公开(公告)号：US09669510B2

公开(公告)日：2017-06-06

申请号：US14533133

申请日：2014-11-05

Applicant: TOKYO ELECTRON LIMITED

Inventor： Akihiro Kubo ,  Masahiro Fukuda ,  Taro Yamamoto ,  Kenji Yada ,  Masashi Enomoto ,  Noboru Nakashima

IPC: B24B27/00 ,  B24B37/005 ,  B24B37/34 ,  B24B47/16 ,  B24B25/00 ,  B24D7/18

CPC classification number: B24B37/005 ,  B24B25/00 ,  B24B27/0061 ,  B24B37/34 ,  B24B47/16 ,  B24D7/18 ,  H01L21/0209 ,  H01L21/30625 ,  H01L21/67046 ,  H01L21/67253

Abstract: There is disclosed a polishing cleaning mechanism configured to be in contact with a rear surface of a substrate which is held in a substrate holding unit for holding the rear surface of the substrate and perform a polishing process and a cleaning process on the rear surface of the substrate, including a cleaning member configured to clean the rear surface of the substrate, a polishing member configured to polish the rear surface of the substrate, and a support member configured to support the polishing member and the cleaning member to face the rear surface of the substrate held in the substrate holding unit, wherein a surface of the polishing member facing the substrate and a surface of the cleaning member facing the substrate differ in relative height from each other.

公开(公告)号：US09256131B2

公开(公告)日：2016-02-09

申请号：US14452929

申请日：2014-08-06

Applicant: TOKYO ELECTRON LIMITED

Inventor： Hirofumi Takeguchi ,  Taro Yamamoto ,  Kousuke Yoshihara

IPC: G03F7/16 ,  G03F7/30

CPC classification number: G03F7/162 ,  G03F7/3021

Abstract: A developing method including a developing step in which, while a wafer horizontally held by a spin chuck is being rotated, the wafer is developed by supplying a developer onto a surface of the wafer, wherein provided before the developing step is a pre-wetting step in which, simultaneously with the developer being supplied from a first nozzle that is located on a position near a central part of the surface of the rotating wafer, a deionized water as a second liquid is supplied from a second nozzle that is located on a position nearer to an outer peripheral part of the wafer than the first nozzle, to thereby spread out the developer in the rotating direction of the wafer by a wall that is formed by the deionized water flowing to the outer peripheral side of the wafer with the rotation of the wafer.

Abstract translation: 一种显影方法，其包括显影步骤，其中当由旋转卡盘水平保持的晶片正在旋转时，通过将显影剂供应到晶片的表面上来显影晶片，其中在显影步骤之前提供预润湿步骤 其中与来自位于旋转晶片表面的中心附近的位置的第一喷嘴一起供给显影剂，作为第二液体的去离子水从位于位置上的第二喷嘴供给 比第一喷嘴更靠近晶片的外周部分，从而通过由去离子水流到晶片的外周侧而形成的壁沿着晶片的旋转方向展开显影剂 晶圆。

公开(公告)号：US09214363B2

公开(公告)日：2015-12-15

申请号：US13937833

申请日：2013-07-09

Applicant: TOKYO ELECTRON LIMITED

Inventor： Hideharu Kyouda ,  Taro Yamamoto

IPC: B05C11/02 ,  H01L21/67 ,  G03F7/11 ,  G03F7/16 ,  G03F7/20

CPC classification number: H01L21/67017 ,  G03F7/11 ,  G03F7/168 ,  G03F7/2041 ,  G03F7/70341 ,  H01L21/67051 ,  H01L21/6715

Abstract: Disclosed is a technique for preventing a water-repellent protective film formed on a resist film from peeling off during immersion exposure. A resist film is formed on the front surface of a substrate and then the peripheral edge portion of the resist film is removed. Before forming a water-repellent protective film onto the resist film, an adhesion-improving fluid, preferably hexamethyldisilazane gas, for improving the adhesion of the water-repellent protective film, is supplied to the region from which the resist film is removed.

Abstract translation: 公开了一种防止在浸渍曝光期间形成在抗蚀剂膜上的防水保护膜被剥离的技术。 在基板的前表面上形成抗蚀剂膜，然后除去抗蚀剂膜的周边部分。 在抗蚀剂膜上形成防水保护膜之前，为了提高防水性保护膜的粘附性，提供了粘附改善液，优选六甲基二硅氮烷气体，其中除去抗蚀剂膜的区域。

公开(公告)号：US10328546B2

公开(公告)日：2019-06-25

申请号：US15499402

申请日：2017-04-27

Applicant: TOKYO ELECTRON LIMITED

Inventor： Akihiro Kubo ,  Masahiro Fukuda ,  Taro Yamamoto ,  Kenji Yada ,  Masashi Enomoto ,  Noboru Nakashima

