CYCLOALKYL GROUP-CONTAINING SILICONE RESIN COMPOSITION AND A METHOD OF USING THE SAME
    12.
    发明申请
    CYCLOALKYL GROUP-CONTAINING SILICONE RESIN COMPOSITION AND A METHOD OF USING THE SAME 有权
    含环烷基的含硅树脂组合物及其使用方法

    公开(公告)号:US20110309407A1

    公开(公告)日:2011-12-22

    申请号:US13165100

    申请日:2011-06-21

    摘要: One object of the present invention is to provide a silicone resin composition having remarkably low gas permeability which is useful for a purpose requiring lower gas permeability. Further, another object of the present invention is to provide an optical semiconductor device provided with a cured product obtained by curing the silicone resin composition which has discoloration resistance, durable reflection efficiency and high reliability. The present invention provides a silicone resin composition comprising (A) an organopolysiloxane having at least two alkenyl groups per molecule, and is represented by the average compositional formula (1), (B) an organohydrogenpolysiloxane having at least two hydrogen atoms bonded to a silicon atom, and is represented by the average compositional formula (2), (C) a catalytic amount of a curing catalyst, and (D) 0.001 to 3 parts by mass of an antioxidant, relative to a total 100 parts by mass of components (A) and (B).

    摘要翻译: 本发明的一个目的是提供一种具有非常低的透气性的有机硅树脂组合物,其用于要求较低气体渗透性的目的。 此外,本发明的另一个目的是提供一种光学半导体器件,其具有通过固化具有耐变色性,耐久反射效率和高可靠性的有机硅树脂组合物获得的固化产物。 本发明提供一种有机硅树脂组合物,其包含(A)每分子具有至少两个烯基的有机聚硅氧烷,并且由平均组成式(1)表示,(B)具有至少两个与硅结合的氢原子的有机氢聚硅氧烷 原子,由平均组成式(2)表示,(C)催化剂量的固化催化剂,(D)相对于总计100质量份成分为0.001〜3质量份的抗氧化剂( A)和(B)。

    Epoxy composition for encapsulating an optical semiconductor element
    13.
    发明授权
    Epoxy composition for encapsulating an optical semiconductor element 有权
    用于封装光学半导体元件的环氧组合物

    公开(公告)号:US08710158B2

    公开(公告)日:2014-04-29

    申请号:US13080730

    申请日:2011-04-06

    摘要: The present invention has a purpose of providing an epoxy composition for encapsulating an optical semiconductor element which composition provides a cured product having a low gas permeability and excellent curability in a form of a thin film together with good light transmission and crack resistance. The present invention provides a composition comprising (A) a silicone-modified epoxy compound represented by the formula (1), (B) a curing agent and (C) a polyhydric alcohol. The present invention further provides a composition comprising a composition prepared by reacting (A) the silicone-modified epoxy compound, (B) the curing agent and (C) the polyhydric alcohol and (D) a curing catalyst, and a cured product thereof.

    摘要翻译: 本发明的目的是提供一种用于封装光学半导体元件的环氧组合物,该组合物提供具有低透气性的固化产物和薄膜形式的优异的固化性以及良好的透光性和抗裂纹性。 本发明提供一种组合物,其包含(A)由式(1)表示的硅氧烷改性的环氧化合物,(B)固化剂和(C)多元醇。 本发明还提供一种组合物,其包含通过(A)硅氧烷改性的环氧化合物,(B)固化剂和(C)多元醇和(D)固化催化剂及其固化产物反应制备的组合物。

    EPOXY COMPOSITION FOR ENCAPSULATING AN OPTICAL SEMICONDUCTOR ELEMENT
    15.
    发明申请
    EPOXY COMPOSITION FOR ENCAPSULATING AN OPTICAL SEMICONDUCTOR ELEMENT 有权
    用于封装光学半导体元件的环氧组合物

    公开(公告)号:US20110251305A1

    公开(公告)日:2011-10-13

    申请号:US13080730

    申请日:2011-04-06

    IPC分类号: C08L63/00 C08G77/26

    摘要: The present invention has a purpose of providing an epoxy composition for encapsulating an optical semiconductor element which composition provides a cured product having a low gas permeability and excellent curability in a form of a thin film together with good light transmission and crack resistance. The present invention provides a composition comprising (A) a silicone-modified epoxy compound represented by the formula (1), (B) a curing agent and (C) a polyhydric alcohol. The present invention further provides a composition comprising a composition prepared by reacting (A) the silicone-modified epoxy compound, (B) the curing agent and (C) the polyhydric alcohol and (D) a curing catalyst, and a cured product thereof.

