Abstract:
Heat-activable adhesive tape particularly for producing and further processing electronic components and conductor tracks, with an adhesive composed at least of a) a polyamide having terminal amino and/or acid groups, b) an epoxy resin, c) if desired, a plasticizer, the polyamide reacting with the epoxy resin at temperatures of at least 150° C., and the ratio in weight fractions of a) to b) lying between 50:50 to 99:1.
Abstract:
The invention relates to the use of a pressure-sensitive adhesive comprising at least one resin-polymer blend of at least 50% by weight of one or more block copolymers comprising polymer blocks based on vinylaromatics and comprising polymer blocks based on 1,3-dienes and not more than 50% by weight of at least one tackifier resin for an adhesive tape for bonding flexible printing plates to printing cylinders or printing sleeves.
Abstract:
Use of an adhesive tape for masking substrates, especially substrates coated with cathodic electrocoat (CED) material, more preferably window flanges, with a single-layer or multi-layer backing and applied to one side thereof a self-adhesive composition comprising metal chelate-crosslinkable vinylaromatic block copolymers, preferably styrene block copolymers, which are blended at least with one or more tackifier resins, the vinylaromatic block copolymers being at least partly acid-modified or acid anhydride-modified.
Abstract:
A redetachable self-adhesive device a) whose reverse face is bonded with a strip of a double-sidedly adhering adhesive sheet in such a way that one end of the adhesive sheet projects beyond the device as a grip tab, b) the adhesive sheet is such that the bond made with it is redetachable by stretching pulling on the grip tab of the strip in the direction of the bond plane, wherein c) on its reverse face (2) the device (1), in the region (3A, 3B) situated against the grip tab (6) of the adhesive sheet strip (5) or and also partly against the free adhesive composition, has an average roughness Ra of 0.4–25 μm.
Abstract translation:一种可重新切割的自粘装置a),其反面与双面粘合粘合片的条带粘合,使得粘合片的一端突出超过装置作为夹紧片,b)粘合片是 使得与其形成的接合可以通过在接合平面的方向上拉伸在带的夹持片上来重新进行,其中c)在其反面(2)上的装置(1)中,在区域(3A, 3)位于粘合片条(5)的夹紧片(6)上,或部分地抵靠游离粘合剂组合物的平均粗糙度R a a为0.4〜25μm。
Abstract:
Heat-activable adhesive tape for bonding electronic components and conductor tracks, with an adhesive composed at least of: a) an acid-modified or acid-anhydride-modified vinylaromatic block copolymer and b) an epoxidized vinylaromatic block copolymer.
Abstract:
The invention relates to a solution, in particular for pre-treating a hydrophilic surface for hydrophobization, comprising: I. at least one silane of the formula (1) where R1, R2, R3 independently of one another are selected from the group consisting of methyl, ethyl, 2-methoxyethyl, propyl and i-propyl, butyl, benzyl m=0 or 1, n=3 to 12, p=1 or 2, and, for p=1, Y=a functional group selected from the group consisting of (meth)alkyl, (meth)acryloxy, mercapto, ureido, —NH—CH2—CH2-NR4R5 and —NR4R5 (where R4 and R5 independently of one another are selected from the group consisting of H, alkyl, phenyl, benzyl, cycloalkyl), or, for p=2, Y=NH; and II. at least one second silane increasing the aging stability having no more than two carbon atoms bound to the silicon in a chain.
Abstract:
Method for encapsulating an electronic arrangement against permeates wherein a pressure-sensitive adhesive mass based on butylene block copolymers is applied to and around the areas of the electronic arrangement to be encapsulated.
Abstract:
Self-adhesive consisting of a mixture having at least one tackifier resin, expanded polymeric microbeads and a polymer blend made up of thermoplastic and/or non-thermoplastic elastomers with at least one vinylaromatic block copolymer containing a fraction of more than 30% by weight of 1,2-linked diene in the elastomer block.
Abstract:
The present invention relates to a method for encapsulating an electronic arrangement against permeants, in which a pressure-sensitive adhesive composition based on vinylaromatic block copolymers is provided, and in which the pressure-sensitive adhesive composition is applied onto and/or around the regions of the electronic arrangement which are to be encapsulated.
Abstract:
Use of an adhesive sheet having a carrier film provided with an adhesive on one side for covering microtitre plates, the adhesive being formed from at least one acid- or acid anhydride-modified vinylaromatic block copolymer, at least one tackifier resin and at least one metal chelate.