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    Folded lead-frame packages for MEMS devices
    11.
    发明授权
    Folded lead-frame packages for MEMS devices 有权
    用于MEMS器件的折叠引线框封装

    公开(公告)号：US08013404B2

    公开(公告)日：2011-09-06

    申请号：US12287466

    申请日：2008-10-09

    Applicant: Wang Zhe ,  Chong Ser Choong

    Inventor： Wang Zhe ,  Chong Ser Choong

    IPC: H01L29/82

    CPC classification number: B81B7/007 ,  B81B2207/097 ,  H01L2224/48091 ,  H01L2924/1461 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: The MEMS package comprises a first and a second pre-molded lead-frame substrate, at least one of them having a cavity formed by plastic sidewalls along its periphery. The first and second pre-molded lead-frame substrates are interconnected with metal leads. At least one MEMS device is attached to one of the substrates. The first pre-molded lead-frame substrate is folded over and joined to the second pre-molded lead-frame substrate to house the at least one MEMS device. In one embodiment, the first pre-molded lead-frame substrate has metal leads extending outside of sidewalls of the cavities. The extended metal leads are folded over the top of the second pre-molded lead-frame substrate to form surface mounting pads. In some embodiments, extended metal leads are folded along the sidewalls and connected to ground for electromagnetic interference (EMI) shielding.

    Abstract translation: MEMS封装包括第一和第二预成型引线框架基板，其中至少一个具有由其周边的塑料侧壁形成的空腔。 第一和第二预成型引线框架基板与金属引线相互连接。 至少一个MEMS器件附接到其中一个衬底。 第一预成型引线框架基板被折叠并连接到第二预成型引线框架基板以容纳至少一个MEMS器件。 在一个实施例中，第一预成型引线框架基板具有延伸到空腔侧壁外侧的金属引线。 延伸的金属引线折叠在第二预成型引线框架基板的顶部上以形成表面安装垫。 在一些实施例中，延伸的金属引线沿着侧壁折叠并连接到地面用于电磁干扰（EMI）屏蔽。

    MEMS microphone with a stacked PCB package and method of producing the same
    15.
    发明授权
    MEMS microphone with a stacked PCB package and method of producing the same 有权
    具有堆叠PCB封装的MEMS麦克风及其制造方法

    公开(公告)号：US07436054B2

    公开(公告)日：2008-10-14

    申请号：US11368172

    申请日：2006-03-03

    Applicant: Wang Zhe

    Inventor： Wang Zhe

    IPC: H01L23/02

    CPC classification number: B81C1/0023 ,  B81B2201/0257 ,  H01L24/83 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/14 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: A MEMS microphone with a stacked PCB package is described. The MEMS package has at least one MEMS acoustic sensor device located on a PCB stack. A metal cap structure surrounds the at least one MEMS acoustic sensor device wherein an edge surface of the metal cap structure is attached and electrically connected to the PCB stack. In a first embodiment, a back chamber is formed underlying the at least one MEMS acoustic sensor device and within the PCB stack wherein an opening underlying the at least one MEMS acoustic sensor device accesses the back chamber. An opening in the metal cap structure not aligned with the at least one MEMS acoustic sensor device allows external fluid, acoustic energy or pressure to enter the at least one MEMS acoustic sensor device. In a second embodiment, a back chamber is formed in the space under the metal cap and over the first PCB. A hollow chamber is formed between the first PCB and the second PCB wherein an opening under the at least one MEMS acoustic sensor device accesses the hollow chamber. An opening in a bottom surface of the PCB stack not aligned with the at least one MEMS acoustic sensor device also accesses the hollow chamber and allows external fluid, acoustic energy or pressure to enter the at least one MEMS acoustic sensor device.

    Abstract translation: 描述了具有堆叠PCB封装的MEMS麦克风。 MEMS封装具有位于PCB堆叠上的至少一个MEMS声学传感器装置。 金属盖结构围绕至少一个MEMS声学传感器装置，其中金属盖结构的边缘表面被附接并电连接到PCB堆叠。 在第一实施例中，后室形成在至少一个MEMS声学传感器装置的下方，并且在PCB堆叠内，其中至少一个MEMS声学传感器装置下方的开口进入后室。 不与至少一个MEMS声学传感器装置对准的金属盖结构中的开口允许外部流体，声能或压力进入至少一个MEMS声学传感器装置。 在第二实施例中，在金属盖下方的空间和第一PCB上形成后室。 在第一PCB和第二PCB之间形成中空室，其中至少一个MEMS声学传感器装置下方的开口进入中空室。 PCB堆叠底部未与至少一个MEMS声学传感器装置对准的底表面中的开口还访问中空室并允许外部流体，声能或压力进入至少一个MEMS声学传感器装置。

    Silicon microphone with softly constrained diaphragm
    16.
    发明申请
    Silicon microphone with softly constrained diaphragm 有权
    硅麦克风具有柔软约束的隔膜

