Light emitting device with adjustable reflector cup
    12.
    发明申请
    Light emitting device with adjustable reflector cup 有权
    具有可调节反射杯的发光装置

    公开(公告)号:US20070090379A1

    公开(公告)日:2007-04-26

    申请号:US11255544

    申请日:2005-10-21

    IPC分类号: H01L33/00

    摘要: A light emitting device has a light emitting diode (LED), a reflector cup, and one or more adjustment mechanisms to control the intensity profile of light emitted from the light emitting device. The reflector cup has a base and a sidewall extending outward from the base. A base adjustment mechanism controls the total amount of light reflected from the base and into the beam of light emitted from the light emitting mechanism by controlling the aggregate reflectivity of the base. A sidewall adjustment mechanism controls the angle of the sidewall relative to the base. A vertical adjustment mechanism vertically raises or lowers the LED relative to the base.

    摘要翻译: 发光器件具有发光二极管(LED),反射杯和一个或多个调节机构,以控制从发光器件发射的光的强度分布。 反射杯具有从底部向外延伸的基部和侧壁。 基座调节机构通过控制基座的聚集反射率来控制从基底反射到光发射机构发射的光束的总光量。 侧壁调节机构控制侧壁相对于底座的角度。 垂直调节机构相对于底座垂直升高或降低LED。

    Thermally controllable substrate
    15.
    发明申请
    Thermally controllable substrate 审中-公开
    耐热基材

    公开(公告)号:US20070252268A1

    公开(公告)日:2007-11-01

    申请号:US11395303

    申请日:2006-03-31

    IPC分类号: H01L23/34

    摘要: A thermally controllable substrate is disclosed. The substrate supports a heat generating source. One of more microchannels are embedded within the substrate and preferably circulate a cooling fluid to dissipate heat being generated by the source. The flow of the cooling fluid serves to remove heat entering the substrate proximate the source providing for the use of enhanced electrical devices which generate more heat in their normal operation.

    摘要翻译: 公开了一种热可控衬底。 基板支撑发热源。 更多的微通道中的一个嵌入在基底内,并且优选地循环冷却流体以散发由源产生的热量。 冷却流体的流动用于去除靠近源的进入基板的热量,从而提供在其正常操作中产生更多热量的增强型电气设备的使用。

    Multi-orifice collet for a pick-and-place machine
    16.
    发明申请
    Multi-orifice collet for a pick-and-place machine 审中-公开
    用于拾放机器的多孔夹头

    公开(公告)号:US20070235496A1

    公开(公告)日:2007-10-11

    申请号:US11399812

    申请日:2006-04-07

    IPC分类号: B23K5/00 B23K1/00

    CPC分类号: H05K13/0482

    摘要: The invention relates to a system and method for simultaneously transferring multiple components using multi-orifice collets with a pick-and-place apparatus. Multiple electronic components, such as light emitting diodes can be picked and place simultaneously while maintaining the spacing and orientation of the components found in the original location.

    摘要翻译: 本发明涉及一种使用拾取和放置装置的多口筒夹同时传送多个部件的系统和方法。 多个电子部件,例如发光二极管可以被拾取并且同时放置,同时保持原始位置中发现的部件的间隔和取向。

    Light source with UV LED and UV reflector
    17.
    发明申请
    Light source with UV LED and UV reflector 审中-公开
    光源采用UV LED和UV反射器

    公开(公告)号:US20070045641A1

    公开(公告)日:2007-03-01

    申请号:US11210714

    申请日:2005-08-23

    IPC分类号: H01L29/22 H01L33/00

    摘要: A lighting source capable of producing white light using a semiconductor radiation source. The semiconductor radiation source may be an ultraviolet (“UV”) light emitting diode (“LED”) device that emits light at a short wavelength, e.g., near-violet or ultraviolet light. A thin film of phosphor may be deposited or coated on the surface of the UV LED or positioned directly above the UV LED. The lighting source may also include an UV reflector radiationally coupled to the thin phosphor layer that allows visible white light emitted from the thin phosphor to pass through and reflects shorter wavelength light back to the thin phosphor layer.

    摘要翻译: 能够使用半导体辐射源产生白光的照明源。 半导体辐射源可以是发射短波长例如近紫外或紫外光的光的紫外(“UV”)发光二极管(“LED”)装置。 可以在UV LED的表面上沉积或涂覆磷光体薄膜,或者直接位于UV LED的正上方。 照明源还可以包括辐射耦合到薄磷光体层的UV反射器,其允许从薄荧光体发射的可见白光穿过并将较短波长的光反射回到薄磷光体层。

    Light source utilizing a flexible circuit carrier
    19.
    发明申请
    Light source utilizing a flexible circuit carrier 有权
    光源采用柔性电路载体

    公开(公告)号:US20060268551A1

    公开(公告)日:2006-11-30

    申请号:US11140865

    申请日:2005-05-31

    IPC分类号: F21V29/00

    摘要: A light source having light emitting modules coupled to a flexible circuit carrier. The flexible circuit carrier includes a sheet of flexible material having electrically conducting traces connecting a circuit mounting area and a connector region. The light emitting modules are electrically connected to the circuit mounting area. In one embodiment, the light emitting modules are arranged in a linear array. The light source preferably includes a light pipe having a planar layer of transparent material, the light emitting modules being bonded to an edge of the planar layer. The light pipe is preferably attached to a printed circuit board and the connection region of the flexible circuit carrier is attached to the printed circuit board. The flexible circuit carrier can move heat from the light emitting modules to the printed circuit board as well as providing electrical connections.

    摘要翻译: 具有耦合到柔性电路载体的发光模块的光源。 柔性电路载体包括具有连接电路安装区域和连接器区域的导电迹线的柔性材料片。 发光模块电连接到电路安装区域。 在一个实施例中,发光模块被布置成线性阵列。 光源优选地包括具有透明材料的平面层的光管,所述发光模块被接合到所述平面层的边缘。 光管优选地附接到印刷电路板,并且柔性电路载体的连接区域附接到印刷电路板。 柔性电路载体可以将热量从发光模块移动到印刷电路板以及提供电连接。

    LED mounting having increased heat dissipation
    20.
    发明申请
    LED mounting having increased heat dissipation 有权
    LED安装具有增加的散热

    公开(公告)号:US20060202210A1

    公开(公告)日:2006-09-14

    申请号:US11075094

    申请日:2005-03-08

    摘要: There is disclosed a system and method for increasing heat dissipation of LED displays by using the current PCB packaging mounted to a LCD panel support structure thereby eliminating the need for a metal core PCB. In one embodiment, reverse mounted LEDs having heat dissipation pads are used to optimize heat transfer to a metal layer which is then placed in contact with the LCD support structure.

    摘要翻译: 公开了通过使用安装在LCD面板支撑结构上的当前PCB封装来增加LED显示器的散热的系统和方法,从而消除了对金属芯PCB的需要。 在一个实施例中,使用具有散热垫的反向安装的LED来优化到金属层的热传递,然后将金属层放置成与LCD支撑结构接触。