公开(公告)号：US08097813B2

公开(公告)日：2012-01-17

申请号：US12414122

申请日：2009-03-30

申请人： Vadim Gektin ,  David W. Copeland

发明人： Vadim Gektin ,  David W. Copeland

IPC分类号： H05K1/03

CPC分类号： H05K3/325 ,  B82Y10/00 ,  H01R12/7082 ,  H05K2201/026 ,  H05K2201/10378

摘要： In at least one embodiment, an interposer for a board interconnect system is provided. The interposer comprises a frame and at least one interconnect. The frame receives a substrate. The substrate includes a top side, a bottom side, and a conductive interface. The conductive interface extends through the top side and the bottom side for delivering an electrical signal from an electrical device positioned on the top side therethrough. The at least one interconnect includes a plurality of carbon nanotubes (CNTs) positioned within the frame for contacting the conductive interface of the substrate to deliver the electrical signal to a conductive arrangement of a circuit board.

摘要翻译： 在至少一个实施例中，提供了用于板互连系统的插入器。 插入器包括框架和至少一个互连件。 框架接收基板。 基板包括顶侧，底侧和导电界面。 导电接口延伸穿过顶侧和底侧，用于从位于顶侧的电气装置传送电信号。 所述至少一个互连件包括位于所述框架内的多个碳纳米管（CNT），用于接触所述基板的所述导电接口以将所述电信号传送到电路板的导电布置。

公开(公告)号：US07791194B2

公开(公告)日：2010-09-07

申请号：US12101077

申请日：2008-04-10

申请人： Vadim Gektin ,  David W. Copeland

发明人： Vadim Gektin ,  David W. Copeland

IPC分类号： H01L23/488

CPC分类号： H05K3/325 ,  B82Y10/00 ,  H01L24/13 ,  H01L24/14 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/0401 ,  H01L2224/06515 ,  H01L2224/10135 ,  H01L2224/13193 ,  H01L2224/1403 ,  H01L2224/14051 ,  H01L2224/14505 ,  H01L2224/14515 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/32225 ,  H01L2224/731 ,  H01L2224/73103 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81139 ,  H01L2224/81815 ,  H01L2224/81906 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/014 ,  H05K3/3436 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2201/10659 ,  H05K2201/10719 ,  H05K2201/2036 ,  H01L2924/00 ,  H01L2924/00012

摘要： A composite interconnect system includes a plurality of carbon nanotubes, a plurality of solder balls and standoff balls disposed on a first device to provide a connection to a second device. A die-attached substrate includes a substrate and one or more die disposed on the substrate by a die-attach composite interconnect. The die-attach composite interconnect includes a plurality of carbon nanotubes, solder bumps, and standoff balls disposed on the die to provide one or more connections to the substrate. A PCB-attached substrate package includes a substrate package and one or more die disposed on the substrate package. The substrate package is disposed on a PCB by a PCB-attach composite interconnect. The PCB-attach composite interconnect includes a plurality of carbon nanotubes, solder balls, and standoff balls disposed on the substrate package to provide one or more connections to the PCB.

摘要翻译： 复合互连系统包括多个碳纳米管，多个焊球和支撑球，其设置在第一装置上以提供到第二装置的连接。 芯片连接的基板包括基板和通过管芯附着复合互连件设置在基板上的一个或多个管芯。 管芯附着复合互连件包括多个碳纳米管，焊料凸块和设置在管芯上的间隙球，以提供与衬底的一个或多个连接。 附着有PCB的衬底封装包括衬底封装和设置在衬底封装上的一个或多个管芯。 衬底封装通过PCB连接复合互连布置在PCB上。 PCB附着复合互连件包括多个碳纳米管，焊球和设置在衬底封装上的间隙球，以提供与PCB的一个或多个连接。