    公开(公告)号：US20060093171A1

    公开(公告)日：2006-05-04

    申请号：US10977693

    申请日：2004-10-29

    Applicant: Wang Zhe ,  Miao Yubo

    Inventor： Wang Zhe ,  Miao Yubo

    IPC: H04R1/00 ,  H04R9/06

    CPC classification number: H04R31/003 ,  H04R7/10 ,  H04R19/005 ,  H04R19/04 ,  H04R25/00

    Abstract: A microphone sensing element and a method for making the same are disclosed. The sensing element has a diaphragm and an attached electrical lead-out arm preferably made of polysilicon that are separated by an air gap from an underlying backplate region created on a conductive silicon substrate. The backplate region has acoustic holes created by removing an oxide filling in a continuous trench that surrounds hole edges and by removing oxide to form the air gap. The diaphragm is softly constrained along its edge by an elastic element that connects to a surrounding rigid polysilicon layer. The elastic element is typically a polymer such as parylene having a Young's modulus substantially less than that of the diaphragm. First and second electrodes are connected to the diaphragm through the lead-out arm and to the substrate through polysilicon via fillings, respectively, and thereby establish a variable capacitor circuit for acoustic sensing.

    Abstract translation: 公开了麦克风传感元件及其制造方法。 感测元件具有隔膜和优选由多晶硅制成的附接电引出臂，其由与在导电硅衬底上形成的下面的背板区域的气隙分开。 背板区域具有通过去除填充在围绕孔边缘的连续沟槽中的氧化物并通过去除氧化物以形成气隙而产生的声孔。 隔膜通过连接到周围的刚性多晶硅层的弹性元件沿其边缘被轻柔地约束。 弹性元件通常是聚合物，例如聚对二甲苯，其杨氏模量显着小于隔膜的杨氏模量。 第一和第二电极分别通过引出臂通过多晶硅通过引出臂连接到膜片，从而建立用于声学感测的可变电容器电路。

    Silicon microphone with enhanced impact proof structure using bonding wires
    17.
    发明授权
    Silicon microphone with enhanced impact proof structure using bonding wires 有权
    硅胶麦克风具有增强的防撞结构，采用接合线

    公开(公告)号：US08045733B2

    公开(公告)日：2011-10-25

    申请号：US11973075

    申请日：2007-10-05

    Applicant: Wang Zhe ,  Chong Ser Choong

    Inventor： Wang Zhe ,  Chong Ser Choong

    IPC: H04R25/00 ,  H04R19/00 ,  H01L21/00

    CPC classification number: H04R19/04

    Abstract: A backplateless silicon microphone and a wire protection method for improved impact resistance are disclosed. A circular diaphragm is surrounded by a circular spring having a plurality of slots and perforations to facilitate air damping reduction, release of in-plane stress, and improve out-plane flexibility. Anchored at a substrate, the circular spring holds the silicon microphone suspended over a backside hole in the substrate but allows the diaphragm to vibrate perpendicular to the substrate. A microphone variable capacitor is formed between the perforated spring and substrate. Slot size is minimized to prevent particles from entering an underlying air gap. A plurality of “n” bonding pads near the outer edge of the circular spring are connected by “n/2” bonding wires that serve as a stopper to restrict an upward motion of the diaphragm. The bonding wires may cross each other to enable lower loop height for more effective resistance to impact.

    Abstract translation: 公开了一种无刷硅传声器和用于提高耐冲击性的线保护方法。 圆形隔膜由具有多个槽和穿孔的圆形弹簧围绕，以便于减少空气阻尼，释放面内应力，并提高平面外的柔性。 固定在基板上的圆形弹簧将硅麦克风保持悬挂在基板的背面孔上，但允许隔膜垂直于基板振动。 在多孔弹簧和基板之间形成麦克风可变电容器。 槽口尺寸被最小化以防止颗粒进入下面的气隙。 在圆形弹簧的外边缘附近的多个“n”键合焊盘通过用作止动器的“n / 2”接合线连接，以限制隔膜的向上运动。 接合线可以彼此交叉以实现较低的回路高度，以更有效地抵抗冲击。

    MEMS G-switch device
    18.
    发明授权
    MEMS G-switch device 有权
    MEMS G开关器件

    公开(公告)号：US07999201B2

    公开(公告)日：2011-08-16

    申请号：US12291106

    申请日：2008-11-06

    Applicant: Wang Zhe ,  Xin Ping Cao

    Inventor： Wang Zhe ,  Xin Ping Cao

    IPC: H01H35/14

    CPC classification number: H01H1/0036 ,  G01P15/08 ,  G01P15/135 ,  H01H35/14

    Abstract: A Micro Electro Mechanical Systems (MEMS) G-switch includes one or more actuators formed between fixed driving stages and moveable driving stages. A proof mass is attached to the moveable driving stages and flexibly attached to a substrate through one or more spring members. A voltage control circuit applies working voltages to the driving stages. With a first working voltage applied between the moveable and the fixed driving stages, moving of the driving stages' sensing direction towards gravity at a first critical angle will cause moveable driving stages to collapse and touch the fixed driving stage on the substrate and thus turn on the MEMS G-switch. After turning on the G-switch, a second working voltage is applied and moving of the driving stages' sensing direction away from gravity at a second critical angle will cause moveable electrodes to deviate from the fixed electrodes and thus turn off the MEMS G-switch.

