公开(公告)号：US5270438A

公开(公告)日：1993-12-14

申请号：US679940

申请日：1991-04-03

申请人： Masami Yusa ,  Shinji Takeda ,  Yasuo Miyadera

发明人： Masami Yusa ,  Shinji Takeda ,  Yasuo Miyadera

IPC分类号： C08G73/10 ,  C08G69/26 ,  C08G8/02

CPC分类号： C08G73/1039 ,  C08G73/1007

摘要： A fluorine-containing polyimide having a low dielectric constant, low water absorption and excellent heat resistance and moisture resistance and a precursor thereof such as a fluorine-containing polyamide-acid, can be prepared by reacting an acid anhydride with an aromatic diamine having perfluoroalkyl group.

公开(公告)号：US5243019A

公开(公告)日：1993-09-07

申请号：US674604

申请日：1991-03-25

申请人： Shinji Takeda ,  Masami Yusa ,  Yasuo Miyadera

发明人： Shinji Takeda ,  Masami Yusa ,  Yasuo Miyadera

IPC分类号： C08G69/26 ,  C08G69/32 ,  C08G69/40 ,  C08G69/42

CPC分类号： C08G69/265 ,  C08G69/32 ,  C08G69/40

摘要： A fluorine-containing aromatic polyamide obtained by reacting an aromatic dicarboxylic acid having a perfluoroalkenyloxy group with a diamine is excellent in water repellency, water resistance, heat resistance, etc.

摘要翻译： 通过使具有全氟链烯氧基的芳香族二羧酸与二胺反应而得到的含氟芳香族聚酰胺的斥水性，耐水性，耐热性等优异。

公开(公告)号：US08031720B2

公开(公告)日：2011-10-04

申请号：US10590033

申请日：2005-02-17

申请人： Kengo Yagyu ,  Shinji Takeda ,  Hidenori Aoki

发明人： Kengo Yagyu ,  Shinji Takeda ,  Hidenori Aoki

IPC分类号： H04L12/28 ,  H04L12/56

CPC分类号： H04L45/00 ,  H04L12/4625 ,  H04L45/48 ,  H04W40/02 ,  H04W88/08 ,  Y02D70/142 ,  Y02D70/22 ,  Y02D70/30

摘要： A fault-tolerant packet transmission system is disclosed that can avoid localized load concentration on a specific portion of a network, while autonomously keeping route optimization, without adding a route control function to non-mesh devices. In a packet transmission system including multiple wireless base stations and one or more terminal devices belonging to one of the wireless base stations, each of the wireless base stations has a location table describing each of the terminal devices associated with a corresponding wireless base station to which the terminal device currently belongs. The wireless base stations exchange the information in the location table with each other to update the location tables and forward a received packet to the next hop along a transmission route toward a destination terminal device.

摘要翻译： 公开了一种容错分组传输系统，其可以避免在网络的特定部分上的局部负载集中，同时自主地保持路由优化，而不向非网状设备添加路由控制功能。 在包括属于无线基站之一的多个无线基站和一个或多个终端设备的分组传输系统中，每个无线基站具有描述与相应无线基站相关联的每个终端设备的位置表， 终端设备当前属于。 无线基站将位置表中的信息彼此交换以更新位置表，并且将接收到的分组转发到朝向目的地终端设备的传输路由的下一跳。

公开(公告)号：US07720466B2

公开(公告)日：2010-05-18

申请号：US10855640

申请日：2004-05-28

申请人： Shinji Takeda ,  Toru Otsu

发明人： Shinji Takeda ,  Toru Otsu

IPC分类号： H04M3/00

CPC分类号： H04W48/10 ,  H04W48/18

摘要： A communication system includes a transmission unit configured to transmit control information relating to plural radio communication systems to a radio terminal through a dedicated control channel commonly used by the plural radio communication systems and for transmitting the control information relating to the plural radio communication systems.

