-
11.发明授权公开(公告)号：US06776891B2
公开(公告)日：2004-08-17
申请号：US09859363
申请日：2001-05-18
申请人： Chaopeng Chen , Kevin Lin , Jei Wei Chang
发明人： Chaopeng Chen , Kevin Lin , Jei Wei Chang
IPC分类号： C25D356
CPC分类号： C25D5/18 , C25D3/562 , C25D5/006 , C25D7/001 , G11B5/3109 , G11B5/3163 , H01F10/16 , H01F41/26 , Y10T428/115 , Y10T428/12493
摘要： A method for forming a plated magnetic thin film of high saturation magnetization and low coercivity having the general form Co100−a−bFeaMb, where M can be Mo, Cr, W, Ni or Rh, which is suitable for use in magnetic recording heads that write on narrow trackwidth, high coercivity media. The plating method includes four current application processes: direct current, pulsed current, pulse reversed current and conditioned pulse reversed current.
摘要翻译： 一种用于形成具有一般形式Co100-a-bFeaMb的高饱和磁化强度和低矫顽力的镀覆磁性薄膜的方法，其中M可以是Mo，Cr，W，Ni或Rh，其适用于磁记录头， 写在狭窄的轨道宽度，高矫顽力的媒体。 电镀方法包括四个当前应用过程：直流，脉冲电流，脉冲反向电流和调节脉冲反向电流。
-
公开(公告)号：US06749334B2
公开(公告)日：2004-06-15
申请号：US10215002
申请日：2002-08-09
申请人： Kevin Lin
发明人： Kevin Lin
IPC分类号： G01J504
CPC分类号： G01J5/04 , G01J5/049 , G01J5/06 , G01J5/08 , G01J5/0818
摘要： An ear thermometer probe structure comprises a shell body. A hollow thermal absorption component is disposed in the shell body, and contacts several positioning points one the inner wall of the shell body. An air gap is formed at the part of the thermal absorption component not contacting the shell body. A wave guide is disposed in the thermal absorption component. The rear section of the wave guide tightly contacts the thermal absorption component, and the front section thereof is separated from the shell body by an air gap. A filter is disposed at the front end of the wave guide to let infrared rays be transmitted. An annular sealing pad is located between the filter and the top of the shell body. A sensor is disposed behind the wave guide and fixed on the thermal absorption component. The sensor is separated from the thermal absorption component and the wave guide by an annular air room.
摘要翻译： 耳温度计探针结构包括壳体。 中空热吸收部件设置在壳体中，并且与壳体的内壁一个接触多个定位点。 在不接触壳体的热吸收部件的部分形成气隙。 波导装置设置在热吸收部件中。 波导的后部与热吸收部件紧密接触，其前部通过气隙与壳体分离。 滤波器设置在波导的前端，以便传输红外线。 环形密封垫位于过滤器和壳体顶部之间。 传感器设置在波导的后面并固定在吸热部件上。 传感器由环形空气室与热吸收部件和波导分开。
-
公开(公告)号：US6150263A
公开(公告)日：2000-11-21
申请号：US188920
申请日：1998-11-09
申请人： Kevin Lin , Ching-Chiao Hao , Kun-Chi Lin
发明人： Kevin Lin , Ching-Chiao Hao , Kun-Chi Lin
IPC分类号： H01L21/768 , H01L21/44
CPC分类号： H01L21/76885
摘要： A method of forming small dimension wires by an isotropic removal process. The method provides a substrate with an insulation layer. A first conductive layer and a second conductive layer are formed on the insulation layer. A wire pattern is formed on a photoresist layer after the coating process and the sequential exposure and development process. Part of the second conductive layer is removed by using the wire pattern on the photoresist layer as a mask, and thus part of the second conductive layer with wires is remained. Isotropic etching the peripheral part of the second conductive layer and thus the part of wire pattern with a smaller dimension is remained. Using the wire pattern with a smaller dimension as a mask to anisotropic etch the first conductive layer until the surface of the insulation layer is exposed, and thus the process of fabricating small dimension is finished.