公开(公告)号：US20090256255A1

公开(公告)日：2009-10-15

申请号：US12101077

申请日：2008-04-10

申请人： Vadim Gektin ,  David W. Copeland

发明人： Vadim Gektin ,  David W. Copeland

IPC分类号： H01L23/488

CPC分类号： H05K3/325 ,  B82Y10/00 ,  H01L24/13 ,  H01L24/14 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/0401 ,  H01L2224/06515 ,  H01L2224/10135 ,  H01L2224/13193 ,  H01L2224/1403 ,  H01L2224/14051 ,  H01L2224/14505 ,  H01L2224/14515 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/32225 ,  H01L2224/731 ,  H01L2224/73103 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81139 ,  H01L2224/81815 ,  H01L2224/81906 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/014 ,  H05K3/3436 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2201/10659 ,  H05K2201/10719 ,  H05K2201/2036 ,  H01L2924/00 ,  H01L2924/00012

摘要： A composite interconnect system includes a plurality of carbon nanotubes, a plurality of solder balls and standoff balls disposed on a first device to provide a connection to a second device. A die-attached substrate includes a substrate and one or more die disposed on the substrate by a die-attach composite interconnect. The die-attach composite interconnect includes a plurality of carbon nanotubes, solder bumps, and standoff balls disposed on the die to provide one or more connections to the substrate. A PCB-attached substrate package includes a substrate package and one or more die disposed on the substrate package. The substrate package is disposed on a PCB by a PCB-attach composite interconnect. The PCB-attach composite interconnect includes a plurality of carbon nanotubes, solder balls, and standoff balls disposed on the substrate package to provide one or more connections to the PCB.

摘要翻译： 复合互连系统包括多个碳纳米管，多个焊球和支撑球，其设置在第一装置上以提供到第二装置的连接。 芯片连接的基板包括基板和通过管芯附着复合互连件设置在基板上的一个或多个管芯。 管芯附着复合互连件包括多个碳纳米管，焊料凸块和设置在管芯上的间隙球，以提供与衬底的一个或多个连接。 附着有PCB的衬底封装包括衬底封装和设置在衬底封装上的一个或多个管芯。 衬底封装通过PCB连接复合互连布置在PCB上。 PCB附着复合互连件包括多个碳纳米管，焊球和设置在衬底封装上的间隙球，以提供与PCB的一个或多个连接。

公开(公告)号：US06836408B2

公开(公告)日：2004-12-28

申请号：US10247503

申请日：2002-09-19

申请人： Vadim Gektin ,  James A. Jones

发明人： Vadim Gektin ,  James A. Jones

IPC分类号： H05H720

CPC分类号： H01L23/433 ,  H01L23/3121 ,  H01L23/4006 ,  H01L2224/32

摘要： The present application describes a method and an apparatus for facilitating increased uniformity and diffusion of force transfer on a bare die electronic package for example, when such electronic package is attached to a circuit board. Additional force absorbent material is applied around a bare die in the bare die electronic package. The force applied to the bare die electronic package can be distributed to the additional force absorbent material. A curable force absorbent material is dispensed around the bare die in the bare die electronic package. The surface of the curable material is substantially parallel with the surface of bare die thus facilitating a substantially uniform force distribution through the bare die and curable material resulting in a robust bare die electronic package.

摘要翻译： 本申请描述了一种方法和装置，用于例如当这种电子封装附接到电路板时，便于在裸片电子封装上增加力传递的均匀性和扩散。 在裸模电子封装中的裸裸裸片周围施加附加力吸收材料。 施加到裸模电子封装的力可以分配到附加的力吸收材料。 在裸模电子封装中的裸芯片周围分配可固化力吸收材料。 可固化材料的表面基本上平行于裸露模具的表面，从而有助于通过裸模和可固化材料的基本均匀的力分布，从而形成牢固的裸模电子封装。

公开(公告)号：US20140055951A1

公开(公告)日：2014-02-27

申请号：US13595777

申请日：2012-08-27

申请人： Youlin Jin ,  Jiye Xu ,  Vadim Gektin

发明人： Youlin Jin ,  Jiye Xu ,  Vadim Gektin

IPC分类号： H05K7/20

CPC分类号： H05K7/20563

摘要： A chassis including a slot configured to receive a printed circuit board having a baffle position pin and electronic components mounted thereon, a guide mechanism mounted within the slot, and a carriage moveably mounted within the slot and biased toward a slot opening by the guide mechanism, the carriage including a baffle suitable to manipulate a flow of air through the slot, the carriage configured to be driven away from the slot opening and to be oriented relative to the electronic components on the printed circuit board by the baffle position pin when the printed circuit board is loaded into the slot such that the baffle directs the flow of air over the electronic components.