摘要翻译： 通信系统包括：发送单元，被配置为通过多个无线电通信系统共同使用的专用控制信道向无线电终端发送与多个无线电通信系统有关的控制信息，并发送与多个无线电通信系统有关的控制信息。

公开(公告)号：US20080159249A1

公开(公告)日：2008-07-03

申请号：US11961563

申请日：2007-12-20

申请人： Hideaki Takahashi ,  Shinji Takeda ,  Shunji Miura ,  Hiromitsu Asakura

发明人： Hideaki Takahashi ,  Shinji Takeda ,  Shunji Miura ,  Hiromitsu Asakura

IPC分类号： H04Q7/00

CPC分类号： H04W16/30 ,  H04L5/0005 ,  H04L5/0037 ,  H04L5/006 ,  H04L5/0062 ,  H04W16/10 ,  H04W72/0453 ,  H04W72/082

摘要： The present invention achieves a flexible and efficient use of frequency bands in a radio communication system in which all or part of frequency bands available in a cell is allocated respectively as frequency bands available in each of a plurality of regions in the cell. An allocation control unit included in a radio communication apparatus according to the present invention is configured to allocate all the frequency band f1 to f6 available in the cell, as a frequency band available in an inner region, to allocate specific frequency bands from among all the all the frequency band f1 to f6 available in the cell, as a frequency band available in an outer region, and to notify the specific frequency band available in the outer region in field B1 to B3 corresponding to the outer region in a data frame, by using a bit map pattern.

摘要翻译： 本发明实现了在无线电通信系统中灵活有效地使用频带，其中小区中可用的全部或部分频带分别被分配为小区中的多个区域中的每个区域中可用的频带。 包括在根据本发明的无线电通信装置中的分配控制单元被配置为将在小区中可用的全部频带f 1至f 6分配为内部区域中可用的频带，以从其中分配特定频带 作为在外部区域中可用的频带，可以在小区中可用的全部频带f 1至f 6，并且通知对应于外部区域的场B 1至B 3中的外部区域中可用的特定频带 在数据帧中，通过使用位图模式。

公开(公告)号：US07116592B2

公开(公告)日：2006-10-03

申请号：US11130141

申请日：2005-05-17

申请人： Shinji Takeda ,  Yoshiharu Hirata ,  Naokazu Kuzuno

发明人： Shinji Takeda ,  Yoshiharu Hirata ,  Naokazu Kuzuno

IPC分类号： G11C29/00

CPC分类号： G11C29/4401 ,  G11C16/04 ,  G11C29/44 ,  G11C29/50004 ,  G11C29/78 ,  G11C2029/0405

摘要： Data read out from each memory cell in a memory cell array is compared with an expected value by a comparator, and the quality of a memory cell is determined by performing program verify and erase verify. Based on the comparison result of the comparator, a detected defective cell is repaired by replacing it with a spare cell. Every time a defective cell is replaced with a spare cell, information on the defective cell is stored in a register, and whether a defective cell exists and whether the repair is possible are determined on the basis of the information. When the repair is possible, a control circuit is caused to execute control, and a detected defective cell is repaired by replacing it with a spare cell. When the repair is impossible, the defect repair stops.

摘要翻译： 通过比较器将存储单元阵列中的每个存储单元读出的数据与预期值进行比较，并通过执行程序验证和擦除验证来确定存储单元的质量。 基于比较器的比较结果，通过用备用单元替换检测到的缺陷单元进行修复。 每当有缺陷的单元被替换为备用单元时，有缺陷单元的信息被存储在寄存器中，并且是否存在缺陷单元以及是否可以修复是可能的。 当可以进行修理时，使控制电路执行控制，并通过用备用单元替换来检测检测到的故障单元。 修理不可能时，缺陷修复停止。