    Abstract translation: 微机电系统（MEMS）G开关包括在固定驱动级和可移动驱动级之间形成的一个或多个致动器。 检测质量被附着到可移动的驱动级上，并通过一个或多个弹簧构件灵活地附接到基底。 电压控制电路向驱动级施加工作电压。 通过施加在可移动和固定驱动级之间的第一工作电压，驱动级的感测方向朝向重力以第一临界角的移动将导致可移动的驱动级塌陷并且接触基板上的固定驱动级，并因此接通 MEMS G开关。 在接通G开关之后，施加第二工作电压，驱动级感测方向与第二临界角处的重力移动将导致可移动电极偏离固定电极，从而关闭MEMS G开关 。

    MEMS G-switch device
    19.
    发明申请
    MEMS G-switch device 有权
    MEMS G开关器件

    公开(公告)号：US20100108478A1

    公开(公告)日：2010-05-06

    申请号：US12291106

    申请日：2008-11-06

    Applicant: Wang Zhe ,  Xin Ping Cao

    Inventor： Wang Zhe ,  Xin Ping Cao

    IPC: H01H35/14

    CPC classification number: H01H1/0036 ,  G01P15/08 ,  G01P15/135 ,  H01H35/14

    Abstract: A Micro Electro Mechanical Systems (MEMS) G-switch includes one or more actuators formed between fixed driving stages and moveable driving stages. A proof mass is attached to the moveable driving stages and flexibly attached to a substrate through one or more spring members. A voltage control circuit applies working voltages to the driving stages. With a first working voltage applied between the moveable and the fixed driving stages, moving of the driving stages' sensing direction towards gravity at a first critical angle will cause moveable driving stages to collapse and touch the fixed driving stage on the substrate and thus turn on the MEMS G-switch. After turning on the G-switch, a second working voltage is applied and moving of the driving stages' sensing direction away from gravity at a second critical angle will cause moveable electrodes to deviate from the fixed electrodes and thus turn off the MEMS G-switch.

    Abstract translation: 微机电系统（MEMS）G开关包括在固定驱动级和可移动驱动级之间形成的一个或多个致动器。 检测质量被附着到可移动的驱动级上，并通过一个或多个弹簧构件灵活地附接到基底。 电压控制电路向驱动级施加工作电压。 通过施加在可移动和固定驱动级之间的第一工作电压，驱动级的感测方向朝向重力以第一临界角的移动将导致可移动的驱动级塌陷并且接触基板上的固定驱动级，并因此接通 MEMS G开关。 在接通G开关之后，施加第二工作电压，驱动级感测方向与第二临界角处的重力移动将导致可移动电极偏离固定电极，从而关闭MEMS G开关 。

    Backplateless silicon microphone
    20.
    发明申请
    Backplateless silicon microphone 有权
    无背板硅麦克风

    公开(公告)号：US20080123878A1

    公开(公告)日：2008-05-29

    申请号：US12011519

    申请日：2008-01-28

    Applicant: Wang Zhe ,  Miao Yubo

    Inventor： Wang Zhe ,  Miao Yubo

    IPC: H04R17/02

    CPC classification number: H04R31/003 ,  H04R19/005 ,  H04R19/04 ,  H04R25/00

    Abstract: A silicon based microphone sensing element and a method for making the same are disclosed. The microphone sensing element has a diaphragm with adjoining perforated plates on the front side of a conductive substrate. The diaphragm is aligned above a back hole in the substrate wherein the front opening of the back hole is smaller than the diaphragm. The diaphragm is supported by mechanical springs each having one end attached to the diaphragm and another end connected to a rigid pad anchored on a dielectric spacer. The diaphragm, perforated plates, and mechanical springs are preferably made of the same film and are suspended above an air gap that overlies the substrate. A first electrode is formed on one or more rigid pads and a second electrode is formed at one or more locations on the substrate to establish a variable capacitor circuit. Different embodiments are shown that reduce parasitic capacitance.

    Abstract translation: 公开了一种基于硅的麦克风传感元件及其制造方法。 麦克风感测元件具有在导电基板的正面上具有相邻多孔板的隔膜。 隔膜在衬底中的后孔上方对准，其中后孔的前开口小于隔膜。 隔膜由机械弹簧支撑，每个机械弹簧的一端连接到隔膜，另一端连接到锚定在介电隔离件上的刚性垫。 隔膜，多孔板和机械弹簧优选由相同的膜制成并且悬挂在覆盖在基底上的气隙之上。 第一电极形成在一个或多个刚性焊盘上，并且第二电极形成在衬底上的一个或多个位置处以建立可变电容器电路。 示出了减少寄生电容的不同实施例。

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