公开(公告)号：US20190287828A1

公开(公告)日：2019-09-19

申请号：US16297858

申请日：2019-03-11

Applicant: Tokyo Electron Limited

Inventor： Koji Yoshii ,  Tatsuya Yamaguchi ,  Hiroyuki Hayashi ,  Mitsuhiro Okada ,  Satoshi Takagi ,  Toshihiko Takahashi ,  Masafumi Shoji ,  Kazuya Kitamura

IPC: H01L21/67 ,  H01L21/673

Abstract: Provided is a heat insulation structure used for a vertical heat treatment apparatus that performs a heat treatment on a substrate. The vertical heat treatment apparatus includes: a processing container having a double tube structure including an inner tube and an outer tube closed upward, the processing container having an opening at a lower end thereof; a gas supply section and exhaust section provided on a lower side of the processing container; a lid configured to introduce or discharge the substrate into or from the opening and to open/close the opening; and a heating section provided to cover the processing container from an outside. The heat insulation structure is provided between the inner tube and the outer tube.

公开(公告)号：US09905442B2

公开(公告)日：2018-02-27

申请号：US15082342

申请日：2016-03-28

Applicant: Tokyo Electron Limited

Inventor： Tatsuya Yamaguchi ,  Koji Yoshii ,  Masafumi Shoji

IPC: F27B5/14 ,  H01L21/67 ,  H01L21/324

CPC classification number: H01L21/67109 ,  H01L21/324 ,  H01L21/67248

Abstract: Disclosed is a heat treatment apparatus including: a heating unit that heats an inside of a processing chamber that accommodates a plurality of workpieces; a temperature drop rate model storing unit that stores a temperature drop rate model; and a heat treatment performing unit that sets the temperature drop rate model stored in the temperature drop model storing unit and sets the inside of the processing chamber to the temperature and the time represented in the temperature drop rate model. The temperature drop rate model storing unit stores a plurality of temperature drop rate models, each of which has a different temperature drop rate. The processing chamber is divided into a plurality of zones, and the temperature drop rate mode is set for each of the zones. The heat treatment performing unit sets different temperature drop rate models in a plurality of zones to heat the plurality of workpieces.

公开(公告)号：US08821014B2

公开(公告)日：2014-09-02

申请号：US13751653

申请日：2013-01-28

Applicant: Tokyo Electron Limited ,  Fenwal Controls of Japan, Ltd.

Inventor： Takanori Saito ,  Koji Yoshii ,  Tsutomu Kurihara ,  Tomoya Okamura

IPC: G01K7/00 ,  G01K7/02

CPC classification number: G01K7/02 ,  G01K1/14 ,  H01L21/67248

Abstract: A temperature detecting element is fixed reliably at an accurate position to enable improvement in a rising characteristic of a temperature and high-accuracy temperature control. Provided is a temperature sensor including a temperature detecting element detecting a temperature in a branch tube branched from a main tube and a positioning supporting mechanism positioning and supporting the temperature detecting element. Tension is applied to a cord of the temperature detecting element. The positioning supporting mechanism is supported by the tensioned cord to position and support the temperature detecting element. The positioning supporting mechanism includes a supporting tube supporting the temperature detecting element, a positioning member supporting the supporting tube and fixed at a set position, and a tensioner applying tension to the cord of the temperature detecting element.

Abstract translation: 温度检测元件可靠地固定在精确位置，以提高温度的上升特性和高精度温度控制。 提供一种温度传感器，其包括检测从主管分支的支管中的温度的温度检测元件和定位并支撑温度检测元件的定位支撑机构。 对温度检测元件的绳索施加张力。 定位支撑机构由张紧的绳索支撑以定位和支撑温度检测元件。 定位支撑机构包括支撑温度检测元件的支撑管，支撑支撑管并固定在设定位置的定位构件，以及向温度检测元件的绳索施加张力的张紧器。

公开(公告)号：US10533896B2

公开(公告)日：2020-01-14

申请号：US15191599

申请日：2016-06-24

Applicant: TOKYO ELECTRON LIMITED

Inventor： Kazuteru Obara ,  Koji Yoshii ,  Yuki Wada ,  Hitoshi Kikuchi

IPC: G01J5/00 ,  C23C16/52 ,  C23C16/46 ,  C23C16/458 ,  H01L21/02 ,  C23C16/40 ,  C23C16/455 ,  H01L21/687

Abstract: There is provided a heat treatment apparatus for performing a predetermined film forming process on a substrate by mounting the substrate on a surface of a rotary table installed in a processing vessel and heating the substrate by a heating part while rotating the rotary table. The heat treatment apparatus includes: a first temperature measuring part of a contact-type configured to measure a temperature of the heating part; a second temperature measuring part of a non-contact type configured to measure a temperature of the substrate mounted on the rotary table in a state where the rotary table is being rotated; and a temperature control part configured to control the heating part based on a first measurement value measured by the first temperature measuring part and a second measurement value measured by the second temperature measuring part.