公开(公告)号：US20060180903A1

公开(公告)日：2006-08-17

申请号：US11379921

申请日：2006-04-24

申请人： Shinji Takeda ,  Takashi Masuko ,  Masami Yusa ,  Tooru Kikuchi ,  Yasuo Miyadera ,  Iwao Maekawa ,  Mitsuo Yamasaki ,  Akira Kageyama ,  Aizou Kaneda

发明人： Shinji Takeda ,  Takashi Masuko ,  Masami Yusa ,  Tooru Kikuchi ,  Yasuo Miyadera ,  Iwao Maekawa ,  Mitsuo Yamasaki ,  Akira Kageyama ,  Aizou Kaneda

IPC分类号： H01L23/495

CPC分类号： H01L24/27 ,  H01L23/49513 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/743 ,  H01L24/83 ,  H01L24/97 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83805 ,  H01L2224/8385 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/181 ,  Y10T428/28 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

摘要： A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.

摘要翻译： 将半导体芯片与吸水率为1.5体积％以下的薄膜状有机芯片接合材料贴合在引线框架上; 具有1.0体积％以下的饱和吸湿性，在250℃的温度下具有不大于3.0重量％的残留挥发组分，弹性模量为10MPa以下。半导体装置 这样获得的半导体器件的封装的回流焊接期间不会发生回流裂纹。

公开(公告)号：US06825249B1

公开(公告)日：2004-11-30

申请号：US09616943

申请日：2000-07-14

申请人： Shinji Takeda ,  Takashi Masuko ,  Masami Yusa ,  Yasuo Miyadera ,  Mituo Yamasaki ,  Iwao Maekawa ,  Akio Kotato ,  Yuusuke Miyamae ,  Tadaji Satou ,  Makoto Saitou ,  Tooru Kikuchi ,  Akira Kageyama ,  Aizou Kaneda

发明人： Shinji Takeda ,  Takashi Masuko ,  Masami Yusa ,  Yasuo Miyadera ,  Mituo Yamasaki ,  Iwao Maekawa ,  Akio Kotato ,  Yuusuke Miyamae ,  Tadaji Satou ,  Makoto Saitou ,  Tooru Kikuchi ,  Akira Kageyama ,  Aizou Kaneda

IPC分类号： C08K300

CPC分类号： H01L24/27 ,  H01L21/4821 ,  H01L23/49513 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/743 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/75 ,  H01L2224/7565 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83805 ,  H01L2224/8385 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/3512 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

摘要： Provided are a laminating method and machine for successively heating and compression-bonding a film-shaped organic die-bonding material on a leadframe. leadframe 7 is placed on a travelling table 8 and is heated there. A film-shaped organic die-bonding material 2 is punched out and the resulting film is tack-bonded to a die pad on the leadframe. The leadframe with the film tack-bonded thereon is then moved to a position B by the travelling table. After the film is pressed by a compression-bonding element at the position B, a chip is mounted on the film-shaped organic die-bonding material 2. It is therefore possible to bond a film-shaped organic die-bonding material under compression on a leadframe with good productivity but without voids and further to avoid package cracking upon mounting a chip.

摘要翻译： 提供了一种用于在引线框上依次加热和压接薄膜状有机芯片接合材料的层压方法和机器。将框架7放置在行进台8上并在那里被加热。 将膜状有机芯片接合材料2冲压出来，将所得的薄膜粘合到引线框架上的芯片焊盘上。 然后将其上粘贴有胶片的引线框架通过移动台移动到位置B. 在位置B的压接元件压制薄膜后，将薄片状的有机芯片接合材料2安装在芯片上。因此，可以将薄膜状的有机模片接合材料压缩 引导框架，生产效率高，但没有空隙，并进一步避免了在安装芯片时的封装破裂。

公开(公告)号：US06717242B2

公开(公告)日：2004-04-06

申请号：US09785194

申请日：2001-02-20

申请人： Shinji Takeda ,  Takashi Masuko ,  Masami Yusa ,  Tooru Kikuchi ,  Yasuo Miyadera ,  Iwao Maekawa ,  Mitsuo Yamasaki ,  Akira Kageyama ,  Aizou Kaneda