摘要翻译： 通过各向同性去除方法形成小尺寸线的方法。 该方法提供具有绝缘层的基板。 第一导电层和第二导电层形成在绝缘层上。 在涂布工艺和顺序曝光和显影处理之后，在光致抗蚀剂层上形成线图案。 通过使用光致抗蚀剂层上的线图案作为掩模来去除部分第二导电层，因此残留了具有导线的第二导电层的一部分。 残留了各向同性蚀刻第二导电层的周边部分，因此保留了具有较小尺寸的线图案的部分。 使用较小尺寸的导线图案作为掩模以对第一导电层进行各向异性蚀刻，直到绝缘层的表面露出，从而完成制造小尺寸的工艺。
-
-
公开(公告)号：US20160329438A1
公开(公告)日：2016-11-10
申请号：US15151381
申请日：2016-05-10
申请人： Chytra Pawashe , Kevin Lin , Anurag Chaudhry , Raseong Kim , Seiyon Kim , Kelin Kuhn , Sasikanth Manipatruni , Rafael Rios , Ian A. Young
发明人： Chytra Pawashe , Kevin Lin , Anurag Chaudhry , Raseong Kim , Seiyon Kim , Kelin Kuhn , Sasikanth Manipatruni , Rafael Rios , Ian A. Young
IPC分类号： H01L29/84 , H01H59/00 , H01L29/161 , H01L29/06 , H01L29/04
CPC分类号： H01L29/84 , B82Y10/00 , H01H1/0094 , H01H9/0271 , H01H59/0009 , H01L29/045 , H01L29/0673 , H01L29/161
摘要： Nanowire-based mechanical switching devices are described. For example, a nanowire relay includes a nanowire disposed in a void disposed above a substrate. The nanowire has an anchored portion and a suspended portion. A first gate electrode is disposed adjacent the void, and is spaced apart from the nanowire. A first conductive region is disposed adjacent the first gate electrode and adjacent the void, and is spaced apart from the nanowire.
摘要翻译： 描述了基于纳米线的机械开关装置。 例如，纳米线继电器包括布置在衬底上方的空隙中的纳米线。 纳米线具有锚固部分和悬挂部分。 第一栅电极邻近空隙设置，并与纳米线隔开。 第一导电区域邻近第一栅电极设置并邻近空隙，并与纳米线隔开。
-
16.发明申请公开(公告)号：US20160104642A1
公开(公告)日：2016-04-14
申请号：US14965734
申请日：2015-12-10
IPC分类号： H01L21/768
CPC分类号： H01L21/76897 , H01L21/0274 , H01L21/31111 , H01L21/31144 , H01L21/76802 , H01L21/76808 , H01L21/76816 , H01L21/76825 , H01L23/522 , H01L23/5226 , H01L23/5329 , H01L2924/0002 , H01L2924/00
摘要： Self-aligned via and plug patterning with photobuckets for back end of line (BEOL) interconnects is described. In an example, an interconnect structure for an integrated circuit includes a first layer of the interconnect structure disposed above a substrate, the first layer having a first grating of alternating metal lines and dielectric lines in a first direction. The dielectric lines have an uppermost surface higher than an uppermost surface of the metal lines. The integrated circuit also includes a second layer of the interconnect structure disposed above the first layer of the interconnect structure. The second layer includes a second grating of alternating metal lines and dielectric lines in a second direction, perpendicular to the first direction. The dielectric lines have a lowermost surface lower than a lowermost surface of the metal lines of the second grating. The dielectric lines of the second grating overlap and contact, but are distinct from, the dielectric lines of the first grating. The integrated circuit also includes a region of dielectric material disposed between the metal lines of the first grating and the metal lines of the second grating, and in a same plane as upper portions of the dielectric lines of the first grating and lower portions of the dielectric lines of the second grating. The region of dielectric material is composed of a cross-linked photolyzable material.
-
公开(公告)号：US08610986B2
公开(公告)日：2013-12-17
申请号：US12419210
申请日：2009-04-06
申请人： Kanti Jain , Junghun Chae , Kevin Lin , Hyunjong Jin
发明人： Kanti Jain , Junghun Chae , Kevin Lin , Hyunjong Jin
CPC分类号： G02B26/0833 , G02B5/0833 , G02B5/0858 , G03F7/70291
摘要： Micromirrors and micromirror arrays described herein are useful, for example in maskless photolithography systems and methods and projection display devices and methods. According to one aspect, the micromirrors comprise a polymer structural layer and a reflective dielectric multilayer for selective reflection and/or redirection of incoming electromagnetic radiation. According to another aspect, incorporation of a reflective dielectric multilayer allows for use of polymer structural materials in micromirrors and prevents damage to such polymer materials due to excessive heating from absorption of electromagnetic radiation, as the reflective dielectric multilayers are highly reflective and minimize heating of the micromirror components. According to yet a further aspect, top down fabrication methods are described herein for making a micromirror comprising a polymer structural layer and a reflective dielectric multilayer.