摘要翻译： 一种底架，其包括：槽，其构造成接收具有挡板位置销和安装在其上的电子部件的印刷电路板;安装在所述槽内的引导机构，以及可移动地安装在所述槽内且由所述引导机构朝向狭槽开口偏压的滑架， 所述托架包括适于操纵通过所述槽的空气流的挡板，所述托架被构造成当所述印刷电路被驱动时被所述挡板位置销从所述槽开口驱动并相对于所述印刷电路板上的所述电子部件定向 板被加载到槽中，使得挡板将空气流引导到电子部件上。

公开(公告)号：US06653167B2

公开(公告)日：2003-11-25

申请号：US09950204

申请日：2001-09-10

申请人： Vadim Gektin

发明人： Vadim Gektin

IPC分类号： H01L2150

CPC分类号： H01L21/4882 ,  H01L23/367 ,  H01L23/433 ,  H01L2924/0002 ,  H01L2924/00

摘要： In accordance with the present invention, a method is described which facilitates heat transfer from a silicon die after the silicon die is bonded to a substrate. The thermal conductor is placed on the silicon layer after the silicon layer has been bonded to the substrate layer. A spacer is used between the substrate and the thermal conductor. The spacer can facilitate heat transfer from the die. The spacer facilitates force transfer from the thermal conductor to the die. In an embodiment, the thermal conductor can be removed and a second thermal conductor used to further facilitate heat transfer. In an enablement, a heat sink and heat sink interface are provided and further facilitate heat transfer from the package. The specification also teaches an integrated circuit package manufactured by the method taught. The specification also teaches a computer system including an integrated circuit package manufactured by the method taught.

公开(公告)号：US20100243298A1

公开(公告)日：2010-09-30

申请号：US12414122

申请日：2009-03-30

申请人： Vadim Gektin ,  David W. Copeland

发明人： Vadim Gektin ,  David W. Copeland

IPC分类号： H05K1/14 ,  H01B5/00

CPC分类号： H05K3/325 ,  B82Y10/00 ,  H01R12/7082 ,  H05K2201/026 ,  H05K2201/10378

摘要： In at least one embodiment, an interposer for a board interconnect system is provided. The interposer comprises a frame and at least one interconnect. The frame receives a substrate. The substrate includes a top side, a bottom side, and a conductive interface. The conductive interface extends through the top side and the bottom side for delivering an electrical signal from an electrical device positioned on the top side therethrough. The at least one interconnect includes a plurality of carbon nanotubes (CNTs) positioned within the frame for contacting the conductive interface of the substrate to deliver the electrical signal to a conductive arrangement of a circuit board.

摘要翻译： 在至少一个实施例中，提供了用于板互连系统的插入器。 插入器包括框架和至少一个互连件。 框架接收基板。 基板包括顶侧，底侧和导电界面。 导电接口延伸穿过顶侧和底侧，用于从位于顶侧的电气装置传送电信号。 所述至少一个互连件包括位于所述框架内的多个碳纳米管（CNT），用于接触所述基板的所述导电接口以将所述电信号传送到电路板的导电布置。

公开(公告)号：US07619308B1

公开(公告)日：2009-11-17

申请号：US12114376

申请日：2008-05-02

申请人： Vadim Gektin ,  David W. Copeland

发明人： Vadim Gektin ,  David W. Copeland

IPC分类号： H01L23/12

CPC分类号： H01L23/3675 ,  H01L23/04 ,  H01L23/467 ,  H01L23/562 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2225/06517 ,  H01L2924/15311 ,  H01L2924/16151

