/1931 ,  H01L23/34 ,  H01L23/467 ,  H05K7/20572 ,  H01L2924/0002

摘要： A highly reliable electronic apparatus free from condensation in the cabinet of the apparatus. The electronic apparatus has printed circuit boards on which heat emitting semiconductor devices are mounted and a fan. The electronic apparatus further comprises a hygrometer for measuring the relative humidity and dew-point temperature of the cooling air that is introduced into the cabinet through an opening, a surface temperature sensor for sensing the temperature of the surface of the semiconductor devices, an internal temperature sensor for sensing the internal temperature of the semiconductor device, dehumidifier and heater means made up of a heat pump and an outdoor unit, and a controller for controlling the dehumidifier means and the heater means so that the relative humidity is less than 100% and the dew-point temperature is less than the surface temperature of the semiconductor devices.

摘要翻译： 一种高度可靠的电子设备，在设备的机柜中无冷凝。 该电子设备具有安装有散热半导体器件的印刷电路板和风扇。 该电子设备还包括湿度计，用于测量通过开口引入机柜的冷却空气的相对湿度和露点温度，用于感测半导体器件表面温度的表面温度传感器，内部温度 用于感测半导体装置的内部温度的传感器，由热泵和室外机组成的除湿器和加热器装置，以及用于控制除湿装置和加热装置的控制器，使得相对湿度小于100％ 露点温度小于半导体器件的表面温度。

公开(公告)号：US5595240A

公开(公告)日：1997-01-21

申请号：US464581

申请日：1995-06-05

申请人： Takahiro Daikoku ,  Noriyuki Ashiwake ,  Nobuo Kawasaki ,  Shizuo Zushi

发明人： Takahiro Daikoku ,  Noriyuki Ashiwake ,  Nobuo Kawasaki ,  Shizuo Zushi

IPC分类号： H01L23/36 ,  H01L23/433 ,  H01L23/34

CPC分类号： H01L23/4338 ,  H01L2224/16225

摘要： A cooling apparatus of electronic devices including thermal conductive members each of which is positioned with one side thereof being in contact with a surface of each electronic device, the other side thereof being fitted to a housing with a small clearance provided therebetween, so as to diffuse and remove heat generated in the electronic devices. In order to press each thermal conductive member onto the associated electronic device, a resilient member is provided between the housing and the thermal conductive member, and is arranged to have a width larger than a width of grooves between fins formed on the housing and also larger than a width of grooves between fins formed on the thermal conductive member. A setting space to receive each resilient member therein is formed in a region where the fins are fitted to each other, so that the resilient member and the thermal conductive member can be fitted and positioned with respect to the housing when the resilient member is provided in this setting space.

摘要翻译： 一种电子设备的冷却装置，包括导热构件，每个导热构件的一侧与每个电子装置的表面接触，其另一侧装配到具有设置在其间的小间隙的壳体，以便扩散 并去除电子设备中产生的热量。 为了将每个导热构件按压到相关联的电子装置上，弹性构件设置在壳体和导热构件之间，并且布置成具有比形成在壳体上的翅片之间的凹槽的宽度更大的宽度，并且还更大 比形成在导热构件上的翅片之间的槽宽度大。 在翅片彼此装配的区域中形成有用于接收其中的每个弹性构件的设置空间，使得当弹性构件设置在弹性构件中时，可以将弹性构件和导热构件相对于壳体配合和定位 这个设置空间。

公开(公告)号：US5345107A

公开(公告)日：1994-09-06

申请号：US839071

申请日：1992-02-20

申请人： Takahiro Daikoku ,  Nobuo Kawasaki ,  Noriyuki Ashiwake ,  Keizou Kawamura ,  Shizuo Zushi ,  Mitsuo Miyamoto ,  Atsushi Morihara

发明人： Takahiro Daikoku ,  Nobuo Kawasaki ,  Noriyuki Ashiwake ,  Keizou Kawamura ,  Shizuo Zushi ,  Mitsuo Miyamoto ,  Atsushi Morihara

IPC分类号： F28F13/00 ,  H01L23/433 ,  H01L23/473 ,  H01L25/065 ,  F28F7/00 ,  H01L23/00 ,  H05K7/20

CPC分类号： H01L24/32 ,  F28F13/00 ,  H01L23/4338 ,  H01L23/473 ,  H01L25/0655 ,  F28F2013/005 ,  H01L2224/16 ,  H01L2224/32057 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2224/83385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/0132 ,  H01L2924/15312 ,  H01L2924/16152

摘要： The present invention relates to a cooling apparatus for an electronic device, in which a cooling solid body in close contact through thermal conductive fluid with a heat transfer portion of the electronic device is provided, on its one surface in contact with the electronic device, with a number of grooves communicating with the outside of the heat transfer portion, and a spring member for elastically pressing this cooling solid body on the electronic device is provided for forcing the cooling solid body into close contact with the electronic device by means of the thermal conductive fluid in a third layer.

摘要翻译： 本发明涉及一种用于电子设备的冷却装置，其中在其与电子设备接触的一个表面上设置有通过导电流体与电子设备的传热部分紧密接触的冷却固体，与 提供与传热部分的外部连通的多个槽，以及用于将该冷却固体本体弹性挤压在电子装置上的弹簧构件，用于迫使冷却固体与电子装置紧密接触，借助于导热 流体在第三层。

公开(公告)号：US5365400A

公开(公告)日：1994-11-15

申请号：US771777

申请日：1991-10-04

申请人： Noriyuki Ashiwake ,  Takahiro Daikoku ,  Toshio Hatsuda ,  Shizuo Zushi ,  Satomi Kobayashi

发明人： Noriyuki Ashiwake ,  Takahiro Daikoku ,  Toshio Hatsuda ,  Shizuo Zushi ,  Satomi Kobayashi

IPC分类号： H01L23/433 ,  H01L23/473 ,  H01L25/065 ,  H05K7/20

CPC分类号： H01L23/433 ,  H01L23/4735 ,  H01L25/0655 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01014 ,  H01L2924/15312 ,  H01L2924/16152 ,  Y10S165/908

摘要： Disclosed are heat sinks particularly effective in cooling semiconductors of a high heat dissipating density and including a multiplicity of tabular fins laminated via spacers and having through-holes pierced in their central parts, the holes admitting introduction of cooling fluids which radially flow in between the fins. The cooling fluids are supplied to the respective heat sinks attached to the multiplicity of semiconductors mounted on a board. In a specific form of the invention, the semiconductor cooling device has a heat sink provided with parallel tabular internal fins and a cooling fluid nozzle having an elongated opening substantially orthogonal to the fins, the nozzle being disposed to span over the parallel tabular fins substantially at longitudinal mid portions of these fins, so that the cooling fluid is evenly distributed from the mid portions of the fins to both longitudinal ends of the fins.

摘要翻译： 公开了散热器在散热密度高的冷却半导体中特别有效，并且包括通过间隔件层叠的多个片状翅片，并且在其中心部分中穿透通孔，允许在散热片之间径向流动的冷却流体的引入 。 冷却流体被供应到附接到安装在板上的多个半导体的各个散热器。 在本发明的具体形式中，半导体冷却装置具有设置有平行的片状内部散热片的散热器和具有与散热片基本正交的细长开口的冷却流体喷嘴，该喷嘴设置成跨越平行板状翅片， 这些翅片的纵向中间部分，使得冷却流体从翼片的中部均匀地分布到翅片的两个纵向端部。