摘要翻译： 本文所述的微镜和微镜阵列是有用的，例如在无掩模光刻系统和方法以及投影显示装置和方法中。 根据一个方面，微镜包括用于选择性反射和/或重定向输入电磁辐射的聚合物结构层和反射电介质多层。 根据另一方面，引入反射电介质多层允许在微反射镜中使用聚合物结构材料，并且防止由于电磁辐射的吸收导致的过度加热而损坏这种聚合物材料，因为反射电介质多层是高度反射性的并且最小化 微镜组件。 根据又一方面，本文描述了自顶向下的制造方法，用于制造包括聚合物结构层和反射电介质多层的微镜。
-
18.发明申请MIRROR ARRAYS FOR MASKLESS PHOTOLITHOGRAPHY AND IMAGE DISPLAY 有权MIRROR ARRAYS FOR MASKLESS PHOTOLITHOGRAPHY和IMAGE DISPLAY公开(公告)号：US20100255426A1
公开(公告)日：2010-10-07
申请号：US12419210
申请日：2009-04-06
申请人： Kanti JAIN , Junghun Chae , Kevin Lin , Hyunjong Jin
发明人： Kanti JAIN , Junghun Chae , Kevin Lin , Hyunjong Jin
CPC分类号： G02B26/0833 , G02B5/0833 , G02B5/0858 , G03F7/70291
摘要： Micromirrors and micromirror arrays described herein are useful, for example in maskless photolithography systems and methods and projection display devices and methods. According to one aspect, the micromirrors comprise a polymer structural layer and a reflective dielectric multilayer for selective reflection and/or redirection of incoming electromagnetic radiation. According to another aspect, incorporation of a reflective dielectric multilayer allows for use of polymer structural materials in micromirrors and prevents damage to such polymer materials due to excessive heating from absorption of electromagnetic radiation, as the reflective dielectric multilayers are highly reflective and minimize heating of the micromirror components. According to yet a further aspect, top down fabrication methods are described herein for making a micromirror comprising a polymer structural layer and a reflective dielectric multilayer.
摘要翻译： 本文所述的微镜和微镜阵列是有用的，例如在无掩模光刻系统和方法以及投影显示装置和方法中。 根据一个方面，微镜包括用于选择性反射和/或重定向输入电磁辐射的聚合物结构层和反射电介质多层。 根据另一方面，引入反射电介质多层允许在微反射镜中使用聚合物结构材料，并且防止由于电磁辐射的吸收导致的过度加热而损坏这种聚合物材料，因为反射电介质多层是高度反射性的并且使得 微镜组件。 根据又一方面，本文描述了自顶向下的制造方法，用于制造包括聚合物结构层和反射电介质多层的微镜。
-
公开(公告)号：US20100143848A1
公开(公告)日：2010-06-10
申请号：US12331131
申请日：2008-12-09
申请人： Kanti Jain , Kevin Lin
发明人： Kanti Jain , Kevin Lin
IPC分类号： G03F7/20
CPC分类号： H05K1/0283 , B23K26/40 , B23K2103/172 , B81B2201/0292 , B81B2203/0109 , B81B2207/07 , B81C1/0019 , H05K3/0032 , H05K3/007 , H05K2201/09109 , H05K2203/0554 , H05K2203/308
摘要： Described herein are processing techniques for fabrication of stretchable and/or flexible electronic devices using laser ablation patterning methods. The laser ablation patterning methods utilized herein allow for efficient manufacture of large area (e.g., up to 1 mm2 or greater or 1 m2 or greater) stretchable and/or flexible electronic devices, for example manufacturing methods permitting a reduced number of steps. The techniques described herein further provide for improved heterogeneous integration of components within an electronic device, for example components having improved alignment and/or relative positioning within an electronic device. Also described herein are flexible and/or stretchable electronic devices, such as interconnects, sensors and actuators.
摘要翻译： 这里描述了使用激光烧蚀图案化方法制造可拉伸和/或柔性电子器件的处理技术。 本文使用的激光烧蚀图案化方法允许有效地制造大面积（例如，高达1mm 2或更大或1m 2或更大）的可拉伸和/或柔性电子器件，例如允许减少步数的制造方法。 本文描述的技术进一步提供了改进的电子设备内的组件的异构集成，例如具有电子设备内的改进的对准和/或相对定位的组件。 本文还描述了柔性和/或可拉伸的电子设备，例如互连，传感器和致动器。
-
-
-
-
-
-
-
-
-
搜索结果
87 条记录 (耗时 0.029 秒)