IPC: B24D7/18 ,  B24B25/00 ,  B24B27/00 ,  B24B37/34 ,  B24B47/16 ,  B24B49/16 ,  H01L21/02 ,  H01L21/67 ,  B24B37/005 ,  H01L21/306

Abstract: There is disclosed a polishing cleaning mechanism configured to be in contact with a rear surface of a substrate which is held in a substrate holding unit for holding the rear surface of the substrate and perform a polishing process and a cleaning process on the rear surface of the substrate, including a cleaning member configured to clean the rear surface of the substrate, a polishing member configured to polish the rear surface of the substrate, and a support member configured to support the polishing member and the cleaning member to face the rear surface of the substrate held in the substrate holding unit, wherein a surface of the polishing member facing the substrate and a surface of the cleaning member facing the substrate differ in relative height from each other.

公开(公告)号：US10289004B2

公开(公告)日：2019-05-14

申请号：US15338638

申请日：2016-10-31

Applicant: TOKYO ELECTRON LIMITED

Inventor： Kousuke Yoshihara ,  Hideharu Kyouda ,  Koshi Muta ,  Taro Yamamoto ,  Yasushi Takiguchi

IPC: G03F7/30 ,  B05D3/12 ,  B05C11/08 ,  B05D1/00 ,  H01L21/67 ,  B05C5/02 ,  B05D1/26

Abstract: A developing apparatus includes: a substrate holder that hold a substrate horizontally; a developer nozzle that supplies a developer onto the substrate to form a liquid puddle; a turning flow generation mechanism including a rotary member that rotates about an axis perpendicular to the substrate while the rotary member is being in contact with the liquid puddle thereby to generate a turning flow in the liquid puddle of the developer formed on the substrate; and a moving mechanism for moving the turning flow generation mechanism along a surface of the substrate. The line-width uniformity of a pattern can be improved by forming turning flows in a desired region of the substrate and stirring the developer.

公开(公告)号：US20190049845A1

公开(公告)日：2019-02-14

申请号：US16100609

申请日：2018-08-10

Applicant: Tokyo Electron Limited

Inventor： Koki Yoshimura ,  Shogo Takahasi ,  Yasushi Takiguchi ,  Taro Yamamoto

IPC: G03F7/16

Abstract: Disclosed is a liquid processing apparatus for performing a liquid processing by supplying a processing liquid from a nozzle to a substrate. The apparatus includes: a cup body provided to surround a substrate holding unit; a nozzle arm provided with a nozzle and supported by a support unit; a moving mechanism configured to move the nozzle arm via the support unit between a stand-by position and a processing position; an elevating mechanism configured to move up and down the support unit; a cover member including a top plate portion provided above a driving region and configured to partition the driving region from a region where the substrate is held within the cup body; an opening formed in a portion corresponding to a moving path of the support unit in the top plate portion; and an exhaust mechanism configured to evacuate the driving region.

公开(公告)号：US10014190B2

公开(公告)日：2018-07-03

申请号：US14339539

申请日：2014-07-24

Applicant: TOKYO ELECTRON LIMITED

Inventor： Yasushi Takiguchi ,  Koki Yoshimura ,  Taro Yamamoto ,  Hideharu Kyouda ,  Koshi Muta

IPC: H01L21/67

CPC classification number: H01L21/67051 ,  H01L21/6715

Abstract: A liquid processing apparatus for performing liquid processing with respect to a substrate using processing fluid, includes: a plurality of substrate holding units arranged side by side in a left-right direction; a nozzle configured to supply the processing fluid to the substrate held in each of the substrate holding units; and a nozzle moving mechanism configured to move the nozzle forward and backward in a front-rear direction intersecting an arrangement direction of the substrate holding units between a supplying position in which the processing fluid is supplied to a region including a central portion of the substrate and a waiting position which is defined at a rear side of a row of the substrate holding units opposite to a front side of the row of the substrate holding units at which the substrate is loaded and unloaded.

公开(公告)号：US09716002B2

公开(公告)日：2017-07-25

申请号：US15204068

申请日：2016-07-07

Applicant: TOKYO ELECTRON LIMITED

Inventor： Yasushi Takiguchi ,  Taro Yamamoto ,  Akihiro Fujimoto ,  Shuuichi Nishikido ,  Dai Kumagai ,  Naoto Yoshitaka ,  Takahiro Kitano ,  Yoichi Tokunaga

IPC: H01L21/02 ,  B08B3/02 ,  H01L21/67 ,  B08B1/00 ,  B08B1/04 ,  B08B5/02 ,  B08B7/00 ,  H01L21/687

CPC classification number: H01L21/0209 ,  B08B1/002 ,  B08B1/04 ,  B08B3/02 ,  B08B5/02 ,  B08B7/0057 ,  H01L21/67028 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/68742 ,  H01L21/68764