发明人： Shinji Takeda ,  Takashi Masuko ,  Masami Yusa ,  Tooru Kikuchi ,  Yasuo Miyadera ,  Iwao Maekawa ,  Mitsuo Yamasaki ,  Akira Kageyama ,  Aizou Kaneda

IPC分类号： H01L23495

CPC分类号： H01L24/27 ,  H01L23/49513 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/743 ,  H01L24/83 ,  H01L2224/05599 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83805 ,  H01L2224/8385 ,  H01L2224/85399 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/3512 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 Mpa or less at a temperature of 259° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.

摘要翻译： 将半导体芯片与吸水率为1.5体积％以下的薄膜状有机芯片接合材料贴合在引线框架上; 具有1.0体积％以下的饱和吸湿性，在259℃的温度下具有不大于3.0重量％的残留挥发组分，弹性模量为10Mpa以下。半导体装置 这样获得的半导体器件的封装的回流焊接期间不会发生回流裂纹。

公开(公告)号：US6099678A

公开(公告)日：2000-08-08

申请号：US875330

申请日：1997-06-25

申请人： Akio Kotato ,  Yuusuke Miyamae ,  Tadaji Satou ,  Makoto Saitou ,  Tooru Kikuchi ,  Akira Kageyama ,  Shinji Takeda ,  Takashi Masuko ,  Masami Yusa ,  Yasuo Miyadera ,  Mituo Yamasaki ,  Iwao Maekawa ,  Aizou Kaneda

发明人： Akio Kotato ,  Yuusuke Miyamae ,  Tadaji Satou ,  Makoto Saitou ,  Tooru Kikuchi ,  Akira Kageyama ,  Shinji Takeda ,  Takashi Masuko ,  Masami Yusa ,  Yasuo Miyadera ,  Mituo Yamasaki ,  Iwao Maekawa ,  Aizou Kaneda

IPC分类号： H01L21/58 ,  H01L21/60 ,  B32B31/00 ,  B23P19/00 ,  B32B35/00 ,  H05K3/30

CPC分类号： H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/743 ,  H01L24/75 ,  H01L24/83 ,  H01L24/97 ,  H01L2224/05599 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/7565 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83805 ,  H01L2224/8385 ,  H01L2224/85 ,  H01L2224/85399 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/181 ,  Y10T156/1062 ,  Y10T156/107 ,  Y10T156/12 ,  Y10T156/1322 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/53178

摘要： A laminating method and a machine are provided for successively heating and compression-bonding a film-shaped organic die-bonding material on a leadframe with good productivity but without voids and further to avoid package cracking upon mounting a chip. A leadframe 7 is placed on a travelling table 8 and is heated there. A film-shaped organic die-bonding material 2 is punched out and the resulting film is tack-bonded to a die pad on the leadframe. The leadframe with the film tack-bonded thereon is then moved to a position b by the travelling table. After the film is pressed by a compression-bonding element at the position B, a chip is mounted on the film-shaped organic die-bonding material 2.

摘要翻译： PCT No.PCT / JP95 / 02691 Sec。 371日期：1997年6月25日 102（e）日期1997年6月25日PCT 1995年12月26日PCT PCT。 公开号WO96 / 29730 日期1996年9月26日提供层压方法和机器，用于在引线框上以良好的生产率连续加热和压接粘合材料，但没有空隙，并且进一步避免了在安装芯片时的封装破裂。 引线框架7放置在行进台8上并在那里被加热。 将膜状有机芯片接合材料2冲压出来，将所得的薄膜粘合到引线框架上的芯片焊盘上。 然后将其上粘贴有胶片的引线框架通过移动台移动到位置b。 在位置B的压接元件压制薄膜后，在薄膜状有机芯片接合材料2上安装芯片。