    摘要翻译: 本发明的目的是提供一种用于封装光学半导体元件的环氧组合物,该组合物提供具有低透气性的固化产物和薄膜形式的优异的固化性以及良好的透光性和抗裂纹性。 本发明提供一种组合物,其包含(A)由式(1)表示的硅氧烷改性的环氧化合物,(B)固化剂和(C)多元醇。 本发明还提供一种组合物,其包含通过(A)硅氧烷改性的环氧化合物,(B)固化剂和(C)多元醇和(D)固化催化剂及其固化产物反应制备的组合物。

    Silicone lens and silicone resin composition for molding lens
    16.
    发明授权
    Silicone lens and silicone resin composition for molding lens 有权
    硅胶透镜和用于成型镜片的硅树脂组合物

    公开(公告)号:US07737194B2

    公开(公告)日:2010-06-15

    申请号:US11785791

    申请日:2007-04-20

    IPC分类号: C08L83/04

    摘要: A colorless transparent silicone lens produced by thermally curing a silicone resin composition comprising (A) an organopolysiloxane having a resin structure comprising R1SiO1.5 unit, R22SiO unit, and R3aR4bSiO(4-a-b)/2 unit wherein R1, R2, and R3 are independently methyl group, ethyl group, propyl group, cyclohexyl group, or phenyl group, R4 is vinyl group or allyl group, a is 0, 1, or 2, b is 1 or 2, and a+b is 2 or 3, and wherein number of repetition of the R22SiO unit is 5 to 300, (B) an organohydrogen polysiloxane having a resin structure comprising R1SiO1.5 unit, R22SiO unit, and R3cHdSiO(4-c-d)/2 unit wherein c is 0, 1, or 2, d is 1 or 2, and c+d is 2 or 3, and wherein number of repetition of the R22SiO unit is 5 to 300, the component, and (C) a platinum group catalyst. A silicone lens having excellent flexibility, transparency, and moldability as well as reduced surface tackiness is provided.

    摘要翻译: 通过热固化硅氧烷树脂组合物制得的无色透明硅氧烷透镜,其包含(A)具有包含R1SiO1.5单元,R22SiO单元和R3aR4bSiO(4-ab)/ 2单元的树脂结构的有机聚硅氧烷,其中R1,R2和R3为 乙基,丙基,环己基或苯基,R4为乙烯基或烯丙基,a为0,1或2,b为1或2,a + b为2或3,以及 其中R22SiO单元的重复数为5〜300,(B)具有包含R1SiO1.5单元,R22SiO单元和R3cHdSiO(4-cd)/ 2单元的树脂结构的有机氢聚硅氧烷,其中c为0,1或 2,d为1或2,c + d为2或3,R22SiO单元的重复数为5〜300,该成分为(C)铂族催化剂。 提供了具有优异的柔性,透明性和成型性以及降低的表面粘性的硅氧烷透镜。

    Epoxy-silicone mixed resin composition, cured article thereof, and light-emitting semiconductor device
    19.
    发明申请
    Epoxy-silicone mixed resin composition, cured article thereof, and light-emitting semiconductor device 审中-公开
    环氧硅酮类混合树脂组合物,其固化物,发光半导体装置

    公开(公告)号:US20060270808A1

    公开(公告)日:2006-11-30

    申请号:US11438444

    申请日:2006-05-23

    IPC分类号: C08L83/05 C08L63/00

    摘要: An epoxy-silicone mixed resin composition comprising (A) an organopolysiloxane having at least one vinyl or allyl group and at least one hydroxyl group, (B) an organic resin having at least one epoxy group, (C) an organohydrogenpolysiloxane, (D) a platinum group metal-based catalyst, (E) an aluminum compound, and (F) 0.1-15% by weight of an organic mold release agent is molded and cured in a metal mold into a transparent product which can be smoothly removed from the mold. The cured product has a satisfactory bond strength to metal frames and maintains heat resistance. LED devices can be fabricated by continuous mechanical molding.

    摘要翻译: 一种环氧硅树脂混合树脂组合物,其包含(A)具有至少一个乙烯基或烯丙基和至少一个羟基的有机聚硅氧烷,(B)具有至少一个环氧基的有机树脂,(C)有机氢聚硅氧烷,(D) 铂族金属类催化剂(E)铝化合物和(F)0.1-15%重量的有机脱模剂在金属模具中成型并固化成透明产品,其可以从 模子。 固化产品对金属框架具有令人满意的粘合强度,并保持耐热性。 LED器件可以通过连续机械成型制造。

    Lens-forming silicone resin composition and silicone lens
    20.
    发明申请
    Lens-forming silicone resin composition and silicone lens 审中-公开
    透镜成型硅树脂组合物和硅胶透镜

    公开(公告)号:US20060264583A1

    公开(公告)日:2006-11-23

    申请号:US11437664

    申请日:2006-05-22

    IPC分类号: C08L83/04

    摘要: Silicone resin compositions comprising (A) an organopolysiloxane containing at least two aliphatic unsaturated bonds and having a viscosity of 100-1,000,000 mPa·s at 25° C., (B) an organohydrogenpolysiloxane having at least three silicon-bonded hydrogen atoms (SiH groups) in the form of HR62SiO-, and (C) a platinum group metal base catalyst cure into colorless transparent parts which are useful lenses.

    摘要翻译: 硅氧烷树脂组合物,其包含(A)含有至少两个脂族不饱和键并且在25℃下具有100-1,000,000mPa.s粘度的有机聚硅氧烷,(B)具有至少三个与硅键合的氢原子的有机氢聚硅氧烷(SiH基) ),和(C)铂族金属碱催化剂固化成无色透明部分,这是有用的透镜。