Abstract: A disclosed substrate cleaning apparatus for cleaning a back surface of a substrate includes a first substrate supporting portion configured to support the substrate at a first area of a back surface of the substrate, the back surface facing down; a second substrate supporting portion configured to support the substrate at a second area of the back surface of the substrate, the second area being separated from the first area; a cleaning liquid supplying portion configured to supply cleaning liquid to the back surface of the substrate; a drying portion configured to dry the second area of the back surface of the substrate; and a cleaning portion configured to clean a third area of the back surface of the substrate when the substrate is supported by the first substrate supporting portion, the third area including the second area, and a fourth area of the back surface of the substrate when the substrate is supported by the second substrate supporting portion, the fourth area excluding the second area of the back surface.

公开(公告)号：US09568829B2

公开(公告)日：2017-02-14

申请号：US14449419

申请日：2014-08-01

Applicant: TOKYO ELECTRON LIMITED

Inventor： Kousuke Yoshihara ,  Hideharu Kyouda ,  Koshi Muta ,  Taro Yamamoto ,  Yasushi Takiguchi ,  Masahiro Fukuda

IPC: B05D3/12 ,  G03F7/30 ,  B05C5/02 ,  B05D1/00 ,  B05C11/08 ,  B05D1/26 ,  H01L21/67

CPC classification number: G03F7/3021 ,  B05C5/02 ,  B05C5/027 ,  B05C11/08 ,  B05D1/005 ,  B05D1/26 ,  G03F7/30 ,  H01L21/6715

Abstract: A developing method includes: horizontally holding an exposed substrate by a substrate holder; forming a liquid puddle on a part of the substrate, by supplying a developer from a developer nozzle; rotating the substrate; spreading the liquid puddle on a whole surface of the substrate, by moving the developer nozzle such that a supply position of the developer on the rotating substrate is moved in a radial direction of the substrate; bringing, simultaneously with the spreading of the liquid puddle on the whole surface of the substrate, a contact part into contact with the liquid puddle, the contact part being configured to be moved together with the developer nozzle and having a surface opposed to the substrate which is smaller than the surface of the substrate. According to this method, an amount of liquid falling down to the outside of the substrate can be inhibited. In addition, since the rotating speed of the substrate can be decreased, spattering of the developer can be inhibited. Further, a throughput can be improved by stirring the developer.

Abstract translation: 显影方法包括：通过基板保持器水平保持曝光的基板; 通过从显影剂喷嘴提供显影剂，在基底的一部分上形成液体熔池; 旋转基板; 通过使显影剂喷嘴移动使得旋转基板上的显影剂的供给位置沿基板的径向方向移动，将液体熔池分散在基板的整个表面上; 使液体熔池在基板的整个表面上的扩展同时与接触部分与液体熔池接触，接触部分被构造成与显影剂喷嘴一起移动并且具有与基板相对的表面， 小于衬底的表面。 根据该方法，能够抑制向基板外侧落下的液体的量。 此外，由于可以降低基板的旋转速度，可以抑制显影剂的飞溅。 此外，可以通过搅拌显影剂来提高生产量。

公开(公告)号：US08678684B2

公开(公告)日：2014-03-25

申请号：US13760399

申请日：2013-02-06

Applicant: Tokyo Electron Limited

Inventor： Taro Yamamoto ,  Kousuke Yoshihara ,  Yuichi Yoshida

IPC: G03D5/00

CPC classification number: H01L21/027 ,  G03F7/3021 ,  H01L21/67051 ,  H01L21/6715

Abstract: A method of developing a substrate including rotating the substrate and supplying a developing liquid from a discharge port of a developer nozzle onto the surface of the substrate, while moving the developer nozzle, disposed above the substrate, from a central portion towards a peripheral portion of the substrate, and supplying a first rinse liquid from a discharge port of a first rinse nozzle onto the surface of the substrate, while moving the first rinse nozzle, disposed above the substrate, from the central portion towards the peripheral portion of the substrate. The supplying of the developing liquid and the first rinse liquid are performed concurrently, with the first rinse nozzle being maintained nearer to a center of the substrate than the developer nozzle.

Abstract translation: 一种显影衬底的方法，包括使衬底旋转并将显影液从显影剂喷嘴的排出口供应到衬底的表面上，同时将位于衬底上方的显影剂喷嘴从中心部分朝向衬底的周边部分移动 并且将第一冲洗液从第一冲洗喷嘴的排出口提供到基板的表面上，同时将设置在基板上方的第一冲洗喷嘴从中心部分朝向基板的周边部分移动。 同时进行显影液和第一漂洗液的供给，第一冲洗喷嘴比显影剂喷嘴更靠近基板的中心。