摘要： A multi-lid semiconductor package includes one or more die disposed on a substrate, an interconnect disposed on the substrate, one or more die lids, a die thermal interface between the one or more die and the corresponding die lid or lids, one or more substrate lids, and a substrate interface between the substrate and the corresponding substrate lid or lids. The multi-lid semiconductor package may include one or more discrete surface mount components disposed on the substrate. The multi-lid semiconductor package may include a sealant between the one or more die lids and the one or more substrate lids and the substrate. The one or more die lids and the one or more substrate lids may differ in construction, design, placement, and/or thermal performance.

摘要翻译： 多盖半导体封装包括设置在基板上的一个或多个管芯，设置在基板上的互连件，一个或多个管芯盖，一个或多个管芯与相应的管芯盖或盖之间的管芯热接口，一个或多个 衬底盖，以及衬底和相应衬底盖或盖之间的衬底界面。 多盖半导体封装可以包括设置在基板上的一个或多个离散的表面安装部件。 多盖半导体封装可以包括在一个或多个模盖和一个或多个基板盖和基板之间的密封剂。 一个或多个模盖和一个或多个基底盖可以在结构，设计，放置和/或热性能上不同。

公开(公告)号：US07187550B1

公开(公告)日：2007-03-06

申请号：US11225986

申请日：2005-09-14

申请人： Ali Heydari ,  Vadim Gektin

发明人： Ali Heydari ,  Vadim Gektin

IPC分类号： H05K7/20

CPC分类号： H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

摘要： A field-replaceable active pumped liquid heat sink module includes a liquid pump, a radiator, an optional receiver, and a gasketed cold heat exchanger box, all of which are connected together in a liquid pump loop through which a coolant such as water is circulated. The liquid pump, radiator, optional receiver and gasketed cold heat exchanger box are in a liquid pump loop and are self-contained in a field-replaceable active pumped liquid heat sink module. The heat sink module provides direct contact between the liquid coolant and the top portion of the targeted electronic component, which can be a CPU.

摘要翻译： 现场可更换的主动泵送液体散热器模块包括液体泵，散热器，可选的接收器和垫圈冷热交换器箱，所有这些都在液体泵回路中连接在一起，诸如水的冷却剂通过该循环 。 液体泵，散热器，可选接收器和垫圈式冷热交换器箱位于液体泵回路中，并且可以在现场可更换的有源泵送液体散热器模块中独立运行。 散热器模块提供液体冷却剂和可以是CPU的目标电子部件的顶部部分之间的直接接触。

公开(公告)号：US06945315B1

公开(公告)日：2005-09-20

申请号：US09703282

申请日：2000-10-31

申请人： Vadim Gektin ,  Shlomo Novotny ,  Marlin R. Vogel

发明人： Vadim Gektin ,  Shlomo Novotny ,  Marlin R. Vogel

IPC分类号： F28D15/00 ,  F28F3/04 ,  F28F7/00 ,  F28F27/02 ,  H01L23/467 ,  H01L23/473

CPC分类号： F28F9/0265 ,  F28D15/00 ,  F28F3/04 ,  H01L23/467 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

摘要： A device for the transfer of heat away from a heat source comprising a base having first and second surfaces a plurality of fins extending adjacent to the second surface of the base. The base further including a chamber disposed between the first surface and the second surface of the base. The chamber further including a divider disposed therein adjacent the first surface. A pump is also disposed within the chamber to circulate fluid within the chamber.

摘要翻译： 一种用于从热源传送热量的装置，包括具有第一和第二表面的基部，多个翅片相邻于基座的第二表面延伸。 基座还包括设置在基座的第一表面和第二表面之间的腔室。 所述腔室还包括邻近所述第一表面设置在其中的分隔件。 泵还设置在腔室内以使腔室内的流体循环。