公开(公告)号：US20180197759A1

公开(公告)日：2018-07-12

申请号：US15864299

申请日：2018-01-08

Applicant: Tokyo Electron Limited

Inventor： Tatsuya Yamaguchi ,  Kazuteru Obara ,  Yasuaki Kikuchi ,  Koji Yoshii

IPC: H01L21/67

CPC classification number: H01L21/67109 ,  H01L21/67248

Abstract: Disclosed is a heat treatment apparatus including: a processing container configured to accommodate a substrate; a furnace body having a heater configured to heat the substrate accommodated in the processing container and provided around the processing container; a blower configured to supply a coolant to a space between the processing container and the furnace body; and a controller having a continuous operation mode in which the blower is continuously energized and an intermittent operation mode in which energization and de-energization of the blower are repeated, and configured to control driving of the blower based on an instruction voltage. The controller drives the blower in the intermittent operation mode when the instruction voltage is higher than 0 V and lower than a predetermined threshold voltage.

公开(公告)号：US09909809B2

公开(公告)日：2018-03-06

申请号：US13742599

申请日：2013-01-16

Applicant: TOKYO ELECTRON LIMITED

Inventor： Goro Takahashi ,  Takanori Saito ,  Wenling Wang ,  Koji Yoshii ,  Tatsuya Yamaguchi

IPC: A21B1/22 ,  H05B1/02 ,  A21B1/00 ,  F27D19/00 ,  F27D21/00 ,  F27B17/00 ,  H01L21/67

CPC classification number: F27D19/00 ,  F27B17/0025 ,  F27D21/0014 ,  H01L21/67109 ,  H01L21/67248

Abstract: The heat treatment apparatus includes: a processing chamber which accommodates a processing object; a heating unit which heats the processing object accommodated in the processing chamber; a temperature detecting unit which detects an internal temperature of the processing chamber; and a controller which sets a second setting temperature identical to as a temperature detected by the temperature detecting unit when the temperature detected by the temperature detecting unit falls below a predetermined first setting temperature due to an external disturbance; controls the heating unit so that a third setting temperature between the second setting temperature and the first setting temperature becomes identical to the temperature detected by the temperature detecting unit; and controls the heating unit so that the first setting temperature becomes identical to the temperature detected by the temperature detecting unit after the third setting temperature becomes identical to the temperature detected by the temperature detecting unit.

公开(公告)号：US20160363373A1

公开(公告)日：2016-12-15

申请号：US15172368

申请日：2016-06-03

Applicant: Tokyo Electron Limited

Inventor： Yuto Noda ,  Tatsuya Yamaguchi ,  Masayoshi Masunaga ,  Koji Yoshii

IPC: F27D19/00 ,  G06N3/12 ,  G05B13/04 ,  F27B1/10 ,  F27B1/02

CPC classification number: F27D19/00 ,  F27B1/02 ,  F27B1/10 ,  F27B17/0025 ,  F27D2019/0096 ,  G05B13/042 ,  G06N3/126 ,  H01L21/67109 ,  H01L21/67248

Abstract: The controller receives information including a plurality of evaluation indexes, a weight of each evaluation index, the number of times for calculating a value of an evaluation function, and initial parameter values, and performs a simulation based on the received information. Then, the controller calculates a value of an evaluation function based on a result of the simulation, and determines whether the calculated value of the evaluation function is minimum, to update parameters when it is determined that the value of the evaluation function is minimum. In the calculation of a value of the evaluation function, a value of the evaluation function is calculated again based on the number of times for calculating a value of an evaluation function. The controller generates new parameters by a genetic algorithm when a value of an evaluation function is calculated again.

Abstract translation: 控制器接收包括多个评价指标的信息，各评价指标的权重，用于计算评价函数的值的次数和初始参数值，并且基于接收到的信息进行模拟。 然后，控制器基于模拟结果计算评估函数的值，并且确定评估函数的计算值是否最小，以便在确定评估函数的值最小时更新参数。 在计算评价函数的值时，基于计算评价函数的值的次数再次计算评价函数的值。 当再次计算评估函数的值时，控制器通过遗传算法生成新参数。